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    ELECTRONIC APPARATUS COMPRISING CONNECTION MEMBER
    2.
    发明公开
    ELECTRONIC APPARATUS COMPRISING CONNECTION MEMBER 审中-公开

    公开(公告)号：EP4451697A1

    公开(公告)日：2024-10-23

    申请号：EP23763644.4

    申请日：2023-02-09

    申请人： Samsung Electronics Co., Ltd.

    发明人： LEE, Kyuho ,  OH, Juntaek ,  KIM, Jeonghoon ,  BANG, Youngseok ,  OH, Yoseb ,  CHOI, Donguk

    IPC分类号： H04R1/10 ,  H01Q1/27 ,  G06F1/16 ,  H02J7/00 ,  H05K1/11 ,  H05K1/14 ,  H05K1/18

    摘要： This electronic apparatus may comprise: a housing; a battery disposed inside the housing; an antenna; a printed circuit board having a first surface that faces the antenna and a second surface that is opposite the first surface and faces the battery, the printed circuit board having a first region that includes a conductive pattern and a second region that includes a dielectric material and is at least partially between the first connection member and the second connection member; the first connection member that is disposed on the first surface and electrically connects the antenna and the printed circuit board; and the second connection member that is disposed on the second surface and electrically connects the battery and the printed circuit board. At least a portion of the second connection member can overlap at least a portion of the first connection member, and at least a portion of the second region can be located between the first connection member and the second connection member.

    ELECTRONIC DEVICE COMPRISING BUFFER STRUCTURE
    3.
    发明公开
    ELECTRONIC DEVICE COMPRISING BUFFER STRUCTURE 审中-公开

    公开(公告)号：EP4451654A1

    公开(公告)日：2024-10-23

    申请号：EP23752997.9

    申请日：2023-01-04

    申请人： Samsung Electronics Co., Ltd.

    发明人： PARK, Jaeyong ,  SHIN, Kwangha

    IPC分类号： H04M1/02 ,  H05K1/14 ,  H05K5/00

    摘要： An electronic device may comprise: a first printed circuit board; a second printed circuit board; a flexible printed circuit board connected to each of the first printed circuit board and the second printed circuit board and extending between the first printed circuit board and the second printed circuit board; and a shock absorber configured to buffer the flexible printed circuit board.

    PRINTED CIRCUIT BOARD MODULE AND ELECTRONIC APPARATUS COMPRISING SAME
    10.
    发明公开
    PRINTED CIRCUIT BOARD MODULE AND ELECTRONIC APPARATUS COMPRISING SAME 审中-实审

    公开(公告)号：EP4408132A1

    公开(公告)日：2024-07-31

    申请号：EP22876838.8

    申请日：2022-09-28

    申请人： Samsung Electronics Co., Ltd.

    发明人： JEON, Jinhwan

    IPC分类号： H05K1/14 ,  H05K1/11 ,  H05K9/00 ,  H04M1/02

    CPC分类号： H05K9/00 ,  H05K1/14 ,  H05K1/11 ,  H04M1/02

    摘要： Various embodiments of the present disclosure relate to a printed circuit board module and an electronic apparatus comprising same. According to various embodiments of the present disclosure, provided is a printed circuit board module comprising: a board including a first surface facing a first direction and having formed thereon a first pad for electrical connection with the board, and a second surface facing a second direction opposite to the first direction and having formed thereon the first pad for electrical connection with the board and a second pad for bonding a shielding member; and at least one component disposed on the second surface, wherein the printed circuit board module may be bonded to an adjacent board by using the first pad formed on the first surface or the second surface. Various other embodiments may be applied.