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    MANUFACTURING METHOD OF HEAT DISSIPATION DEVICE-INTEGRATED HEAT DISSIPATION SUBSTRATE FOR SEMICONDUCTOR
    1.
    发明公开
    MANUFACTURING METHOD OF HEAT DISSIPATION DEVICE-INTEGRATED HEAT DISSIPATION SUBSTRATE FOR SEMICONDUCTOR 审中-公开

    公开(公告)号：EP4503870A1

    公开(公告)日：2025-02-05

    申请号：EP24190895.3

    申请日：2024-07-25

    Applicant: IMH Inc.

    Inventor： LEE, Jong Eun

    IPC: H05K3/00 ,  H01L23/373 ,  H05K1/02 ,  H01L23/473 ,  H01L21/48 ,  H01L23/367 ,  H05K1/00 ,  H01L23/427

    Abstract: A manufacturing method of a heat dissipation device-integrated heat dissipation substrate for a semiconductor includes a base processing step of preparing a first base plate and a second base plate in the form of metal plates that overlap each other and constitute a part of a metal base, and providing a first base and a second base in which a three-dimensional structure forming the heat media circulation space is formed on an inner surface of at least one of the first base plate and the second base plate, a base coupling step of coupling opposing inner surfaces of the first base and the second base against each other to form heat dissipation device-integrated base, an electrode metal plate preparation step of processing an electrode metal plate to form a groove pattern, and preparing an electrode metal plate configured to cover an area corresponding to at least one circuit unit, and an electrode metal plate bonding step of bonding, via insulating resin, the electrode metal plate to an upper surface of the heat dissipation device-integrated base.

    MODULAR FUNCTIONALIZED COVER PANELS
    2.
    发明公开
    MODULAR FUNCTIONALIZED COVER PANELS 审中-公开

    公开(公告)号：EP4471656A1

    公开(公告)日：2024-12-04

    申请号：EP23176469.7

    申请日：2023-05-31

    Applicant: Airbus Operations GmbH

    Inventor： Brückmann, Konstantin ,  Hahn, Dennis ,  Nitsche, Maximilian

    IPC: G06F30/3947 ,  H05K1/00 ,  B64C1/06 ,  B64F5/00 ,  H05K1/02 ,  G06F113/16 ,  G06F113/24 ,  G06F113/26 ,  G06F113/28 ,  G06F115/12 ,  G06F119/18

    Abstract: The present disclosure relates to a method for generating, according to an input specification, a layout of a laminated panel comprising a first layer providing a cover function, a second layer providing a support function and a third layer providing a routing function. The method comprises the steps of selecting a mounting surface to be equipped with at least one electrical function, wherein the first layer is a part of the mounting surface, superimposing, onto the selected mounting surface, a grid signifying at least one virtual interface and at least one virtual constraint for the at least one electrical function, receiving the input specification to select and place the at least one electrical function on the superimposed grid, transferring the at least one selected and placed electrical function into one or more modules to be placed on the grid, connecting the one or more modules with the routing function, and generating the layout comprising manufacturing specifications for the first, second and third layers. The present disclosure further relates to a computer-readable medium, a laminated panel, an apparatus and a system.

    FLÄCHENLEUCHTE MIT RÜCKSEITIGER (SEKUNDÄR-)BELEUCHTUNG
    3.
    发明公开
    FLÄCHENLEUCHTE MIT RÜCKSEITIGER (SEKUNDÄR-)BELEUCHTUNG 审中-公开

    公开(公告)号：EP4269870A3

    公开(公告)日：2024-01-03

    申请号：EP23170286.1

    申请日：2023-04-27

    Applicant: Thorn Lighting Limited

    Inventor： KEANE, Raymond ,  ROUND, David ,  HODGSON, Robert ,  ARCHER, Peter

    IPC: F21V3/00 ,  F21V7/00 ,  F21V19/00 ,  H05K1/00 ,  F21Y105/18 ,  F21Y115/10 ,  F21Y109/00

    Abstract: Die vorliegende Erfindung betrifft eine Flächenleuchte (1) aufweisend eine flächige LED-Leiterplatte (2) mit einer flächigen Vorderseite (20), auf der eine Vielzahl von LEDs (23) vorgesehen ist, und einer von der Vorderseite (20) abgewandten flächigen Rückseite (21), wobei die Vorderseite (20) und die Rückseite (21) über eine umlaufende Stirnseite (22) miteinander verbunden sind, ein vorderes Lichtabgabeelement (3), welches eine zu der Vorderseite (20) beabstandet vorgesehene vordere Lichtabgabefläche (30) aufweist, die als Diffusor ausgebildet ist und die mit der LED-Leiterplatte (2) einen Lichtraum (4) derart begrenzt, so dass von den LEDs (23) in den Lichtraum (4) abgegebenes Licht wenigstens teilweise direkt über die vordere Lichtabgabefläche (30) nach außen abgegeben wird, und ein hinteres Lichtabgabeelement (5), welches eine hintere Lichtabgabefläche (50) aufweist, die der Rückseite (21) gegenüberliegend auf der dem vorderen Lichtabgabeelement (3) abgewandten Seite der LED-Leiterplatte (2) vorgesehen ist, wobei die LED-Leiterplatte (2) die Vorderseite (20) mit der Rückseite (21) verbindende Lichtdurchtrittsöffnungen (7) derart aufweist, so dass von der vorderen Lichtabgabefläche (30) zum Lichtraum (4) hin reflektiertes Licht der LEDs (23) über die Lichtdurchtrittsöffnungen (7) und die hintere Lichtabgabefläche (50) rückseits der Flächenleuchte (1) nach außen abgegeben wird.

    MOUNTING STRUCTURE FOR A CAPACITOR
    7.
    发明公开
    MOUNTING STRUCTURE FOR A CAPACITOR 审中-公开

    公开(公告)号：EP4167259A1

    公开(公告)日：2023-04-19

    申请号：EP21202236.2

    申请日：2021-10-12

    Applicant: Veoneer Passive Co. AB

    Inventor： SAVIN, Anatolie ,  CACU, Adrian

    IPC: H01G2/04 ,  H01G2/06 ,  H01G2/10 ,  H01G9/06 ,  H01G9/08 ,  H05K1/00 ,  F16B9/02 ,  H05K3/30 ,  H05K7/12

    Abstract: The invention relates to a mounting structure (3) for a capacitor (4). A second pair (12) of holding elements (13) is defined by a first arm (31) and a second arm (32), each having an inner circular arc surface (34) with a curvature being the same as the curvature of a surface (20) of the capacitor (4). In order to fix the capacitor (4) in the mounting structure (3), a nose (35) is formed at a free end (36) of the first arm (31) and at least one recess (37) is formed at a free end (38) of the second arm (32). When nose (35) and one of the at least one recess (37) cooperate, the capacitor (4) is fixed in position.

    POSITIONING FIXTURE
    8.
    发明公开
    POSITIONING FIXTURE 审中-公开

    公开(公告)号：EP4138123A1

    公开(公告)日：2023-02-22

    申请号：EP22179531.3

    申请日：2022-06-17

    Applicant: Pegatron Corporation

    Inventor： CHEN, Chun-Nan ,  LIN, Ming-Te ,  TSAI, Chi-Ming

    IPC: H01L23/40 ,  H05K1/00 ,  H05K7/14 ,  H05K7/20 ,  F16B5/02 ,  H05K13/00

    Abstract: A positioning fixture (100) including a shielding member (110) and a driving member (120) is provided. The shielding member (110) includes a sliding part (111) connected to a functional module (10), a guiding part (112), and a shielding part (113). The driving member (120) is disposed on the functional module (10). The driving member (120) includes a base part (121), a driving part (122) that contacts the guiding part (112), and a pillar part (123), which protrudes from the base part (121) and passes through the guiding groove (114). When the functional module (10) is positioned on the circuit board (20), the base part (121) of the driving member (120) is pushed by the electronic component (30), and the guiding part (112) is pushed by the driving part (122), so that the shielding member (110) slides and the shielding part (113) shields a screw hole of the circuit board (20).

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