Abstract:
PURPOSE:To moderate ionic concentration on the central part of a substrate to enable a thin film uniform in thickness and quality to be formed, by making mesh electrodes be disposed facing to electron-drawing electrodes and on the central side of an ionization part. CONSTITUTION:In an ionization part, mesh electrodes 30 having the same potential as ionization filaments 9 are disposed facing to electrondrawing electrodes 10 and on the central side of the ionization part against the electron-drawing electrodes 10. Disposal of these mesh electrodes 30 allows no thermion is electron13 to exist near the center of the ionization part, eliminating cluster ions formed there. Hence, the amount of clusters concentrated on the central part of the substrate becomes small, so that a distribution of ions on the substrate can be uniformized to improve uniformity in thickness and quality of the formed thin film.
Abstract:
PURPOSE:To reduce the stress concentration onto fusion zone and to reduce the generation of cracks by forming a space part between two members and by forming a fusion zone adjacent this space part. CONSTITUTION:A plate 1 and foil 2 are joined with melting by forming a space part 8 between the plate 1 and foil 2 and by irradiating an electron beam 4 on a weld line 3. In this case, bottom part of the fusion zone 6 is formed in a groove 8 and the concentration of stress is extremely small with the joint shape having deep notch not exsisting. The possibility in the crack generation is thus eliminated even in case of the thermal contraction stress in the soldifying stage after welding and load being generated.
Abstract:
PURPOSE:To enable to form a homogeneous insulative thin film by providing electron generating means for emitting electrons to a thin film forming substrate to reduce a charge-up by ions of depositing ionized material in a vacuum tank. CONSTITUTION:Electrons 29 are generated in the state parallel to the generation of cluster ion beam 17, and emitted to the entire insulative thin film forming region on a substrate 18. To generate the electrons 29, a filament 26a is, for example, heated, and a voltage of approx. several tens - several hundreds V is applied between the filament 26a and an anode 26b, and when a voltage of several tens - 1,000V is applied between the electron drawing electrode 27 and the filament 26b, the electrons 29 are emitted to the entire film forming region on the substrate 18. The electrons 29 are simultaneously emitted into the film deposition, and preferably emitted in the quantity equal to or larger than the quantity of ions 16. Thus, it can prevent the film formed on the substrate 18 from charging up, thereby forming the thin film in the state that no discharge is generated.
Abstract:
PURPOSE:To obtain an ion implantation apparatus capable of forming a thick ion implanted layer even if performing simultaneously the ion implantation and a thin film formation for base material provided in a vacuum vessel by providing an ion implantation means and a vapor deposition means for forming the thin film on the surface of the base material. CONSTITUTION:In the inside of a vacuum vessel 1 which is reduced till the prescribed degree of vacuum, ion implantation is performed on the base material 15 by an ion implantation means 100 and simultaneously the surface of the base material 15 is vapor-deposited with a cluster ion beam-vapor depositing apparatus 17. Namely, by combinating the ion implantation with the vapor deposition by the cluster ion beam, the diffusing effect of the ion implantation on the base material 15 and the increment of the density due to the ion implantation are simultaneously advanced and the vapor-deposited layer can be continuously formed. Therefore, the thick ion implanted layer is substantially obtained. Further, when the same substance as the base material 15 is used as the vapor depositing substance 19, the ion implanted layer of same quality is obtained. When the substance different from the base material 15 is used, the ion implanted layer of the base material 15, the ion implanted layer mixed with the base material and vapor depositing substance around the boundary of the vapor deposited layer of the base material 15 and also the ion implanted layer of the vapor deposited layer are continuously formed respectively.
Abstract:
PURPOSE:To separate current caused by stray capacity and accurately measure output current by installing a resistance used to measure output current in a high potential part and transmitting its detected current to a low potential through a transmission circuit containing optical fiber. CONSTITUTION:Voltage from a low voltage power source is boosted, rectified, and smoothed and beam accelerating voltage is supplied to a charged beam device 20, and output voltage is divided with a voltage divider 7 and introduced from a measuring terminal 9. Output current is detected with a resistance 8 and detected value is modulated with a V/F converter 31 and converted to photo signal with an LED32 and transmitted through an optical fiber 33, and introduced from a current measuring terminal 10 through a photo transistor 34 and an F/V converter 35. Since output current is directly measured on the high potential side, overlapping of current flowing through a stray capacity 11 to output current is prevented and accurate measurement is provided.
Abstract:
PURPOSE:To make a device small-sized and perform a stable control by using an insulated transformer to feed a high potential portion accelerating an electron beam and controlling a beam control system with a negative-feedback circuit including a light emitting element, an optical transmission path and a photosensing element. CONSTITUTION:A main power supply 1 is stepped up 1, rectified 3 and applied to a cathode 27. An auxiliary power supply 50 is fed to a filament 9, a bombard power supply 14 and a bias power supply 25 through an insulated transformer 51. An electron beam 30 machines a work 31 and the current value of the beam 30 is detected by a resistor 15. The detected value is compared with the output of a current setter 16 and fed to a PIP regulator 18. The output of the regulator 18 is converted into a light signal by a light emitting diode 52 and fed to a photosensing transistor 54 through an optical fiber cable 53 to be converted into an electric signal. An amplified 55 output is fed to a power transistor 56 to control the input voltage of a transformer 58, and a rectified 23 output is applied across the cathode 27 and a Wehnelt electrode 28. Accordingly, the device can be made small-sized and perform a stable control.
Abstract:
PURPOSE:To increase the maximum beam current obtained from an electron gun, by connecting the voltage having the polarity opposite to a bias power source, to the bias power supply in series and by erasing the self-bias voltage. CONSTITUTION:A bias voltage generating part 31 and a self-bias erasing voltage generating part 32 are of mutually opposite polarity and connected in series to each other. In this power supply device, the output voltage of said voltage generating part 32 is erased by raising highly enough the output voltage of said voltage generating part 31 in order to obtain a high bias voltage. On the other hand, when the output voltage of the voltage generating part 31 is lowered and the bias voltage is forced to approach 0V, self vias current (i) is generated as shown in the figure, then a self-bias voltage is generated across a discharge resistance 33a; however the voltage generating part 32 of opposite polarity is connected in series to said discharge resistance 33a, so that a bias voltage is not generated across a load resistance 25. Consequently, compared with the case where the self-bias erasing voltage generating part 32 is not used, a maximum electron beam current which is about 30% larger than that of said case can be obtained by using the same electron gun.
Abstract:
PURPOSE:To enable titled detection using a relatively simple apparatus even when welding is in progress, by providing a radiation passage that gives unobstructed view of a part near the deepest part of penetration of an object to be welded from outside, and detecting radioactive rays generated from the weld zone through the radiation passage. CONSTITUTION:When an electron beam 6 is irradiated to an object 1 to be welded, X-rays are generated from irradiated part or light is generated from molten part. Accordingly, when a radiation passage 16 that gives an unobstructed view of a part near the deepest part 15 of penetration in the weld zone 1 from outside is provided by piercing the weld zone, light or radioactive rays such as X-rays leak to outside from the passage 16. By detecting the radioactive rays 17 with a detecting element 18, a confirmation signal 19 that indicates that the depth of penetration is deeper than the position of the passage 16 can be obtained.
Abstract:
PURPOSE:To improve the accuracy of positions, by outputting the error signal for the weld line of the N-th cycle and processing the signal of the (N+1)th cycle after a computer for signal processing detects the weld line of the (N+1)th cycle. CONSTITUTION:Upon ending of the (N-1)th welding D E, in order to detect the weld line near M necessary for the (N+1)th welding L M, the irradiation point of an electron beam moves to F. F G is the detection period for the (N+1)th weld line, and upon ending of the detection of the weld line, the irradiation point of the electron beam moves to H (the same point as E). The N-th welding H I wherein the errors of the weld line are corrected by the operated result of the N-th weld line calculated during the (N-1)th welding D E is accomplished. Since the conditions for the N-th welding H I are outputted at the irradiation point H, the results of the (N+1)th weld line detected previously are operated during the N-th welding H I.