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    FLOW SENSING DEVICE
    2.
    发明公开
    FLOW SENSING DEVICE 审中-实审

    公开(公告)号：EP4354094A3

    公开(公告)日：2024-07-03

    申请号：EP24152551.8

    申请日：2021-06-02

    申请人： HONEYWELL INTERNATIONAL INC.

    发明人： BECK, Scott Edward ,  FOSTER, Philip C. ,  WANG, Yong-Fa

    IPC分类号： G01F1/684 ,  G01F1/688 ,  G01F1/69 ,  G01F1/692

    CPC分类号： G01F1/6845 ,  G01F1/6847 ,  G01F1/6888 ,  G01F1/69 ,  G01F1/692

    摘要： Methods and apparatuses associated with an example flow sensing device are provided. In some examples, the flow sensing device may include a flow cap component and a sensor component. In some examples, the flow cap component may include a heating element disposed in a first layer of the flow cap component. In some examples, the sensor component may include at least one thermal sensing element disposed in a second layer of the sensor component. In some examples, the first layer and the second layer are noncoplanar. In some examples, the flow cap component may be bonded to a first surface of the sensor component to form a flow channel. In some examples, the first layer and the second layer may be noncoplanar and separated by the flow channel.

    FLOW SENSING DEVICE
    5.
    发明公开
    FLOW SENSING DEVICE 审中-公开

    公开(公告)号：EP3995789A1

    公开(公告)日：2022-05-11

    申请号：EP21205786.3

    申请日：2021-11-01

    申请人： Honeywell International Inc.

    发明人： BECK, Scott Edward ,  SPELDRICH, Jamie W. ,  SPELDRICH, Brian D. ,  FOSTER, Philip C.

    IPC分类号： G01F1/684 ,  G01F1/688 ,  G01F1/69

    摘要： Methods and apparatuses associated with flow sensing devices are provided. An example flow sensing device includes a flow cap component and a sensor component. The flow cap component or sensor component may include a heating element. The flow cap component can at least partially define a flow channel configured for a media to flow therethrough. The heater element may be orthogonal or perpendicular to the flow channel. The sensor component may include at least one thermal sensing element disposed upstream of the heater element and at least one thermal sensing element disposed downstream of the heater element. The sensor component may include two or more thermal sensing elements disposed in either the upstream direction or downstream direction of the heater element. Thermal sensing elements may be spaced different distances from the heater element to increase the accuracy and precision of flow rate measurement at low flow rates.

    WATER METERING SYSTEM
    6.
    发明公开
    WATER METERING SYSTEM 审中-公开

    公开(公告)号：EP3974781A1

    公开(公告)日：2022-03-30

    申请号：EP21193186.0

    申请日：2017-07-18

    申请人： Vaughn Realty Ventures LLC

    发明人： RADUCHEL, William J. ,  VAUGHN, Bradley Moser

    IPC分类号： G01F1/00 ,  G01F1/66 ,  G01F1/688 ,  G01F5/00 ,  G01F1/696 ,  G01F15/06 ,  G01F15/075 ,  H04Q9/00 ,  F24D19/10 ,  G01F15/063

    摘要： Methods, systems, and apparatus, including computer programs encoded on a computer storage medium, for metering water are disclosed. In one aspect, a method includes the actions of receiving, from a first meter that is connected to a first pipe, first audio data collected during a time period and first temperature data collected during the time period. The actions further include receiving, from a second meter that is connected to a second pipe, second audio data collected during the time period and second temperature data collected during the time period. The actions further include, based on the first audio data, the first temperature data, the second audio data, and the second temperature data, determining a first amount of material that has flowed through the first pipe during the time period relative to a second amount of material that has flowed through the second pipe.

    MEMS FLOW SENSOR
    10.
    发明公开
    MEMS FLOW SENSOR 审中-公开

    公开(公告)号：EP3332227A1

    公开(公告)日：2018-06-13

    申请号：EP16833674.1

    申请日：2016-08-01

    申请人： Aceinna, Inc.

    发明人： ZHAO, Yang ,  SILPACHAI, Ohlan ,  MAN, Francis ,  ZHAO, Zhengxin

    IPC分类号： G01F1/688 ,  G01F9/00 ,  G01N9/32 ,  H01C17/075 ,  H05B3/60

    CPC分类号： G01F1/6847 ,  G01F1/6845 ,  G01F1/692

    摘要： A MEMS flow sensor is provided having a micro flow channel etched in a silicon structure composed of two silicon substrates bonded or fused together. A heater and one or more temperature sensors are, in one embodiment, disposed around the perimeter of the flow channel and outside of the channel. In another embodiment, a heater and one or more temperature sensors are respectively disposed outside the flow channel at the top and bottom of the channel. In further embodiments, a heater and one or more temperature sensors are located inside the flow channel on one or more surfaces thereof or around the inside perimeter of the channel. The flow sensors in accordance with the invention are preferably fabricated using wafer scale fabrication techniques.