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    Metal foil polyimide laminate
    108.
    发明专利
    Metal foil polyimide laminate 审中-公开
    金属箔聚酰亚胺层压板

    公开(公告)号：JP2011062842A

    公开(公告)日：2011-03-31

    申请号：JP2009213251

    申请日：2009-09-15

    Applicant: Asahi Kasei E-Materials Corp ,  Pi R & D Co Ltd ,  旭化成イーマテリアルズ株式会社 ,  株式会社ピーアイ技術研究所

    Inventor： SASAYAMA MASAAKI ,  IZUMI AKIHIRO ,  IOKA TAKAAKI

    IPC: B32B15/088 ,  H05K1/03

    Abstract: PROBLEM TO BE SOLVED: To provide a metal foil polyimide laminate which has a high adhesion property to metal foil not subjected to roughening treatment and keeps the high adhesion property even after being preserved at a high temperature. SOLUTION: The metal foil polyimide laminate has an adhesive polyimide and the metal foil on at least one side of a polyimide film. The adhesive polyimide contains 1,3-bis(3-aminophenoxy)benzene. The ten-point average roughness (Rz) of the surface of the metal foil in contact with the polyimide is from 0.4 μ to 1.3 μ, and the quantity of elements of the surface of the metal foil in contact with the polyimide in an atom.% value by XPS (X-ray photoelectron spectroscopy measurement), Si value/(Zn value+Cr value+Ni value+Cu value) is at least 0.3. COPYRIGHT: (C)2011,JPO&INPIT

    Abstract translation: 要解决的问题：提供一种对未进行粗糙化处理的金属箔具有高粘附性的金属箔聚酰亚胺层压体，并且即使在高温下保持之后也能保持高附着性。 解决方案：金属箔聚酰亚胺层压体在聚酰亚胺膜的至少一侧具有粘合聚酰亚胺和金属箔。 粘合聚酰亚胺含有1,3-双（3-氨基苯氧基）苯。 与聚酰亚胺接触的金属箔的表面的十点平均粗糙度（Rz）为0.4μm〜1.3μm，金属箔与原子中的聚酰亚胺接触的表面的元素量。 XPS（X射线光电子能谱测定）的％值，Si值/（Zn值+ Cr值+ Ni值+ Cu值）为0.3以上。 版权所有（C）2011，JPO＆INPIT

    Metal foil polyimide laminate
    109.
    发明专利
    Metal foil polyimide laminate 审中-公开
    金属箔聚酰亚胺层压板

    公开(公告)号：JP2011037157A

    公开(公告)日：2011-02-24

    申请号：JP2009187191

    申请日：2009-08-12

    Applicant: Asahi Kasei E-Materials Corp ,  Pi R & D Co Ltd ,  旭化成イーマテリアルズ株式会社 ,  株式会社ピーアイ技術研究所

    Inventor： ASANO GOJI ,  OGIYA SATOSHI

    IPC: B32B15/088 ,  B32B7/02 ,  H05K1/03

    Abstract: PROBLEM TO BE SOLVED: To provide a metal foil polyimide laminate which can form fine wiring, and can obtain a low rate of a dimension change.
    SOLUTION: A metal foil polyimide laminate includes a non-thermoplastic polyimide layer 3 and a heat contact-bonding polyimide layer 4 laminated on one surface of the non-thermoplastic polyimide layer 3, and includes a polyimide film 1 having a thickness of 5-15 μm, and metal foil 2 laminated on the heat contact-bonding polyimide layer 4. The non-thermoplastic polyimide layer 3 has a linear thermal expansion coefficient of 10 ppm/K or higher which is not higher than that of the metal foil 2, and the heat contact-bonding polyimide layer 4 has a linear thermal expansion coefficient of 40-60 ppm/K. The metal foil 2 has an Ef of 2.0 or larger when a thickness of wiring is Tc, a width of a top side of the wiring is Wt, a width of a bottom side of the wiring is Wb, and an etching factor Ef is defined as Ef=(2×Tc)/(Wb-Wt) when patterning is performed by an etching method.
    COPYRIGHT: (C)2011,JPO&INPIT

    Abstract translation: 要解决的问题：提供可以形成精细布线的金属箔聚酰亚胺层压体，并且可以获得低的尺寸变化率。 解决方案：金属箔聚酰亚胺层压体包括层压在非热塑性聚酰亚胺层3的一个表面上的非热塑性聚酰亚胺层3和热接触聚酰亚胺层4，并且包括聚酰亚胺膜1，其厚度为 5-15μm，层压在热接触聚酰亚胺层4上的金属箔2.非热塑性聚酰亚胺层3的线性热膨胀系数为10ppm / K以上，不高于金属箔 2，热接触聚酰亚胺层4的线性热膨胀系数为40〜60ppm / K。 当布线厚度为Tc，布线的上侧的宽度为Wt，布线的底侧的宽度为Wb，并且刻蚀因子Ef被限定时，金属箔2的Ef为2.0以上 当通过蚀刻方法进行图案化时，Ef =（2×Tc）/（Wb-Wt）。 版权所有（C）2011，JPO＆INPIT

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