公开(公告)号：JP2009282513A

公开(公告)日：2009-12-03

申请号：JP2009105447

申请日：2009-04-23

Applicant: Asahi Kasei E-Materials Corp ,  Pi R & D Co Ltd ,  旭化成イーマテリアルズ株式会社 ,  株式会社ピーアイ技術研究所

Inventor： KIDA YUSUKE ,  SEO WIN MAW ,  GOTO TOSHIYUKI

IPC: G03F7/023 ,  C08G73/10 ,  G03F7/004 ,  G03F7/075 ,  G03F7/40

Abstract: PROBLEM TO BE SOLVED: To provide a photosensitive resin composition having high plating resistance when a photosensitive film is formed, and to provide the photosensitive film using the composition.
SOLUTION: The photosensitive resin composition contains (A) 100 parts by mass of an alkali soluble resin, and(B) 1 to 50 parts by mass of a photosensitive agent having a quinone diazide structure. The elastic modulus and the adhesion strength of the composition after heat treatment satisfy an expression (a):Y≥0.0004X, wherein Y represents an adhesion strength (N/mm) and X represents an elastic modulus (MPa) after the heat treatment.
COPYRIGHT: (C)2010,JPO&INPIT

Abstract translation: 要解决的问题：提供当形成感光膜时具有高电镀电阻的感光性树脂组合物，并使用该组合物提供感光膜。 解决方案：感光性树脂组合物含有（A）100质量份碱溶性树脂，（B）1〜50质量份具有醌二叠氮化物结构的感光剂。 热处理后的组合物的弹性模量和粘合强度满足式（a）：Y≥0.0004X，其中Y表示粘合强度（N / mm），X表示热处理后的弹性模量（MPa）。 版权所有（C）2010，JPO＆INPIT

公开(公告)号：JP2009251344A

公开(公告)日：2009-10-29

申请号：JP2008100147

申请日：2008-04-08

Applicant: Asahi Kasei E-Materials Corp ,  Pi R & D Co Ltd ,  旭化成イーマテリアルズ株式会社 ,  株式会社ピーアイ技術研究所

Inventor： SHIMIZU KENJU ,  NAGASAWA TOSHIAKI ,  TAKAHASHI HIDEAKI ,  SEO WIN MAW ,  GOTO TOSHIYUKI

IPC: G03F7/023 ,  C08G73/10 ,  G03F7/004 ,  G03F7/40 ,  H05K3/28

Abstract: PROBLEM TO BE SOLVED: To provide a photosensitive ink which is excellent in developability and avoids warpage after curing and has flame retardancy, and a printed wiring board using the same. SOLUTION: When the photosensitive ink is applied to one surface of a polyimide film (thickness: 25 μm) such that a cured film has a thickness of 20±2 μm, the applied ink is baked in air at 120°C for 60 min and further baked at 180°C for 60 min to obtain a two-layer film including a cured film on one surface of the polyimide film, and the two-layer film is cut to dimensions of 5×5 cm, warpage of ends is ≤10 mm. When the photosensitive ink is applied to the other surface of the polyimide film opposite to the surface on which the cured film has been disposed by using the two-layer film such that a cured film has a thickness of 20±2 μm, and the applied ink is baked in air at 120°C for 60 min and further baked at 180°C for 60 min to obtain a three-layer film, the three-layer film shows VTM-0 in a flame retardancy test. COPYRIGHT: (C)2010,JPO&INPIT

Abstract translation: 要解决的问题：提供显影性优异并且防止固化后具有阻燃性的翘曲的感光性油墨和使用其的印刷线路板。 解决方案：当将感光油墨施加到聚酰亚胺膜（厚度：25μm）的一个表面上，使得固化膜的厚度为20±2μm时，将所施加的油墨在空气中在120℃下烘烤， 60分钟，进一步在180℃下烘烤60分钟，得到在聚酰亚胺膜的一个表面上具有固化膜的双层膜，将两层膜切断成5×5cm的尺寸， ≤10mm。 当通过使用两层膜使得固化膜具有20±2μm的厚度将感光墨施加到与已经设置了固化膜的表面相对的另一个表面上时， 油墨在空气中在120℃下烘烤60分钟，并进一步在180℃烘烤60分钟，得到三层薄膜，三层膜在阻燃性试验中显示VTM-0。 版权所有（C）2010，JPO＆INPIT

公开(公告)号：JP2009204767A

公开(公告)日：2009-09-10

申请号：JP2008045571

申请日：2008-02-27

Applicant: Asahi Kasei E-Materials Corp ,  Pi R & D Co Ltd ,  旭化成イーマテリアルズ株式会社 ,  株式会社ピーアイ技術研究所

Inventor： TADA MIZUHO ,  SHIMIZU KENJU

IPC: G03F7/023 ,  C08K5/13 ,  C08K5/28 ,  C08K5/521 ,  C08L79/08 ,  G03F7/004 ,  G03F7/075 ,  H05K3/28

Abstract: PROBLEM TO BE SOLVED: To provide a positive photosensitive resin composition which exhibits a high residual film ratio and excellent residue removability in dry film shape, and a photosensitive film comprising the photosensitive resin composition. SOLUTION: The photosensitive resin composition comprises (A) an alkali-soluble polyimide containing ≥10 wt.% of a siloxane structure, (B) a photosensitive agent having a quinonediazide structure, and (C) a compound having an acid dissociation constant (pKa) at 25°C of 6-14. COPYRIGHT: (C)2009,JPO&INPIT

Abstract translation: 要解决的问题：提供一种正面感光性树脂组合物，其具有高的残留膜比和优异的干膜形状的残留物去除性，以及包含感光性树脂组合物的感光性膜。 解决方案：感光性树脂组合物包含（A）含有≥10重量％的硅氧烷结构的碱溶性聚酰亚胺，（B）具有醌二叠氮化物结构的感光剂，（C）具有酸解离的化合物 25℃时的常数（pKa）为6-14。 版权所有（C）2009，JPO＆INPIT

公开(公告)号：JP2009155640A

公开(公告)日：2009-07-16

申请号：JP2008309981

申请日：2008-12-04

Applicant: Asahi Kasei E-Materials Corp ,  Pi R & D Co Ltd ,  旭化成イーマテリアルズ株式会社 ,  株式会社ピーアイ技術研究所

Inventor： SASAYAMA MASAAKI ,  WAKI SHUZO

IPC: C08G73/10 ,  C09J179/08 ,  H05K1/03 ,  H05K3/00

Abstract: PROBLEM TO BE SOLVED: To provide an adhesive polyimide excellent in storage stability and soldering heat resistance during moisture absorption, and housing a low hygroscopic expansion coefficient.
SOLUTION: The adhesive polyimide is an adhesive polyimide comprising a solvent soluble block polyimide compound containing an oligomer of an imide compound, an aromatic diamine and a tetracarboxylic acid dianhydride as components, wherein the oligomer of the imide compound contains a bicyclo[2,2,2]oct-7-ene-2,3,5,6-tetracarboxylic acid dianhydride (A) and 3,5-diamino benzoic acid (B) as components, and the amount of component (B) is less than 9.9 wt.% based on the total amount of diamine and tetracarboxylic acid dianhydride, and has at least 80,000 of a weight average molecular weight.
COPYRIGHT: (C)2009,JPO&INPIT

Abstract translation: 要解决的问题：提供一种在吸湿期间储存稳定性和焊接耐热性优异的粘合剂聚酰亚胺，并且具有低吸湿膨胀系数。 粘合性聚酰亚胺是包含含有酰亚胺化合物的低聚物，芳香族二胺和四羧酸二酐作为成分的溶剂可溶性嵌段聚酰亚胺化合物的粘合性聚酰亚胺，其中酰亚胺化合物的低聚物含有双环[2 ，2,2]辛-7-烯-2,3,5,6-四羧酸二酐（A）和3,5-二氨基苯甲酸（B）作为组分，组分（B）的量小于 基于二胺和四羧酸二酐的总量为9.9重量％，并且具有至少80,000重均分子量。 版权所有（C）2009，JPO＆INPIT

公开(公告)号：JP4204352B2

公开(公告)日：2009-01-07

申请号：JP2003056962

申请日：2003-03-04

Applicant: 株式会社ピーアイ技術研究所 ,  独立行政法人産業技術総合研究所

Inventor： 博 仲川 ,  和彦 所 ,  博 板谷 ,  繁昌 瀬川 ,  克弥 菊地 ,  昌宏 青柳

IPC: H01L21/3205 ,  H01L21/312 ,  H01L21/768

公开(公告)号：JP2008276174A

公开(公告)日：2008-11-13

申请号：JP2007301004

申请日：2007-11-20

Applicant: Asahi Kasei Corp ,  Pi R & D Co Ltd ,  旭化成株式会社 ,  株式会社ピーアイ技術研究所

Inventor： SHIMIZU KENJU ,  SEO WIN MAW ,  GOSHIMA TOSHIYUKI

IPC: G03F7/004 ,  C08K5/42 ,  C08K5/521 ,  C08L79/08 ,  G03F7/023 ,  H05K3/28

Abstract: PROBLEM TO BE SOLVED: To provide a positive photosensitive resin composition which can be pressure-bonded to a substrate or the like, has flame retardancy and reduces warpage in dry film formation, and a photosensitive film comprising the photosensitive resin composition. SOLUTION: The photosensitive resin composition comprises (A) a polyimide, (B) a light-sensitive material and (C) a phosphoric ester compound. COPYRIGHT: (C)2009,JPO&INPIT

Abstract translation: 要解决的问题：为了提供一种能够对基材等进行压力粘合的正型感光性树脂组合物，具有阻燃性，并且减少干膜形成中的翘曲，以及包含感光性树脂组合物的感光性膜。 光敏树脂组合物包含（A）聚酰亚胺，（B）感光材料和（C）磷酸酯化合物。 版权所有（C）2009，JPO＆INPIT

公开(公告)号：JP4171777B2

公开(公告)日：2008-10-29

申请号：JP18946999

申请日：1999-05-31

Applicant: 株式会社ピーアイ技術研究所 ,  独立行政法人産業技術総合研究所

Inventor： 統徳 坂本 ,  俊一 松本 ,  博 板谷 ,  太郎 板谷

IPC: G03F7/023 ,  G03F7/037 ,  C08L79/08 ,  G03F7/027

公开(公告)号：JP4154478B2

公开(公告)日：2008-09-24

申请号：JP2002042756

申请日：2002-02-20

Applicant: 株式会社ピーアイ技術研究所 ,  独立行政法人産業技術総合研究所

Inventor： 博 仲川 ,  和彦 所 ,  博 板谷 ,  繁昌 瀬川 ,  克弥 菊地 ,  殷實 鄭 ,  昌宏 青柳

IPC: G03F7/027 ,  H01L21/3205 ,  G03F7/037 ,  H01L23/52 ,  H01L25/065 ,  H01L25/07 ,  H01L25/18

CPC classification number: H01L21/76898 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2924/15311

Abstract: PROBLEM TO BE SOLVED: To provide a method for forming an electrode penetrating an integrated circuit chip from the surface to the rear surface in order to mount three or more integrated circuit chips directly on a circuit board while stacking. SOLUTION: A thin conductive semiconductor substrate is bored by etching and a photosensitive polyimide insulation film is deposited thereon by rotary coating. A pattern of holes of smaller diameter is then formed by exposure and development, the through hole is filled with a metallic material, and the rear surface of the substrate is ground to expose the metal thus forming a through electrode. The inventive through electrode has such a structure as a polyimide insulation layer is formed on the side face of a through hole made through a substrate of ground potential and the center of the hole is filled with a metallic material. Since a coaxial line structure is attained, a wide range characteristic impedance can be realized by controlling the thickness of the polyimide insulation film on the side face of the hole. COPYRIGHT: (C)2003,JPO

公开(公告)号：JP2008202108A

公开(公告)日：2008-09-04

申请号：JP2007040627

申请日：2007-02-21

Applicant: National Institute Of Advanced Industrial & Technology ,  Pi R & D Co Ltd ,  株式会社ピーアイ技術研究所 ,  独立行政法人産業技術総合研究所

Inventor： YOKOSHIMA TOKIHIKO ,  NAKAGAWA HIROSHI ,  AOYANAGI MASAHIRO ,  GOSHIMA TOSHIYUKI ,  NAKAJIMA SHINTARO ,  SEGAWA SHIGEMASA

IPC: C25D13/06 ,  B32B15/088 ,  C23C28/00 ,  C25D13/00 ,  C25D13/20

Abstract: PROBLEM TO BE SOLVED: To provide a Cu-Ni-organic electrodeposition thin film laminated structure deposited by film-depositing an organic electrodeposition thin film such as an electrodeposition polyimide thin film having excellent adhesiveness on a Cu base material and a method of depositing the same.
SOLUTION: The Cu-Ni-organic electrodeposition thin film laminated structure is deposited by film-depositing the organic electrodeposition thin film through a Ni layer having ≥5 nm and

Abstract translation: 要解决的问题：提供通过对Cu基材料具有优异的粘合性的电沉积聚酰亚胺薄膜等有机电沉积薄膜进行成膜而沉积的Cu-Ni-有机电沉积薄膜层压结构体，以及 存放相同。 解决方案：通过在Cu基材上通过在≥5nm和<1μm厚度的Ni层上沉积有机电沉积薄膜来沉积Cu-Ni-有机电沉积薄膜层压结构。 沉积Cu-Ni-有机电沉积薄膜叠层结构的方法包括：在Cu基材上沉积厚度≥5nm和<1μm厚度的Ni层，使Ni层与阴离子材料电沉积溶液接触并电沉积 使用其上形成有Ni层的Cu基材作为阳极，在Ni层上使用阴离子材料。 版权所有（C）2008，JPO＆INPIT

公开(公告)号：JP3911209B2

公开(公告)日：2007-05-09

申请号：JP2002203373

申请日：2002-07-12

Applicant: 株式会社ピーアイ技術研究所 ,  独立行政法人産業技術総合研究所

Inventor： 博 仲川 ,  和彦 所 ,  博 板谷 ,  繁昌 瀬川 ,  克弥 菊地 ,  殷實 鄭 ,  昌宏 青柳

IPC: H01L21/312 ,  H01L21/768 ,  H01L23/12 ,  H01L23/522