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公开(公告)号：JP4858547B2
公开(公告)日：2012-01-18
申请号：JP2009003298
申请日：2009-01-09
申请人： 株式会社デンソー
IPC分类号： H01L29/84 , G01L9/00 , G01P15/08 , G01P15/125
CPC分类号： G01P15/0802 , B81B7/007 , B81B7/02 , B81B2207/092 , B81B2207/095 , G01P1/023 , G01P15/125 , G01P2015/0814 , G01P2015/0828 , H01L27/14601 , H01L27/148
摘要： A semiconductor device includes a sensor member and a cap member. The sensor member has a surface and includes a first sensing section. The first sensing section includes first and second portions that are located on the surface side of the sensor member and electrically insulated from each other. The cap member has a surface and includes a cross wiring portion. The surface of the cap member is joined to the surface of the sensor member in such a manner that the first sensing section is sealed by the sensor member and the cap member. The cross wiring portion electrically connects the first portion to the second portion.
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公开(公告)号：JP2011007672A
公开(公告)日：2011-01-13
申请号：JP2009152269
申请日：2009-06-26
申请人： Mitsumi Electric Co Ltd , ミツミ電機株式会社
CPC分类号： G01P15/0802 , B81B7/0077 , B81B2201/0235 , G01P15/123 , G01P15/18 , G01P2015/0814 , G01P2015/0828 , G01P2015/0842
摘要： PROBLEM TO BE SOLVED: To provide an acceleration sensor for improving the reliability of the proximity of an electrode pad using a wafer level package.SOLUTION: This acceleration sensor 100 includes a sensor section 110 formed of an acceleration detection element and Al wiring 116 for connecting it to the electrode pads 115 formed in a frame 111, a cap section 117 that is mounted in the sensor section 110 and stores the sensor section 110 in a sealed space, and an adhesive layer 118 for joining the sensor section 110 to the cap section 117. Each electrode pad 115 has an extended section 115A extended in the direction of the sealed space of the sensor section 110. The cap section 117 is joined to the sensor section 110 via the adhesive layer 118 stacked on ends of the extended sections 115A.
摘要翻译： 要解决的问题：提供一种用于提高使用晶片级封装的电极焊盘接近的可靠性的加速度传感器。解决方案：该加速度传感器100包括由加速度检测元件形成的传感器部分110和用于连接的Al布线116 它连接到形成在框架111中的电极焊盘115，安装在传感器部分110中并将传感器部分110存储在密封空间中的盖部分117和用于将传感器部分110接合到盖部分的粘合剂层118 每个电极焊盘115具有沿传感器部分110的密封空间的方向延伸的延伸部分115A。盖部分117经由层叠在延伸部分115A的端部上的粘合剂层118接合到传感器部分110。
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公开(公告)号：JP4562762B2
公开(公告)日：2010-10-13
申请号：JP2007315328
申请日：2007-12-06
申请人： Okiセミコンダクタ株式会社
发明人： 泰史 五十嵐
IPC分类号： G01P15/125 , G01L9/00
CPC分类号： G01P15/125 , B81B7/02 , B81B2201/0235 , B81B2201/0264 , B81B2207/092 , B81C1/00301 , G01P1/023 , G01P2015/0828
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公开(公告)号：JP2010071714A
公开(公告)日：2010-04-02
申请号：JP2008237516
申请日：2008-09-17
发明人： NISHIZAWA RYUTA , KAMEDA TAKAHIRO
IPC分类号： G01P15/10
CPC分类号： G01P15/097 , G01P2015/0828
摘要： PROBLEM TO BE SOLVED: To provide a vibration sensor excellent in impact resistance by preventing damage of a vibration piece in such a manner to prevent concentration of stress on the vibration piece which may occur by an impact applied to a sensor. SOLUTION: This vibration sensor includes beam shaped vibration arms 15, 16 capable of undergoing bending vibration in a plane direction by a predetermined resonant frequency, the vibration piece 11 in which a first base part 12, a first constriction part 8 and a first support part 17 are sequentially formed from one ends of the vibration arms 15, 16 and a second base part 13, a second constriction part 9 and a second support part 18 are sequentially formed from the other ends thereof, and a base 23 for supporting the vibration piece 11. In the vibration piece 11, one main face 31 of each of the first support part 17 and second support part 18 is connected to the base 23. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译： 要解决的问题：通过防止振动片的损坏以防止由于施加到传感器的冲击而产生的振动片上的应力集中，提供抗冲击性优异的振动传感器。 解决方案：该振动传感器包括能够在平面方向上以预定的共振频率进行弯曲振动的波束形振动臂15,16;振动片11，其中第一基部12，第一收缩部8和 第一支撑部17从振动臂15,16的一端顺序地形成，第二基部13，第二缩颈部9和第二支撑部18从其另一端依次形成，并且支撑基部23 在振动片11中，第一支撑部17和第二支撑部18中的每一个的一个主面31连接到基座23.版权所有（C）2010，JPO＆INPIT
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15.发明专利Method and system for minimizing vibration rectification error in magnetic circuit acceleration meter 有权用于最小化磁电加速度计中振动恢复误差的方法和系统
公开(公告)号：JP2009236911A
公开(公告)日：2009-10-15
申请号：JP2009063045
申请日：2009-03-16
发明人： PAUL DWYER
IPC分类号： G01P15/11
CPC分类号： G01P15/132 , G01P15/11 , G01P2015/0828
摘要： PROBLEM TO BE SOLVED: To provide a system and method for minimizing vibration rectification error in magnetic circuit acceleration meter. SOLUTION: The system includes an acceleration meter provided with: an excitation ring having an apex piece 40 having internal diameter of a lower part and a bottom piece 42 having a diameter smaller than the internal diameter of the lower part of the apex piece; a proof mass 64; a magnet 44 fixed on the bottom piece of the excitation ring; a pole piece 46 fixed to the magnet; and a coil 70 extending between the apex piece of the excitation ring and the magnetic pole piece, together with fixing to the proof mass. This method includes: a step of arranging a magnetic pole piece in a magnetic pole piece for polishing a surface deposition; a step of arranging the apex piece on the out side part of the magnetic pole piece for polishing the surface deposition; and a step of arranging the bottom piece of the excitation ring under the apex piece of the excitation ring. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译： 要解决的问题：提供一种用于使磁路加速度计中的振动整流误差最小化的系统和方法。 解决方案：该系统包括加速度计，其具有：具有内径为下部的顶点40和直径小于顶点的下部的内径的底部件42的激励环 ; 验证质量64; 固定在激励环的底部片上的磁体44; 固定在磁铁上的极片46; 以及在激励环的顶点与磁极片之间延伸的线圈70，以及固定在校验块上。 该方法包括：将磁极片布置在用于抛光表面沉积的磁极片中的步骤; 将顶点布置在磁极片的外侧部分以抛光表面沉积的步骤; 以及将激励环的底部片置于激励环的顶点之下的步骤。 版权所有（C）2010，JPO＆INPIT
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公开(公告)号：JP4285488B2
公开(公告)日：2009-06-24
申请号：JP2006039192
申请日：2006-02-16
申请人： Tdk株式会社
发明人： 茂 庄司
IPC分类号： G01P15/105 , G01P15/18 , G11B33/14
CPC分类号： G01P15/105 , B82Y25/00 , G01P15/18 , G01P2015/0828 , G01R33/093 , G01R33/1207 , G11B19/043
摘要： An acceleration sensor includes at least one permanent magnet, a spring member for supporting the at least one permanent magnet to displace the at least one permanent magnet when an external force is applied, and a magnetic field detection sensor mounted in stationary state to face the at least one permanent magnet. The magnetic field detection sensor has at least one multi-layered MR element that includes a magnetization fixed layer and a magnetization free layer. The magnetization fixed layer is magnetized in a direction parallel to a displacement detection direction. Each permanent magnet has a multi-layered structure of hard magnetic material layers and nonmagnetic material layers alternately laminated each other in a direction perpendicular to a plane of the magnetic field detection sensor and to the magnetized direction of the magnetization fixed layer.
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公开(公告)号：JP2007121107A
公开(公告)日：2007-05-17
申请号：JP2005313560
申请日：2005-10-27
发明人： TAKAHASHI YOSHITOMO
CPC分类号： G01L9/0072 , G01D21/02 , G01L19/0092 , G01P15/125 , G01P2015/0828
摘要： PROBLEM TO BE SOLVED: To provide a pressure sensor with a built-in acceleration sensor, thereby separated installation of a pressure sensor and an acceleration sensor is unnecessary, while capable of enhancing wet endurance of acceleration sensor. SOLUTION: A lower capacitive electrode 2 and an opposite substrate capacitive electrode 6 are prepared on the facing plane of a TFT substrate 1 and an opposite substrate 5, respectively, and sealants 7 are prepared at periphery of the both substrates, which seal a space surrounded by the sealants 7 so as to have a predetermined spacing between the both substrates. An acceleration sensor 3 is built onto the upper surface of the TFT substrate 1 inside the pressure sensor, which measures the pressure imposed on the substrate from capacitance change between the lower capacitive electrode 2 and the opposite substrate capacitive electrode 6. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译： 要解决的问题：为了提供具有内置加速度传感器的压力传感器，因此不需要压力传感器和加速度传感器的分离安装，同时能够提高加速度传感器的耐久性。 解决方案：在TFT基板1和相对基板5的相对平面上分别制备下电容电极2和相对的基板电容电极6，并在两个基板的周边制备密封胶7，密封 由密封剂7包围的空间，以便在两个基板之间具有预定间隔。 在压力传感器内部的TFT基板1的上表面上形成有加速度传感器3，其通过下电容电极2和相对基板电容电极6之间的电容变化来测量施加在基板上的压力。版权所有： （C）2007，JPO＆INPIT
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公开(公告)号：JP2005530159A
公开(公告)日：2005-10-06
申请号：JP2004513781
申请日：2003-06-13
发明人： マホン、ジェフリー、エル．
IPC分类号： G01P15/08 , G01P15/12 , G01P15/125 , G01P15/18 , H01L29/84
CPC分类号： G01P15/18 , G01P15/0802 , G01P15/123 , G01P15/125 , G01P2015/0828 , Y10T29/49002 , Y10T29/49004 , Y10T29/49005 , Y10T29/49007 , Y10T29/49126 , Y10T29/49156
摘要： モノリシックシリコン加速度センサーの製造方法が開示される。 当該モノリシックシリコン加速度センサーは、１またはそれ以上のセンサーセルが形成されるようにシリコンからマイクロマシン加工され、各センサーセルは、シリコン支持構造体に固定されたビーム部材により位置決めされた慣性質量を有する。 サンドイッチされたエッチング停止層は、第１シリコンウエハーセクションと第２シリコンウエハーセクションとの間に形成される。 ビーム部材と慣性質量の第１セクションは、サンドイッチ層の第１ウエハーセクションについて、エッチング停止層に達するまでＵ形溝および線条形溝をエッチングすることにより形成される。 慣性質量の第２セクションは、第２ウエハーセクションの枠形溝を、第１セクションのＵ形溝および線条形溝と整列させ、枠形溝をエッチング停止層に達するまでエッチングすることにより形成される。 露出したエッチング停止層を除去した後、シリコン支持構造体に固定されたビーム部材によって位置決めされた慣性質量が形成される。 第１カバープレート構造体は、シリコン支持構造体の第１表面に接合される。
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公开(公告)号：JP2005277365A
公开(公告)日：2005-10-06
申请号：JP2004160631
申请日：2004-05-31
申请人： Tokyo Electron Ltd , 東京エレクトロン株式会社
发明人： KAGAWA KENICHI , YAKABE MASAMI
IPC分类号： B81B3/00 , B81C1/00 , G01D5/24 , G01P15/08 , G01P15/125 , H01L21/301 , H01L29/84
CPC分类号： B81C1/00896 , G01P15/0802 , G01P15/125 , G01P2015/0828 , H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device, the element of which is diced without being contaminated with foreign substances such as chips. SOLUTION: The substrate of the semiconductor device is formed in a rectangular shape having four sides along the dicing lines, and a protruding bank 56 is formed thereon surrounding the total periphery of an actuator element 50 and input/output electrode pads. The protruding bank 56 has a rectangular shape having four sides, each of which continuously extends parallel to each side of the substrate. Since the adhesion of a protection tape 9 is strengthened by the protruding bank 56, sticking of the foreign substances 104 generated in the dicing to the actuator element 50 and the electrode pads is prevented. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译： 要解决的问题：提供半导体器件，其元件被切割而不被诸如芯片的异物污染。 解决方案：半导体器件的衬底形成为具有沿着切割线的四边的矩形形状，并且在其周围形成有围绕致动器元件50和输入/输出电极焊盘的总周边的突出堤坝56。 突出部56具有四边的矩形形状，每一侧均平行于基板的每一侧连续延伸。 由于保护带9的附着被突出堤56加强，因此防止了在切割中产生的异物104向致动器元件50和电极垫的粘附。 版权所有（C）2006，JPO＆NCIPI
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公开(公告)号：JP2005114394A
公开(公告)日：2005-04-28
申请号：JP2003345400
申请日：2003-10-03
发明人： NOZOE TOSHIYUKI
IPC分类号： G01C19/56 , G01C19/5614 , G01P15/125 , G01P21/00 , G01P9/04
CPC分类号： G01P15/18 , G01C19/5607 , G01C19/5614 , G01P15/125 , G01P21/00 , G01P2015/0828 , G01P2015/084
摘要： PROBLEM TO BE SOLVED: To realize an inertial sensor capable of actively diagnosing whether there are any abnormalities in the sensor itself, and to realize a composite sensor using the inertial sensor.
SOLUTION: The inertial sensor is provided with a self-diagnostic circuit 41 which delivers a diagnostic signal, that is, applies AC bias signal voltage on a node prior to a synchronous demodulator 24 in order to detect the abnormality in at least one of a sensing element 6 and a detecting circuit 27. Therefore, only by monitoring as to whether a predetermined DC offset signal can be obtained from a sensor output terminal 26 of the inertial sensor, the diagnosis whether there are any abnormalities in the sensor itself, can be carried out actively.
COPYRIGHT: (C)2005,JPO&NCIPI摘要翻译： 要解决的问题：实现能够主动诊断传感器本身是否存在异常的惯性传感器，并且实现使用惯性传感器的复合传感器。
解决方案：惯性传感器设置有自诊断电路41，其传送诊断信号，即，在同步解调器24之前的节点上施加AC偏置信号电压，以便检测至少一个 传感元件6和检测电路27.因此，只有通过监视从惯性传感器的传感器输出端子26是否可以获得预定的DC偏移信号，就可以诊断传感器本身是否有异常， 可以积极进行。 版权所有（C）2005，JPO＆NCIPI
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