Curable polycyclic compound and its preparation process
    92.
    发明专利
    Curable polycyclic compound and its preparation process 审中-公开
    可固化多环化合物及其制备方法

    公开(公告)号:JP2005146253A

    公开(公告)日:2005-06-09

    申请号:JP2004180123

    申请日:2004-06-17

    Abstract: PROBLEM TO BE SOLVED: To provide an industrially useful novel curable compound having a polycyclic hydrocarbon structure in the molecule and excellent in such as light and heat resistances with abundant applicable techniques. SOLUTION: The curable polycyclic compound is shown by formula (1) [wherein A represents a bi- to hexa-valent group derived from the polycyclic hydrocarbon compounds; R 1 represents an optionally perfluorinated 1-4C alkyl group or fluorine atom; n represents an integer of 0-2; m represents an integer of 2-4; Y represents a formula (2) or (3) (wherein R 2 , R 3 , R 5 and R 6 are each independently represents hydrogen or a fluorine atom or a 1-4C alkyl group; R 4 represents a methyl or ethyl group; p and q each represent an integer of 0-4)]. COPYRIGHT: (C)2005,JPO&NCIPI

    Abstract translation: 要解决的问题:提供在分子中具有多环烃结构的工业上有用的新型可固化化合物,并且具有优异的耐光性和耐热性,具有丰富的适用技术。 解决方案:可固化多环化合物由式(1)表示[其中A表示衍生自多环烃化合物的二价至六价基团; R 1表示任选全氟化的1-4C烷基或氟原子; n表示0-2的整数, m表示2-4的整数; Y表示式(2)或(3)(其中R 2 ,R 3 ,R 5 和R SP“各自独立地表示氢或氟原子或1-4C烷基; R”SP 4表示甲基或乙基; p和q各自表示0-4)]的整数。 版权所有(C)2005,JPO&NCIPI

    98.
    发明专利
    失效

    公开(公告)号:JPH05287051A

    公开(公告)日:1993-11-02

    申请号:JP10905792

    申请日:1992-04-03

    Abstract: PURPOSE:To obtain an epoxy resin composition having flow at ordinary temperature or low melt viscosity, can give a cured product excellent in heat and humidity resistance and is desirable for semiconductor sealing by mixing an epoxy resin of a specified formula with a curing agent. CONSTITUTION:The title composition is obtained by mixing an epoxy resin of formula I (wherein R1 and R2 are each H, halogen, 1-4C alkyl or aryl; and n is 1 or 2) with a curing agent and optionally a cure accelerator. The epoxy resin of formula I can be obtained by reacting a methylolated naphthol of formula II (wherein R1 and R2 are as defined above) with an epihalohydrin in the presence of an alkali metal hydroxide and a polar solvent. The resin composition containing the curing agent can easily be cured by a usual heating process or by uniformly dispersing or dissolving the respective components in a solvent or the like and removing the solvent or the like from the mixture. The obtained cured product is excellent in heat and humidity resistance and is a highly pure liquid resin, so that it can be highly filled with a filler when used for semiconductor sealing and can improve the reliability of the sealed device.

    PRODUCTION OF ALLYL GLYCIDYL ETHER
    100.
    发明专利

    公开(公告)号:JPS60130579A

    公开(公告)日:1985-07-12

    申请号:JP23877483

    申请日:1983-12-20

    Abstract: PURPOSE:To produce the titled substance by reacting allyl alcohol with epichlorohydrin and a solid alkali while removing produced water by the azeotropic distillation with epichlorohydrin, removing water from the azeotropic distillate, treating the distillate with a dehydration agent, and recycling to the reaction system. CONSTITUTION:1mol of allyl alcohol is made to react with 1-3mol of epichlorohydrin in the presence of 1.0-1.5mol of a solid alkali under boiling to obtain the objective substance. The produced water is removed from the system by forming an azeotropic mixture with the epichlorohydrin, water is separated from the distillate, and the distillate is treated with a dehydration agent and recycled to the reaction system. The reaction temperature is preferably 30-60 deg.C, and the reaction pressure is controlled (generally 40mm.Hg-1atm) so as to keep the boiling state at the above temperature. The reaction mixture may be added to 0.1-3.0g of an organic amine, a quaternary ammonium salt, etc. per 100g of allyl alcohol.

Patent Agency Ranking