公开(公告)号：JP2010258930A

公开(公告)日：2010-11-11

申请号：JP2009108749

申请日：2009-04-28

Applicant: Kyocera Kinseki Corp ,  京セラキンセキ株式会社

Inventor： OBA KENJI

IPC: H03H3/02 ,  H01L41/09 ,  H01L41/18 ,  H01L41/22 ,  H01L41/313 ,  H01L41/332

Abstract: PROBLEM TO BE SOLVED: To provide a method for manufacturing a crystal vibrator, capable of easily manufacturing the crystal vibrator in which one main surface of a vibrating portion has a curved convex portion, and reducing the manufacturing cost of the crystal vibrator. SOLUTION: The manufacturing method includes: a crystal substrate recess forming step of providing a plurality of crystal substrate recesses and substrate internal wirings on a crystal wafer; a cover forming step of providing a plurality of covers on the other main surface used as a crystal substrate of the crystal wafer by using an inkjet method; a convex processing step of processing the other main surface of the crystal wafer having the covers formed thereon; an electrode forming step of providing an electrode on a portion to be the crystal substrate; a first joining step of joining the first wafer having the portion to be a plurality of first containers to the crystal wafer with the crystal substrate recesses toward the first wafer; a second joining step of joining the second wafer having the plurality of container recesses provided on the one main surface to the crystal wafer with the container recesses toward the crystal wafer; and an individuating step of dividing the crystal wafer into individual crystal vibrators. COPYRIGHT: (C)2011,JPO&INPIT

Abstract translation: 解决的问题：为了提供一种制造晶体振子的方法，能够容易地制造振动部分的一个主表面具有弯曲凸部的晶体振子，并降低晶体振子的制造成本。 解决方案：制造方法包括：在晶体晶片上提供多个晶体衬底凹槽和衬底内部布线的晶体衬底凹槽形成步骤; 覆盖形成步骤，通过使用喷墨法在用作晶体晶片的晶体基板的另一主表面上设置多个盖; 凸形加工步骤，其处理形成有所述盖的所述晶体晶片的另一个主表面; 在作为所述晶体基板的部分上设置电极的电极形成工序; 第一接合步骤，将具有多个第一容器的部分的第一晶片接合到晶体晶片，晶体基板凹陷朝向第一晶片; 第二接合步骤，将具有设置在所述一个主表面上的所述多个容器凹部的所述第二晶片连接到所述晶体晶片，所述容器凹部朝向所述晶体晶片; 以及将晶体晶片分割成单独的晶体振子的单独步骤。 版权所有（C）2011，JPO＆INPIT

公开(公告)号：JP2010251978A

公开(公告)日：2010-11-04

申请号：JP2009098228

申请日：2009-04-14

Applicant: Shin-Etsu Chemical Co Ltd ,  信越化学工業株式会社

Inventor： ABE ATSUSHI

IPC: H03H3/08 ,  H01L21/02 ,  H01L41/09 ,  H01L41/18 ,  H01L41/22 ,  H01L41/313 ,  H01L41/337 ,  H03H9/25

Abstract: PROBLEM TO BE SOLVED: To provide a method of manufacturing a composite piezoelectric board in which a piezoelectric board and an insulation board are attached through an adhesive material, wherein the warpage is small after heat processing even if an inexpensive insulation board is used, and variations of the warpage are small and stable. SOLUTION: The method of manufacturing a piezoelectric board includes at least: a first step of applying an adhesive material on the main surface of either of a piezoelectric board or an insulation board; a second step of attaching the piezoelectric board and the insulation board together through the adhesive material; a third step of controlling the temperature of the attached boards so as to be 25±5°C and radiating ultraviolet rays onto the adhesive material to cure it; a fourth step of grinding the attached boards to a desired thickness; and a fifth step of heating the ground attached boards to completely cure the adhesive material. COPYRIGHT: (C)2011,JPO&INPIT

Abstract translation: 解决的问题：提供一种制造复合压电板的方法，其中压电板和绝缘板通过粘合材料附着，其中即使使用廉价的绝缘板，热处理后的翘曲也很小 翘曲变形小，稳定。 解决方案：压电板的制造方法至少包括：在压电板或绝缘基板的任一个的主面上涂布粘接材料的第一工序; 通过粘合剂材料将压电板和绝缘板连接在一起的第二步骤; 将附着板的温度控制为25±5℃并将紫外线照射到粘合剂材料上以使其固化的第三步骤; 将附着的板研磨成所需厚度的第四步骤; 以及加热地面连接板以完全固化粘合材料的第五步骤。 版权所有（C）2011，JPO＆INPIT

公开(公告)号：JP2010213262A

公开(公告)日：2010-09-24

申请号：JP2010026241

申请日：2010-02-09

Applicant: Nippon Dempa Kogyo Co Ltd ,  日本電波工業株式会社

Inventor： SAITO TAKESHI

IPC: H03H9/19 ,  H01L41/09 ,  H01L41/18 ,  H01L41/22 ,  H01L41/313 ,  H01L41/332 ,  H03H3/02 ,  H03H9/215

CPC classification number: H03H9/21 ,  H03H3/02 ,  H03H9/0595 ,  H03H9/1021 ,  H03H9/1035 ,  H03H2003/026 ,  H03H2003/0492 ,  Y10T29/42

Abstract: PROBLEM TO BE SOLVED: To provide a tuning-fork type piezoelectric vibrating piece or piezoelectric device, wherein weight portions in the distal ends of vibrating arms do not collide with each other during vibration, even when the weight portions must be enlarged, while miniaturizing the tuning-fork type piezoelectric vibrating piece. SOLUTION: The tuning-fork type piezoelectric vibrating piece 20 is provided with a base portion 23 including a piezoelectric material; a pair of parallel vibrating arms 21, with a designated thickness D3 and a width W3 extending from the base portion; and a pair of weight portions 28, with the width of the vibrating arms 21 enlarged to have a fixed width W4 from the front of the tips of the vibrating arms 21 to the side of the tips. The pair of weight portions 28 have a skirt portion which has a thickness D4 smaller than the designated thickness D3. Accordingly, even if the vibrating arms vibrate, the weight portions will not collide. COPYRIGHT: (C)2010,JPO&INPIT

Abstract translation: 要解决的问题：为了提供一种音叉型压电振动片或压电装置，其中振动臂的远端中的重量部分在振动期间不会相互碰撞，即使重量部分必须扩大， 同时使音叉型压电振动片小型化。 音叉式压电振动片20设置有包括压电材料的基部23; 一对平行的振动臂21，具有指定的厚度D3和从基部延伸的宽度W3; 以及一对配重部28，其中振动臂21的宽度被扩大，从振动臂21的前端到前端侧的固定宽度W4。 一对配重部28具有比规定厚度D3小的厚度D4的裙部。 因此，即使振动臂振动，重量部也不会发生碰撞。 版权所有（C）2010，JPO＆INPIT

公开(公告)号：JP2010183539A

公开(公告)日：2010-08-19

申请号：JP2009027857

申请日：2009-02-09

Applicant: Seiko Instruments Inc ,  セイコーインスツル株式会社

Inventor： MINEGISHI TAKASHI

IPC: H03H9/19 ,  H01L41/09 ,  H01L41/18 ,  H01L41/22 ,  H01L41/23 ,  H01L41/29 ,  H01L41/313 ,  H03B5/32 ,  H03H3/02 ,  H03H9/215

Abstract: PROBLEM TO BE SOLVED: To provide a piezoelectric vibration piece that can improve bondability between the piezoelectric vibration piece and a package by suppressing deposition of ground metal made of chromium on a finished metal layer, a piezoelectric vibrator, a method of manufacturing the piezoelectric vibrator, oscillator, and electronic equipment and a radio wave clock. SOLUTION: The piezoelectric vibration piece 2 has, on a surface of a mounting region P, an electrode layer 18 formed by laminating the ground metal layer 18a made of chromium and the finished metal layer 18c made of gold. A barrier metal layer 18b for preventing the ground metal layer 18a from being diffused to the finished metal layer 18c is arranged between the ground metal layer 18a and the finished metal layer 18c in the mounting region P. COPYRIGHT: (C)2010,JPO&INPIT

Abstract translation: 解决的问题：提供一种压电振动片，其可以通过抑制在成品金属层上镀铬的金属的沉积来提高压电振动片与封装之间的结合能力，压电振动器，制造方法 压电振子，振荡器和电子设备以及无线电波时钟。 解决方案：压电振动片2在安装区域P的表面上具有通过层压由铬制成的接地金属层18a和由金制成的成品金属层18c而形成的电极层18。 用于防止接地金属层18a扩散到成品金属层18c的阻挡金属层18b布置在安装区域P中的接地金属层18a和成品金属层18c之间。（C）2010 ，JPO＆INPIT

公开(公告)号：JP2010183538A

公开(公告)日：2010-08-19

申请号：JP2009027856

申请日：2009-02-09

Applicant: Seiko Instruments Inc ,  セイコーインスツル株式会社

Inventor： MINEGISHI TAKASHI

IPC: H03H3/02 ,  H01L41/09 ,  H01L41/18 ,  H01L41/22 ,  H01L41/23 ,  H01L41/313 ,  H03B5/32 ,  H03H9/02 ,  H03H9/13 ,  H03H9/19

Abstract: PROBLEM TO BE SOLVED: To provide a method of manufacturing a piezoelectric vibrator which can improve bondability between a piezoelectric vibration piece and a package by keeping a surface of a finished metal layer in a good state and the piezoelectric vibrator manufactured by the manufacturing method, an oscillator having the piezoelectric vibrator, electronic equipment, and a radio wave clock. SOLUTION: The method of manufacturing the piezoelectric vibrator includes: a first etching process of processing a surface of the piezoelectric vibration piece 2 using a first etchant consisting of a potassium hydroxide aqueous solution prior to a process of mounting the piezoelectric vibration piece 2; and a second etching process of processing the surface of the piezoelectric vibration piece 2 using a second etchant consisting of a solution of potassium ferricyanide and potassium hydroxide. COPYRIGHT: (C)2010,JPO&INPIT

Abstract translation: 解决的问题：提供一种制造压电振动器的方法，该压电振动器可以通过将成品金属层的表面保持在良好状态来提高压电振动片与封装之间的粘合性，以及通过制造制造的压电振动器 方法，具有压电振动器的振荡器，电子设备和无线电波时钟。 解决方案：制造压电振动器的方法包括：在安装压电振动片2的过程之前，使用由氢氧化钾水溶液组成的第一蚀刻剂来处理压电振动片2的表面的第一蚀刻工艺 ; 以及使用由铁氰化钾和氢氧化钾溶液组成的第二蚀刻剂来处理压电振动片2的表面的第二蚀刻工艺。 版权所有（C）2010，JPO＆INPIT

公开(公告)号：JP4522182B2

公开(公告)日：2010-08-11

申请号：JP2004221176

申请日：2004-07-29

Applicant: 京セラ株式会社

Inventor： 昭一 島田

IPC: H03H9/02 ,  H01L23/02 ,  H01L41/09 ,  H01L41/18 ,  H01L41/22 ,  H01L41/23 ,  H01L41/253 ,  H01L41/313 ,  H03H3/02

Abstract: PROBLEM TO BE SOLVED: To provide a package for storing a piezoelectric element which is miniaturized and excellent in airtightness, and to provide a piezoelectric device, and a method for manufacturing the piezoelectric device. SOLUTION: The package includes a base body 101 for storing the piezoelectric element; an electrode 102 to which the piezoelectric element is connected; an outer connection terminal 103; a through-hole 104; and a conductor layer 105 formed on the inner surface of the through-hole. The base body 101 includes a recessed part 107 on the upper surface 106 to store the piezoelectric element. The electrode 102 is formed in the recessed part 107. The outer connection terminal 103 is formed on the lower surface 108 of the base body 101. The through-hole 104 is formed between the bottom surface 109 of the recessed part 107 in the base body 101 and the lower surface 108 of the base body 101. The conductor layer 105 electrically connects the electrode 102 to the outer connection terminal 103. COPYRIGHT: (C)2006,JPO&NCIPI

公开(公告)号：JP4507551B2

公开(公告)日：2010-07-21

申请号：JP2003361574

申请日：2003-10-22

Applicant: エプソントヨコム株式会社

Inventor： 健二 佐藤 ,  資郎 村上 ,  紀之 渡辺 ,  和寿 畑中

IPC: H01L41/09 ,  H03H9/19 ,  H01L41/18 ,  H01L41/22 ,  H01L41/313 ,  H01L41/332 ,  H01L41/338 ,  H03H3/02

Abstract: PROBLEM TO BE SOLVED: To provide a crystal oscillator element capable of dealing with miniaturization and cost reduction and having a highly accurate outer dimension, provide a manufacturing method thereof, and provide a surface mounted crystal device employing this crystal oscillator element. SOLUTION: The method of manufacturing the AT-cut crystal oscillator element in which a short side exposing a cleavage is arranged in parallel to a Z-axis and on the negative side of an X-axis, comprises an etching process for segmenting, and forming, on the large crystal preform, a crystal element board equivalent to the crystal oscillator element of a large crystal preform, coupling portions extending from each of corners of one of the short sides of the crystal preform, and a supporting portion connecting to an end edge of each of the connecting portions; and a dividing process of bending and breaking the crystal vibrating element at the smallest part of the coupling portion. COPYRIGHT: (C)2005,JPO&NCIPI

公开(公告)号：JP2010153962A

公开(公告)日：2010-07-08

申请号：JP2008326880

申请日：2008-12-24

Applicant: Ngk Insulators Ltd ,  日本碍子株式会社

Inventor： SUZUKI KENJI

IPC: H03H3/08 ,  H01L41/09 ,  H01L41/18 ,  H01L41/22 ,  H01L41/313 ,  H01L41/337 ,  H03H9/25

Abstract: PROBLEM TO BE SOLVED: To facilitate manufacturing a composite substrate which is used for an acoustic wave element and has a relatively simple structure while variation in size with temperature is smaller than that of a substrate formed only by laminating a piezoelectric substrate with a support substrate together.
SOLUTION: A method includes preparing a silicon substrate 12, an LT substrate 10 capable of propagating SAW, and a resin film 18 in the same shape with the LT substrate 10. Then the LT substrate 10 is coated with an organic adhesive 13 and stuck on the silicon substrate 12, and the resin film 18 is put over the silicon substrate 12 and then heated to form a stuck substrate 16. Further, the top surface of the LT substrate 10 is polished by a polishing surface plate to polish the top surface into a mirror plane while reducing the thickness of the LT substrate 10.
COPYRIGHT: (C)2010,JPO&INPIT

Abstract translation: 要解决的问题为了便于制造用于声波元件并且具有相对简单的结构的复合衬底，同时尺寸随温度的变化小于仅通过将压电衬底与 一起支撑基板。 解决方案：一种方法包括制备硅衬底12，能够传播SAW的LT衬底10和与LT衬底10具有相同形状的树脂膜18.然后，将LT衬底10涂覆有机粘合剂13 并粘贴在硅基板12上，将树脂膜18放置在硅基板12上，然后被加热以形成粘贴的基板16.此外，通过抛光表面板抛光LT基板10的顶表面以抛光 顶部表面进入镜面，同时减小LT基板10的厚度。版权所有（C）2010，JPO＆INPIT

公开(公告)号：JP2010141908A

公开(公告)日：2010-06-24

申请号：JP2010013550

申请日：2010-01-05

Applicant: Piedekku Gijutsu Kenkyusho:Kk ,  有限会社ピエデック技術研究所

Inventor： KAWASHIMA HIROFUMI

IPC: H03H9/19 ,  H01L41/09 ,  H01L41/18 ,  H01L41/22 ,  H01L41/23 ,  H01L41/253 ,  H01L41/29 ,  H01L41/311 ,  H01L41/313 ,  H03B5/32 ,  H03H3/02 ,  H03H3/04 ,  H03H9/215

Abstract: PROBLEM TO BE SOLVED: To provide a tuning-fork flexible crystal oscillator, capable of oscillating at a fundamental-wave mode in which harmonic-mode oscillation free of the influence of impacts and vibrations is suppressed, and to provide a crystal unit, a crystal-controlled oscillator, and electronic devices equipped with the crystal oscillator. SOLUTION: The tuning-fork flexible crystal oscillator is equipped with a tuning-fork base, and at least first and second tuning-fork arms connected to the tuning-fork base. One end in each of the first and second tuning-fork arms is connected to the tuning-fork base, and the other end is free; grooves are formed in each of the upper and lower sides of the tuning-fork arms, and electrodes are disposed on the upper sides of the grooves and the tuning-fork arms so as to oscillate in a reverse-phase flexible mode; and sizes of the tuning forks, grooves, and electrodes are determined so that the figure of merit M 1 in the fundamental-wave mode oscillation of the tuning-fork crystal oscillator is larger than the figure of merit M 2 in the secondary harmonic-mode oscillation. COPYRIGHT: (C)2010,JPO&INPIT

Abstract translation: 要解决的问题：提供一种音叉式柔性晶体振荡器，其能够在不受冲击和振动的影响的谐波模式振荡被抑制的基波模式下振荡，并提供晶体单元 晶体振荡器，以及装配有晶体振荡器的电子器件。 解决方案：音叉柔性晶体振荡器配有音叉底座，至少第一和第二音叉臂连接到音叉底座。 第一和第二音叉臂中的每一个中的一端连接到音叉基座，另一端是自由的; 在音叉臂的上侧和下侧的每一个中形成有凹槽，并且电极设置在凹槽和音叉臂的上侧，以便以反相柔性模式振荡; 并且确定调音叉，凹槽和电极的尺寸，使得音叉晶体振荡器的基波模式振荡中的品质因数M 1 大于品质因数M 2 二次谐波模式振荡。 版权所有（C）2010，JPO＆INPIT

公开(公告)号：JP2010130400A

公开(公告)日：2010-06-10

申请号：JP2008303436

申请日：2008-11-28

Applicant: Daishinku Corp ,  株式会社大真空

Inventor： KODA NAOKI

IPC: H03H9/19 ,  H01L41/09 ,  H01L41/18 ,  H01L41/22 ,  H01L41/23 ,  H01L41/29 ,  H01L41/313 ,  H01L41/332

Abstract: PROBLEM TO BE SOLVED: To provide a piezoelectric vibration device capable of obtaining stable characteristics by preventing an insulation defect while relaxing stress generated on a piezoelectric diaphragm. SOLUTION: A crystal vibrator 1 is comprised of a crystal diaphragm 2, a first cover member 3 and a second cover member 4 and in the crystal diaphragm 2, there are integrally molded a vibrating part 20 in which a pair of front and rear exciting electrodes 23 are formed, a frame part 29 formed thicker than the vibrating part, and a thin part 28 formed thinner than the vibrating part between the vibrating part and the frame part. In the vibrating part 20, a first bonding electrode 25 is formed and on one principal surface 31 of the first cover member 3, a second bonding electrode 33 is formed which is electrically coupled with an external connecting terminal 34 formed on another principal surface 37. Then, the first bonding electrode 25 and the second bonding electrode 33 are integrally bonded via brazing metal material, so that the exciting electrode 23 is electrically coupled with the external connecting terminal 34. COPYRIGHT: (C)2010,JPO&INPIT

Abstract translation: 解决的问题：提供一种压电振动装置，能够通过在压电振动板上产生的应力放松同时防止绝缘缺陷而获得稳定的特性。 解决方案：晶体振子1包括晶体振动膜2，第一盖构件3和第二盖构件4，并且在晶体振动膜2中整体地模制有振动部20，其中一对前部和 形成后激励电极23，形成为比振动部更厚的框部29，以及形成为比振动部与框架部之间的振动部更薄的薄部28。 在振动部20中，形成第一接合电极25，在第一盖部件3的一个主面31上形成有与形成在另一主面37上的外部连接端子34电连接的第二接合电极33。 然后，第一接合电极25和第二接合电极33通过钎焊金属材料一体接合，使得激励电极23与外部连接端子34电耦合。版权所有（C）2010，JPO＆INPIT