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公开(公告)号:EP4140262B1
公开(公告)日:2024-07-17
申请号:EP21722582.0
申请日:2021-04-23
CPC分类号: H05K3/207 , H05K3/1275 , H05K1/095 , H05K1/092 , H05K2203/011320130101 , H05K2203/013920130101 , H05K2203/012620130101 , H05K2203/052220130101 , H05K2203/052820130101 , H05K2203/078320130101 , H05K2203/08320130101 , H05K2203/013420130101 , H05K3/1258 , H05K2203/110520130101 , H05K2203/111520130101
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公开(公告)号:EP4388826A1
公开(公告)日:2024-06-26
申请号:EP22755123.1
申请日:2022-07-21
申请人: JUMATECH GmbH
发明人: WÖLFEL, Markus
CPC分类号: H05K3/202 , H05K1/0263 , H05K2201/102820130101 , H05K3/103
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公开(公告)号:EP3337301B1
公开(公告)日:2024-05-01
申请号:EP17207467.6
申请日:2017-12-14
CPC分类号: H05K1/0265 , H05K1/056 , H05K3/103 , H05K3/202 , H05K3/305 , H05K3/386 , H05K2201/1010620130101 , H05K2201/1027220130101 , H05K2201/102820130101
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公开(公告)号:EP4346339A1
公开(公告)日:2024-04-03
申请号:EP22199193.8
申请日:2022-09-30
摘要: A printing device (1) is provided herein for printing a substance on a target surface (TS) of a target (T). The printing device comprises a carrier (2) having at a first main side (21) a carrier surface (2s) for carrying a specimen (SB1, SB2, SB3) of the substance to be printed. The printing device further comprises a heater facility (23) for heating the carrier surface to vaporize a portion of the specimen at the side of the carrier surface and inducing a vapor pressure that causes a transfer of a remainder of said specimen towards the target surface and a structured thermal buffer layer (25) that provides for a position dependent delay with which heat is transferred from the heater facility to the carrier surface.
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公开(公告)号:EP4315478A1
公开(公告)日:2024-02-07
申请号:EP22709672.4
申请日:2022-02-25
发明人: FRANKE, Torsten
IPC分类号: H01M10/42 , H01M50/519 , H05K3/00 , H05K3/20 , H01M10/48 , H01M10/613 , H01M10/6556 , H01M50/249
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6.
公开(公告)号:EP4218370A1
公开(公告)日:2023-08-02
申请号:EP21777486.8
申请日:2021-09-13
申请人: JUMATECH GmbH
发明人: WÖLFEL, Philipp
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公开(公告)号:EP4213196A1
公开(公告)日:2023-07-19
申请号:EP21864407.8
申请日:2021-09-02
申请人: Daicel Corporation
发明人: MIYAKE, Hiroto
摘要: There are provided a mounted structure from which such a mounted structure can be obtained that is excellent in precision with little joining deviation and can be efficiently produced, an LED display, and a mounting method. A mounted structure is provided in which a semiconductor element including a terminal is mounted on a substrate including an electrode. The mounted structure includes a joining portion in which the terminal and the electrode are joined opposing each other. The electrode is a bump of a bulk metal material disposed on the substrate. The joining portion is produced by thermally fusing metal nanoparticles, the metal nanoparticles being deposited from a metal complex by laser irradiation, the metal complex having been transferred onto at least one of the electrode or the terminal by using a microcontact printing method.
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公开(公告)号:EP3288350B1
公开(公告)日:2022-08-03
申请号:EP17179460.5
申请日:2017-07-04
发明人: SPEER, Richard S. , HAMBY, David
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公开(公告)号:EP3826438B1
公开(公告)日:2022-04-20
申请号:EP20216728.4
申请日:2017-07-28
IPC分类号: H05K3/20 , H01L31/0224
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