公开(公告)号：JP2008107419A

公开(公告)日：2008-05-08

申请号：JP2006288010

申请日：2006-10-23

Applicant: Asahi Kasei Corp ,  Pi R & D Co Ltd ,  旭化成株式会社 ,  株式会社ピーアイ技術研究所

Inventor： GOSHIMA TOSHIYUKI ,  WIN MOOSOO ,  ARIHISA SHINJI ,  NAGASAWA TOSHIAKI ,  TAKAHASHI HIDEAKI

IPC: G03F7/023 ,  C08G73/10 ,  G03F7/004 ,  G03F7/075 ,  H05K3/28

Abstract: PROBLEM TO BE SOLVED: To provide a positive photosensitive resin composition which suppresses curl as a photosensitive dry film, has good adhesion to a circuit substrate and provides excellent developability and mechanical properties.
SOLUTION: The positive photosensitive resin composition contains at least an organic solvent-soluble polyimide having a hydroxyl group and/or a carboxyl group, a photoacid generator and a compound having a carbon-carbon double bond, wherein the photoacid generator is contained in a range of 1-100 parts by mass based on 100 parts by mass of the organic solvent-soluble polyimide and the compound having a carbon-carbon double bond is contained in a range of 1-100 parts by mass based on 100 parts by mass of the organic solvent-soluble polyimide.
COPYRIGHT: (C)2008,JPO&INPIT

Abstract translation: 要解决的问题：为了提供抑制作为感光性干膜的卷曲的正性感光性树脂组合物，对电路基板具有良好的粘附性，并提供优异的显影性和机械性能。 解决方案：正型感光性树脂组合物至少含有具有羟基和/或羧基的有机溶剂可溶性聚酰亚胺，光酸产生剂和具有碳 - 碳双键的化合物，其中含有光酸产生剂 相对于100质量份的有机溶剂可溶性聚酰亚胺和具有碳 - 碳双键的化合物，在1-100质量份的范围内，相对于100份 有机溶剂可溶性聚酰亚胺的质量。 版权所有（C）2008，JPO＆INPIT

公开(公告)号：JP4034403B2

公开(公告)日：2008-01-16

申请号：JP4094898

申请日：1998-01-16

Applicant: 株式会社ピーアイ技術研究所

Inventor： 正男 友井 ,  俊一 松本 ,  博 板谷 ,  孝雄 飯島

IPC: G03F7/004 ,  G03F7/023 ,  C08G73/10 ,  G03F7/022 ,  G03F7/037

公开(公告)号：JPWO2004035689A1

公开(公告)日：2006-02-16

申请号：JP2004544725

申请日：2003-02-28

Applicant: 株式会社ピーアイ技術研究所

Inventor： 板谷　博 ,  博 板谷

IPC: C08L79/08 ,  C08G73/10 ,  C08K5/00 ,  G03F7/004 ,  G03F7/023 ,  G03F7/037

CPC classification number: C08G73/1042 ,  C08G73/1021 ,  C08G73/1032 ,  C08L79/08

Abstract: PMDAと芳香族ジアミンよりなるポリイミドは、一般に溶媒に難溶である。これを溶剤可溶化させ、四成分系以上のブロック共重合体を製造する。PMDAと或る種の芳香族ジアミンとを1:2〜1.5モル比で反応させると溶剤可溶のオリゴマーを生成する。これに更に酸ジ無水物と芳香族ジアミンを加え、4成分以上の溶媒可溶ブロック共重合体が生成する。PMDAと共に添加する芳香族ジアミンのモル比は1:2〜1.5である。PMDAを含む多数の溶剤可溶のブロック共重合体が製造できる。二成分系触媒の存在下に、PMDA、BTDA、DATを含有する四成分以上のブロック共重合ポリイミドが遂次反応によって製造される。この結果、多数の原料が安価に入手できる各種のポリイミドの製造が可能となった。経済性のよい直接イミド化法を採用して、PMDA−BTDA−DATを含むポリイミドは高性能)、多量生産、低価格となり、今後、広く利用できる。

公开(公告)号：JP2005228984A

公开(公告)日：2005-08-25

申请号：JP2004037297

申请日：2004-02-13

Applicant: Mitsubishi Cable Ind Ltd ,  Pi R & D Co Ltd ,  三菱電線工業株式会社 ,  株式会社ピーアイ技術研究所

Inventor： WIN MOO SOO ,  NAKAJIMA SHINTARO ,  GOSHIMA TOSHIYUKI ,  FUJII MASANORI ,  MIYASHITA YOSHIJI

IPC: H01F27/32 ,  H01F5/06

Abstract: PROBLEM TO BE SOLVED: To provide an annular insulating board, having superior dielectric strength properties, heat-resistance properties, and processing resistance, and to provide a compact and lightweight coil having superior dielectric strength properties and heat-resisting properties.
SOLUTION: The annular insulating board has an insulating coating layer 5 provided at least on the surface of an annular flat board 3 of a conductor board 1, which has a planar cross section and includes the annular flat board 3 having an opening. The insulating layer 5 contains a siloxane bond in a principal chain and comprises an electrodeposited film of a block mixed polyamide having an anionic group in a molecule. The electrodeposited film of block mixed polyamide, which contains siloxane bond in a principal chain and has an anionic group in the molecule, has superior heat-resisting properties and dielectric strength properties, even if the film has a relatively small thickness. Consequently, a coil which is sufficiently reduced in both the size and the weight can be obtained, by stacking a plurality of the annular insulating boards.
COPYRIGHT: (C)2005,JPO&NCIPI

Abstract translation: 要解决的问题：提供具有优异的介电强度性能，耐热性能和耐加工性的环形绝缘板，并提供具有优异的介电强度性能和耐热性能的紧凑且轻便的线圈。 解决方案：环形绝缘板具有至少设置在导体板1的环形平板3的表面上的绝缘涂层5，其具有平面截面并且包括具有开口的环形平板3。 绝缘层5在主链中含有硅氧烷键，并且包含分子中具有阴离子基团的嵌段混合聚酰胺的电沉积膜。 在分子中含有阴离子性基团的含有硅氧烷键的嵌段混合聚酰胺的电沉积膜即使膜厚度相对较小，也具有优异的耐热性能和介电强度性能。 因此，通过堆叠多个环形绝缘板，可以获得在尺寸和重量上充分减小的线圈。 版权所有（C）2005，JPO＆NCIPI

公开(公告)号：JP2005120317A

公开(公告)日：2005-05-12

申请号：JP2003359676

申请日：2003-10-20

Applicant: Pi R & D Co Ltd ,  株式会社ピーアイ技術研究所

Inventor： ITAYA HIROSHI

IPC: C09J179/08

Abstract: PROBLEM TO BE SOLVED: To provide a new imide type adhesive composition, aiming to improve adhesiveness, and bringing improvement in heat resistance and low dielectric property. SOLUTION: This adhesive composition contains (1) a first imide oligomer having 3-aminobenzonitrile units at the both terminals, (2) a second imide oligomer having maleic anhydride units at the both terminals and (3) a cross-linking agent consisting of an oligomer having the maleic anhydride unit at one terminal and a diamine unit at another end or a mixture of components forming such oligomer. Since the adhesive composition exhibits an excellent adhesiveness, heat resistance and low dielectric property, it can be suitably used for a printed circuit substrate used for an electric or electronic materials, a sealing agent, an over-coating agent, etc. Also, it can be used as a structural material and a composite materials, by impregnating a glass fiber or Kevlar with the same. COPYRIGHT: (C)2005,JPO&NCIPI

Abstract translation: 要解决的问题：提供新的酰亚胺型粘合剂组合物，旨在提高粘合性，并且提高耐热性和低介电性能。 该粘合剂组合物含有（1）在两末端具有3-氨基苯甲腈单元的第一酰亚胺低聚物，（2）在两末端具有马来酸酐单元的第二酰亚胺低聚物和（3）交联剂 由一端具有马来酸酐单元的低聚物和另一端的二胺单元或形成这种低聚物的组分的混合物组成。 由于粘合剂组合物具有优异的粘合性，耐热性和低介电性，因此可以适用于电气或电子材料用的印刷电路基板，密封剂，过涂层剂等。另外，它可以 用作结构材料和复合材料，通过浸渍玻璃纤维或凯夫拉尔。 版权所有（C）2005，JPO＆NCIPI

公开(公告)号：JP2004266199A

公开(公告)日：2004-09-24

申请号：JP2003056962

申请日：2003-03-04

Applicant: National Institute Of Advanced Industrial & Technology ,  Pi R & D Co Ltd ,  株式会社ピーアイ技術研究所 ,  独立行政法人産業技術総合研究所

Inventor： AOYANAGI MASAHIRO ,  TOKORO KAZUHIKO ,  NAKAGAWA HIROSHI ,  KIKUCHI KATSUYA ,  ITAYA HIROSHI ,  SEGAWA SHIGEMASA

IPC: H01L21/3205 ,  H01L21/312 ,  H01L21/768

Abstract: PROBLEM TO BE SOLVED: To provide a forming method of a wiring in an integrated circuit chip or in a mounting system for mounting the chip, which enables the formation of an extremely thin film while controlling the thickness highly precisely for a large area.
SOLUTION: In a solution containing a solvent soluble organic material used as an insulating layer, a substrate with a metallic film formed in its surface is an anode and a cathode is disposed facing it, a dc voltage is applied between the anode and the cathode and an organic thin film is formed by depositing the organic material in a substrate surface of the anode. Then, a resist pattern is formed in a lithography process and a groove is formed by dry-etching the organic thin film using the pattern as an etching mask. Thereafter, a seed metallic layer is deposited in the groove and a wiring is formed by depositing a wiring metal on the seed metallic layer by a plating method.
COPYRIGHT: (C)2004,JPO&NCIPI

公开(公告)号：JP2004128437A

公开(公告)日：2004-04-22

申请号：JP2002375882

申请日：2002-12-26

Applicant: National Institute Of Advanced Industrial & Technology ,  Pi R & D Co Ltd ,  株式会社ピーアイ技術研究所 ,  独立行政法人産業技術総合研究所

Inventor： AOYANAGI MASAHIRO ,  NAKAGAWA HIROSHI ,  TOKORO KAZUHIKO ,  KIKUCHI KATSUYA ,  ITAYA HIROSHI ,  SEGAWA SHIGEMASA

IPC: H01L39/00 ,  H01L21/312 ,  H01L21/3205 ,  H01L21/768 ,  H01L23/52 ,  H01L23/522 ,  H01L27/18 ,  H01L39/22 ,  H01L39/24

CPC classification number: H01L39/223 ,  H01L27/18 ,  H01L39/2493

Abstract: PROBLEM TO BE SOLVED: To manufacture a superconducting tunnel junction element by using a material having excellent insulating characteristics and a low-dielectric-constant property for an interlayer insulating film.
SOLUTION: In a superconducting integrated circuit to be provided, a superconductor lower electrode, a tunnel barrier, and a superconductor upper electrode which is shaped to form a junction of fine geometry by etching are stacked in this sequence from the bottom, and a high-resolution photosensitive polyimide insulating layer having via holes of fine geometry is arranged thereon. By using the high-resolution photosensitive polyimide for an insulating film for the upper and the lower electrodes of the superconducting tunnel junction element, forming via holes in the insulating layer is accomplished only by a lithography process, and as compared to the insulating film formation using a vacuum process based on prior arts, a high cost is reduced and the process steps are greatly simplified.
COPYRIGHT: (C)2004,JPO

公开(公告)号：JP2003327907A

公开(公告)日：2003-11-19

申请号：JP2002131042

申请日：2002-05-07

Applicant: Pi R & D Co Ltd ,  株式会社ピーアイ技術研究所

Inventor： WIN MOO SOO ,  GOSHIMA TOSHIYUKI ,  KYO EIKA ,  ITAYA HIROSHI

IPC: C09D179/08 ,  C09D5/44 ,  C25D13/06

Abstract: PROBLEM TO BE SOLVED: To obtain a new composition for electrodeposition excellent in smoothness, heat resistance, chemical resistance and uniformity of a film thickness than conventional electrodeposited products. SOLUTION: The composition for electrodeposition comprises a blocked copolyimide resin composed of a reaction product of two or more kinds of diamine components containing at least one kind of aromatic diamine with two or more kinds of acid dianhydrides containing an aromatic tetracarboxylic acid, a polar solvent for dissolving the polyimide resin, an oil-soluble solvent in which the resin is soluble, an ion exchange water and an alcohol having a phenyl group, a furfuryl group or a naphthyl group. The composition comprises 30-60 wt.% water-soluble polar solvent, 10-30 wt.% oil-soluble solvent, 5-15 wt.% alcohols, 5-30 wt.% ion exchange water and 2-10 wt.% solid content composed of a basic nitrogen-containing compound for neutralizing an acid radical of the polyimide resin and 30-200 mol% (based on a theoretical neutralization amount) neutralized salt of the polyimide resin acid radical. COPYRIGHT: (C)2004,JPO

Abstract translation: 要解决的问题：为了获得与常规电沉积产品相比平滑度，耐热性，耐化学性和膜厚均匀性优异的电沉积组合物。 解决方案：电沉积用组合物包括由两种或更多种含有至少一种芳族二胺与二种或更多种含有芳族四羧酸的酸二酐的二胺组分的反应产物组成的封端共聚酰亚胺树脂， 用于溶解聚酰亚胺树脂的极性溶剂，可溶于树脂的油溶性溶剂，离子交换水和具有苯基，糠基或萘基的醇。 该组合物包含30-60重量％的水溶性极性溶剂，10-30重量％油溶性溶剂，5-15重量％醇，5-30重量％离子交换水和2-10重量％ 由用于中和聚酰亚胺树脂的酸基的碱性含氮化合物和30-200摩尔％（基于理论中和量）中和的由聚酰亚胺树脂酸基的中和盐构成的固体含量。 版权所有（C）2004，JPO

公开(公告)号：JP2003309121A

公开(公告)日：2003-10-31

申请号：JP2002112890

申请日：2002-04-16

Applicant: National Institute Of Advanced Industrial & Technology ,  Pi R & D Co Ltd ,  株式会社ピーアイ技術研究所 ,  独立行政法人産業技術総合研究所

Inventor： AOYANAGI MASAHIRO ,  NAKAGAWA HIROSHI ,  TOKORO KAZUHIKO ,  KIKUCHI KATSUYA ,  ITAYA HIROSHI ,  SEGAWA SHIGEMASA

IPC: H01L21/3205 ,  H01L21/768 ,  H01L23/12 ,  H01L23/52 ,  H01L23/522

Abstract: PROBLEM TO BE SOLVED: To provide a new multi-layer fine wiring structure concerning a manufacturing method of multi-layer wiring in a digital integrated circuit chip for high speed information processing and in a mounting system such as a package, a module and a board for mounting the chip, and to provide its manufacturing method.
SOLUTION: An impedance is controlled constant and a line suitable for digital high speed signal transmission can be obtained in a wide frequency band for obtaining the multi-layer fine wiring structure having a transmission line structure such as a strip line, a micro strip line and a coaxial line by using metals such as copper, silver, gold, aluminum, palladium and niobium as a wiring layer by using high resolution photosensitive polyimide as an insulating layer. Via hole processing to the insulating layer is attained by only a lithography process by using the photosensitive polyimide having high resolution characteristics as the insulating layer. A high density structure can be obtained as compared with a conventional multi-layer wiring technology by forming a metal wiring layer with a pattern by a lift-off method, and the process can be simplified remarkably.
COPYRIGHT: (C)2004,JPO

Abstract translation: 要解决的问题：为了提供一种关于用于高速信息处理的数字集成电路芯片中的多层布线的制造方法以及诸如封装，模块等的安装系统的新的多层精细布线结构 以及用于安装芯片的板，并提供其制造方法。 解决方案：阻抗控制恒定，可以在宽频带中获得适用于数字高速信号传输的线路，以获得具有传输线结构的多层精细布线结构，如带状线，微型 通过使用高分辨率光敏聚酰亚胺作为绝缘层，通过使用诸如铜，银，金，铝，钯和铌的金属作为布线层的带状线和同轴线。 通过使用具有高分辨率特性的光敏聚酰亚胺作为绝缘层，仅通过光刻工艺实现对绝缘层的通孔处理。 与传统的多层布线技术相比，通过用剥离法形成具有图案的金属布线层，可以获得高密度结构，并且可以显着地简化该工艺。 版权所有（C）2004，JPO

公开(公告)号：JP6649283B2

公开(公告)日：2020-02-19

申请号：JP2016573337

申请日：2016-02-01

Applicant: 株式会社ピーアイ技術研究所 ,  トップバッテリー・カンパニー・リミテッド ,  Top Battery Co., Ltd.

Inventor： 鈴木 鉄秋 ,  脇 周三 ,  ノ ファン ジン ,  ホン スン ジュン

IPC: H01M4/134 ,  H01M4/62