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    Adhesive for floor board
    41.
    发明专利
    Adhesive for floor board 审中-公开
    胶布板

    公开(公告)号：JP2006176727A

    公开(公告)日：2006-07-06

    申请号：JP2004373936

    申请日：2004-12-24

    Applicant: Nooteepu Kogyo Kk ,  Takiron Co Ltd ,  タキロン株式会社 ,  ノーテープ工業株式会社

    Inventor： YAMAZAKI FUMITAKA ,  IGAKI FUMIHIRO

    IPC: C09J121/00 ,  C09J109/00 ,  C09J123/22 ,  C09J125/10 ,  C09J153/02 ,  C09J175/00

    Abstract: PROBLEM TO BE SOLVED: To provide a one-liquid type adhesive for a floor board excellent in workability, wherein peeling-off of a synthetic resin material for a floor board can easily be conducted with a simple procedure without giving damage to the material and a subfloor and thus the peeling-off material itself can be recycled.
    SOLUTION: The adhesive comprises 100 pts.wt. of a composition containing 20-70 wt% of a rubbery polymer containing no functional group reactive with an isocyanate group and 80-30 wt% of a sticking resin forming no network structure by reacting with an isocyanate group, and 6-30 pts.wt. of an isocyanate compound.
    COPYRIGHT: (C)2006,JPO&NCIPI

    Abstract translation: 解决的问题：为了提供一种用于地板的单液型粘合剂，其加工性优异，其中用于地板的合成树脂材料的剥离可以简单地进行，而不会损害 材料和底层地板，因此剥离材料本身可以被再循环。 解决方案：粘合剂包含100重量份 的含有20-70重量％的不含与异氰酸酯基反应的官能团的橡胶状聚合物和80-30重量％不与异氰酸酯基反应形成网络结构的粘着树脂的组合物和6-30重量份 。 的异氰酸酯化合物。 版权所有（C）2006，JPO＆NCIPI

    Heat-resistant and moisture-resistant adhesive and adhesive sheet
    42.
    发明专利
    Heat-resistant and moisture-resistant adhesive and adhesive sheet 审中-公开
    耐高温和耐水粘胶和粘合片

    公开(公告)号：JP2006036843A

    公开(公告)日：2006-02-09

    申请号：JP2004215819

    申请日：2004-07-23

    Applicant: Diatex Co Ltd ,  ダイヤテックス株式会社

    Inventor： YOSHIOKA TAKASHI ,  KAINUMA HITOSHI

    IPC: C09J133/00 ,  C09J7/02 ,  C09J11/00 ,  C09J163/00 ,  C09J175/00

    Abstract: PROBLEM TO BE SOLVED: To provide an adhesive hardly deteriorated in high-humidity atmosphere at high temperature, and having excellent durability; and to provide an adhesive sheet utilizing the adhesive. SOLUTION: The heat-resistant and moisture-resistant adhesive is obtained by adding (B) a polyfunctional crosslinking agent in an amount exceeding the equivalent to the functional groups contained in (A) an acrylic copolymer to the acrylic copolymer (A) obtained by copolymerizing (a) an acrylic monomer providing a homopolymer having ≤-20°C glass transition temperature when polymerized, with (b) a functional monomer having a radically polymerizable unsaturated group and a functional group and optionally (c) a comonomer except the acrylic monomer (a) and the functional monomer (b), and having ≤-10°C glass transition temperature and 100,000-2,000,000 weight average molecular weight, to cross-link the acrylic copolymer (A). COPYRIGHT: (C)2006,JPO&NCIPI

    Abstract translation: 要解决的问题：提供在高温下在高湿度气氛中几乎不劣化的粘合剂，并且具有优异的耐久性; 并提供利用粘合剂的粘合片。 解决方案：通过将（B）与丙烯酸共聚物（A）中的（A）中包含的官能团相当的量的多官能交联剂（B）加入到耐热和耐湿粘合剂中， 通过（a）聚合时提供具有≤-20℃玻璃化转变温度的均聚物的丙烯酸类单体与（b）具有自由基聚合性不饱和基团和官能团的官能单体和任选地（c）除 丙烯酸类单体（a）和官能单体（b），并且具有≤-10℃玻璃化转变温度和100,000-2,000,000重均分子量，以交联丙烯酸共聚物（A）。 版权所有（C）2006，JPO＆NCIPI

    Hot melt film adhesive and a method of manufacturing the same
    43.
    发明专利
    Hot melt film adhesive and a method of manufacturing the same 失效

    公开(公告)号：JP3703902B2

    公开(公告)日：2005-10-05

    申请号：JP6506396

    申请日：1996-02-16

    Applicant: 日本ミラクトラン株式会社

    Inventor： 護 小山内 ,  眞人 石原

    IPC: C09J7/00 ,  C08G18/42 ,  C08G18/65 ,  C08G18/66 ,  C09J175/00 ,  C09J175/04

    CPC classification number: C08G18/4202 ,  C08G18/664 ,  C08G2170/20

    Abstract: PROBLEM TO BE SOLVED: To obtain the subject adhesive not yellowed and excellent in low temperature flexibility by partially introducing methyl group side chains into the molecular structure of a thermoplastic polyurethane resin produced from a single aliphatic diisocyanate. SOLUTION: This composition comprising (A) an aliphatic diisocyanate, (B) a polymer diol and (C) a chain extender wherein at least one of the components contains one or more methyl side chains in the molecule is reacted with each other in a solvent-free state, and the obtained thermoplastic polyurethane resin having a hardness (JIS-A hardness) of 65-90 degree and a flow- starting temperature of 80-150 deg.C is hot-formed into a film. The component A is preferably a 4-13C aliphatic diisocyanate, and the component B is preferably a polymer diol having repeating units having methyl side chains. The component C includes ethylene glycol, diethylene glycol and propylene glycol.

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