Method of patterning and fabricating poled dielectric microstructure within dielectric material
    94.
    发明专利
    Method of patterning and fabricating poled dielectric microstructure within dielectric material 审中-公开
    在介质材料中绘制和制作电介质微结构的方法

    公开(公告)号:JP2003307758A

    公开(公告)日:2003-10-31

    申请号:JP2003075070

    申请日:2003-03-19

    CPC classification number: G02F1/3558

    Abstract: PROBLEM TO BE SOLVED: To provide a method of patterning and fabricating poled dielectric microstructures in dielectric materials. SOLUTION: The poled dielectric microstructure is formed within the dielectric material. The poled dielectric microstructure is then segmented into a plurality of independent sub-structures. The poled dielectric microstructures are then fabricated within each of the plurality of the independent sub-structures. Further, additional processes and a novel poling setup for improving and implementing the patterning and fabrication method are also disclosed. COPYRIGHT: (C)2004,JPO

    Abstract translation: 要解决的问题:提供在电介质材料中图案化和制造极化电介质微结构的方法。

    解决方案:极化电介质微结构形成在电介质材料内。 然后将极化的电介质微结构分割成多个独立的子结构。 然后在多个独立子结构的每一个内制造极化介电微结构。 此外,还公开了用于改进和实现图案化和制造方法的附加工艺和新型极化设置。 版权所有(C)2004,JPO

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