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341 条记录 (耗时 0.015 秒)

    LOCKING MECHANISM AND POWER SUPPLY DEVICE
    1.
    发明公开
    LOCKING MECHANISM AND POWER SUPPLY DEVICE 审中-公开

    公开(公告)号：EP4444051A1

    公开(公告)日：2024-10-09

    申请号：EP23766407.3

    申请日：2023-02-09

    申请人： Murata Manufacturing Co., Ltd.

    发明人： FURUNO Masataka

    IPC分类号： H05K7/12 ,  E05B65/00 ,  F16B1/02 ,  H05K7/14

    CPC分类号： H05K7/12 ,  H05K7/14 ,  F16B1/02 ,  E05B65/00

    摘要： A lock mechanism (10) attached to an exterior body for housing an electronic device includes a latch (20) and a bumper (30). The latch (20) has a first flat plate (21) and a first protrusion (23). The first flat plate (21) has a main surface (22). The first protrusion (23) protrudes from the first flat plate (21) to a side that the main surface (22) faces. The bumper (30) has a second flat plate (31) in contact with the latch (20) and a second protrusion (33). The second protrusion (33) protrudes from the second flat plate (31) to a side in the same direction as the first protrusion (23). A specific axis parallel to the main surface (22) is a first axis (X), and an axis orthogonal to the first axis (X) and parallel to the main surface (22) is a second axis (Y). The first protrusion 23 has a latch surface (23A) perpendicular to the first axis (X). The second protrusion (33) has a bumper surface (33A) perpendicular to the second axis (Y).

    LOW PROFILE, NESTING CAPACITOR COLLARS
    4.
    发明公开
    LOW PROFILE, NESTING CAPACITOR COLLARS 审中-公开

    公开(公告)号：EP4220673A3

    公开(公告)日：2023-08-09

    申请号：EP23162959.3

    申请日：2019-06-18

    申请人： Raytheon Company

    发明人： WELLS, Derek B. ,  WALSH JR, Kenneth P. ,  RENAUD, Gregory S. ,  ZARKH, Dimitry

    IPC分类号： H01G11/82 ,  H01G11/10 ,  H01G2/04 ,  H01G11/86 ,  H01M10/0587 ,  H01G2/06 ,  H01G4/38 ,  H05K5/02 ,  H05K7/12 ,  H01G2/10 ,  H01G11/80 ,  H01G4/40

    摘要： A mounting collar comprises a collar body comprising an opening for receiving at least a portion of an electronics component of an electronics assembly, and a radial retention component supported about an inner surface of the opening of the collar body. The radial retention component is operable to apply a radial force on the electronics component to at least partially support the electronics component. A mounting system comprises a first mounting collar for mounting a first electronics component to a support structure, and a second mounting collar for mounting a second electronics component to the support structure. The first and second mounting collars can be nested together to minimize a distance between the first and second electronics components. The first and second mounting collars can each comprise an elastomeric O-ring to reduce strain between the electronics components and the circuit board. Associated systems and methods are provided.

    LOW PROFILE, NESTING CAPACITOR COLLARS
    5.
    发明公开
    LOW PROFILE, NESTING CAPACITOR COLLARS 审中-公开

    公开(公告)号：EP4220673A2

    公开(公告)日：2023-08-02

    申请号：EP23162959.3

    申请日：2019-06-18

    申请人： Raytheon Company

    发明人： WELLS, Derek B. ,  WALSH JR, Kenneth P. ,  RENAUD, Gregory S. ,  ZARKH, Dimitry

    IPC分类号： H01G2/04 ,  H01G2/06 ,  H01G4/38 ,  H01G11/10 ,  H01G11/82 ,  H05K7/12 ,  H01G2/10 ,  H01G4/40 ,  H01G11/80

    摘要： A mounting collar comprises a collar body comprising an opening for receiving at least a portion of an electronics component of an electronics assembly, and a radial retention component supported about an inner surface of the opening of the collar body. The radial retention component is operable to apply a radial force on the electronics component to at least partially support the electronics component. A mounting system comprises a first mounting collar for mounting a first electronics component to a support structure, and a second mounting collar for mounting a second electronics component to the support structure. The first and second mounting collars can be nested together to minimize a distance between the first and second electronics components. The first and second mounting collars can each comprise an elastomeric O-ring to reduce strain between the electronics components and the circuit board. Associated systems and methods are provided.

    MOUNTING STRUCTURE FOR A CAPACITOR
    7.
    发明公开
    MOUNTING STRUCTURE FOR A CAPACITOR 审中-公开

    公开(公告)号：EP4167259A1

    公开(公告)日：2023-04-19

    申请号：EP21202236.2

    申请日：2021-10-12

    申请人： Veoneer Passive Co. AB

    发明人： SAVIN, Anatolie ,  CACU, Adrian

    IPC分类号： H01G2/04 ,  H01G2/06 ,  H01G2/10 ,  H01G9/06 ,  H01G9/08 ,  H05K1/00 ,  F16B9/02 ,  H05K3/30 ,  H05K7/12

    摘要： The invention relates to a mounting structure (3) for a capacitor (4). A second pair (12) of holding elements (13) is defined by a first arm (31) and a second arm (32), each having an inner circular arc surface (34) with a curvature being the same as the curvature of a surface (20) of the capacitor (4). In order to fix the capacitor (4) in the mounting structure (3), a nose (35) is formed at a free end (36) of the first arm (31) and at least one recess (37) is formed at a free end (38) of the second arm (32). When nose (35) and one of the at least one recess (37) cooperate, the capacitor (4) is fixed in position.

    ELECTRONIC DEVICE
    9.
    发明公开
    ELECTRONIC DEVICE 审中-公开

    公开(公告)号：EP4152903A1

    公开(公告)日：2023-03-22

    申请号：EP22744364.5

    申请日：2022-04-21

    申请人： Honor Device Co., Ltd.

    发明人： The designation of the inventor has not yet been filed

    IPC分类号： H05K7/02 ,  H05K7/12

    摘要： This application discloses an electronic device, where a middle frame hole is provided on a middle frame. A screen chip and a screen outlet line are located on a side that is of the middle frame and that is close to a display, a battery is located on a side that is of the middle frame and that is away from the display, and the screen chip is laminated to a large surface of the screen outlet line. To avoid contact between the middle frame and the screen chip, the middle frame hole accommodates the screen chip, a protruding height of the screen chip relative to the large surface of the screen outlet line is less than a thickness of the middle frame hole, and a distance between the screen chip and the battery is greater than an avoidance distance of the screen chip. It can be learned that the electronic device avoids the screen chip by providing the middle frame hole, so that the screen chip is prevented from moving downward to be in contact with the middle frame when a user presses the display, thereby avoiding damage. In addition, only a minimum wall thickness that meets a reliability requirement needs to be set for the middle frame, so that an internal space of the electronic device is fully used, a wall thickness of the middle frame can be reduced while the screen chip is avoided, thereby further reducing an overall thickness of the electronic device.