公开(公告)号：EP4426076A2

公开(公告)日：2024-09-04

申请号：EP24188167.1

申请日：2020-11-25

Applicant: Noda Screen Co., Ltd

Inventor： MORI, Yasumitsu ,  DOI, Akihiro

IPC: H05K3/00

CPC classification number: H05K3/42 ,  H05K2203/013920130101 ,  H05K2201/095920130101 ,  H05K3/0094 ,  H05K2203/147620130101 ,  H05K2203/02520130101 ,  C09J7/20 ,  C09J2301/20420200801 ,  C09J2301/1820200801 ,  C09J2203/32620130101

Abstract: A sealing film (12) that is to be attached to a print board (10) when supplying filling material (16) into through holes (11) of the print board (10) with a printing method under a vacuum atmosphere, the sealing film (12) being to be attached to the print board (10) from an opposite side from a filling material supplying side and separated from the print board (10) before starting a curing of the filling material (16), the sealing film (12) being made of synthetic resin and having a thickness being from 35 µm to 100 µm , the sealing film (12) comprising: a base film (12A) that has a smooth surface, the base film (12A) including micro holes (12C) having a diameter being from 10 µm to 100 µm and arranged at intervals of 2 mm to 4 mm; and an adhesive layer (12B) divided into adhesive layer (12B) portions that have a diameter being from 100 µm to 500 µm and are disposed on the base film at intervals of 10 µm to 400 µm.

公开(公告)号：EP4015988B1

公开(公告)日：2024-04-24

申请号：EP21210082.0

申请日：2021-11-24

IPC: G01B11/06 ,  H05K13/04 ,  H05K13/08 ,  H05K3/12

CPC classification number: G01B11/0608 ,  H05K3/0008 ,  H05K13/0465 ,  H05K13/082 ,  H05K13/081 ,  H05K3/1216 ,  H05K2203/013920130101 ,  H05K2203/16720130101

公开(公告)号：EP4351880A1

公开(公告)日：2024-04-17

申请号：EP22735803.3

申请日：2022-06-10

Applicant: Ekra Automatisierungssysteme GmbH

Inventor： PLACHY, Franz ,  SÄNGER, Lukas ,  VOIGT, Rainer

IPC: B41F15/08 ,  B41F15/44 ,  B41F33/00 ,  H05K3/12

CPC classification number: B41F15/44 ,  H05K3/1233 ,  B41F15/0881 ,  B41F15/20 ,  B41F15/26 ,  B41F15/46 ,  B41F33/0081 ,  B41F15/36 ,  B41P2215/11220130101 ,  B41P2215/11420130101 ,  H05K2203/013920130101

公开(公告)号：EP4424120A1

公开(公告)日：2024-09-04

申请号：EP22829904.6

申请日：2022-12-14

Applicant: REOPHOTONICS, LTD.

Inventor： GILAN, Ziv ,  ZENOU, Michael ,  NESHER, Guy

IPC: H05K3/14 ,  H05K3/04 ,  H05K3/12

CPC classification number: H05K3/046 ,  H05K3/1283 ,  H05K3/146 ,  H05K2203/012620130101 ,  H05K2203/013920130101 ,  H05K2203/014320130101 ,  H05K2203/015620130101 ,  H05K2203/052820130101 ,  H05K2203/08120130101 ,  H05K2203/08520130101 ,  H05K2203/10720130101 ,  H05K2203/113120130101 ,  H05K2203/16320130101

公开(公告)号：EP4140262B1

公开(公告)日：2024-07-17

申请号：EP21722582.0

申请日：2021-04-23

IPC: H05K1/09 ,  H05K3/12 ,  H05K3/20

CPC classification number: H05K3/207 ,  H05K3/1275 ,  H05K1/095 ,  H05K1/092 ,  H05K2203/011320130101 ,  H05K2203/013920130101 ,  H05K2203/012620130101 ,  H05K2203/052220130101 ,  H05K2203/052820130101 ,  H05K2203/078320130101 ,  H05K2203/08320130101 ,  H05K2203/013420130101 ,  H05K3/1258 ,  H05K2203/110520130101 ,  H05K2203/111520130101

公开(公告)号：EP3808563B1

公开(公告)日：2024-09-11

申请号：EP20200092.3

申请日：2020-10-05

IPC: B41F15/42 ,  B41F15/46 ,  B41F33/00 ,  B41F33/16 ,  H05K3/12

CPC classification number: H05K3/1233 ,  B41F15/423 ,  B41F15/46 ,  B41F33/16 ,  B41F33/0009 ,  B41F33/0036 ,  H05K2203/013920130101

公开(公告)号：EP4376558A1

公开(公告)日：2024-05-29

申请号：EP22209704.0

申请日：2022-11-25

Applicant: AT & S Austria Technologie & Systemtechnik Aktiengesellschaft

Inventor： Ifis, Abderrazzaq ,  Riedler, Jens

IPC: H05K1/02 ,  H05K3/00 ,  H05K3/28 ,  H05K3/42 ,  H05K3/40

CPC classification number: H05K3/0094 ,  H05K2203/013920130101 ,  H05K2201/095920130101 ,  H05K2201/0956320130101 ,  H05K3/429 ,  H05K3/0047 ,  H05K2203/02520130101 ,  H05K3/288 ,  H05K2203/138320130101 ,  H05K2203/138820130101 ,  H05K2201/0957220130101 ,  H05K1/0206 ,  H05K3/421 ,  H05K2203/072320130101 ,  H05K3/4038

Abstract: A method of manufacturing a component carrier (100), wherein the method comprises providing a stack (102) comprising at least one electrically conductive layer structure (104) and at least one electrically insulating layer structure (106) and having a hole (112), applying a protection layer (108) at least on at least part of a horizontal surface of the stack (102) for protecting the stack (102), filling a filling medium (114) in and/or on and/or around the hole (112) in the stack (102), and subsequently removing at least part of the protection layer (108) completely from the horizontal surface and removing material of the filling medium (114) by carrying out a common material removal process.