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    Method of loading and cutting glass sheet on cutting table
    61.
    发明专利
    Method of loading and cutting glass sheet on cutting table 审中-公开
    加工和切割切割玻璃板的方法

    公开(公告)号：JP2006008507A

    公开(公告)日：2006-01-12

    申请号：JP2005166781

    申请日：2005-06-07

    Applicant: Z Bavelloni Spa ,  ジ・バヴェロニ・ソシエタ・ペル・アチオニZ.Bavelloni S.P.A.

    Inventor： FRANCO BAVELLONI

    IPC: C03B33/03 ,  B28D7/04 ,  B65G49/06 ,  C03B33/027

    CPC classification number: C03B33/03 ,  B65G49/067 ,  B65G49/068 ,  B65G2249/04 ,  C03B33/027 ,  Y10T83/0333 ,  Y10T83/04 ,  Y10T83/6667 ,  Y10T225/321

    Abstract: PROBLEM TO BE SOLVED: To provide a method of loading and cutting a glass sheet by which idle time is decreased and to provide a cutting table. SOLUTION: In the method of loading and cutting the glass sheet on a cutting table, ruled line is provided on the sheet 4 by a ruling head 5. In the ruling process, a pickup arm 11 with a sucking device is drawn from the lower side of the sheet 4 to be worked and inclined to mount the sucking device 12 on the vertically arranged sheet 4 to be picked up to pick up the sheet 4. The picked up sheet 4 is started to be inclined toward the cutting table 1 on which the sheet 4 exists and after the ruled sheet 4 is moved from the table 1, the ruling head 5 is positioned beyond a sheet supporting zone to be in the opposite side to a pickup zone and the sheet 4 is mounted on the cutting table 1. COPYRIGHT: (C)2006,JPO&NCIPI

    Abstract translation: 解决的问题：提供一种加载和切割空闲时间减少的玻璃板并提供切割台的方法。 解决方案：在将玻璃板加载和切割在切割台上的方法中，通过刻线头5在片材4上设置划线。在规定过程中，从具有吸入装置的拾取臂11被抽出 要被加工并倾斜的片材4的下侧将吸附装置12安装在垂直布置的片材4上，以拾取片材4.拾取片材4开始朝向切割台1倾斜 片材4在其上存在，并且在刻版纸4从工作台1移动之后，刻印头5定位在片材支撑区域之外，以与拾取区域相对，并且片材4安装在切割台 1.版权所有（C）2006，JPO＆NCIPI

    Laser beam machining method and device
    62.
    发明专利
    Laser beam machining method and device 审中-公开
    激光束加工方法和装置

    公开(公告)号：JP2005028423A

    公开(公告)日：2005-02-03

    申请号：JP2003272483

    申请日：2003-07-09

    Applicant: Disco Abrasive Syst Ltd ,  株式会社ディスコ

    Inventor： SHIGEMATSU KOICHI ,  NAGAI YUSUKE

    IPC: B23K26/00 ,  B23K26/04 ,  B23K26/08 ,  B23K26/40 ,  B23K101/40 ,  H01L21/00 ,  H01L21/301

    CPC classification number: H01L21/67092 ,  B23K26/0057 ,  B23K26/0063 ,  B23K26/048 ,  B23K26/0853 ,  B23K2201/40 ,  Y10T225/12 ,  Y10T225/321

    Abstract: PROBLEM TO BE SOLVED: To provide a laser beam machining method and device by which an alteration layer can be formed at a desired position in a plate even in the presence of variance in the thickness of the plate. SOLUTION: The laser beam machining method is such method that a plate formed with a lattice like intended dividing lines (lines) on the surface is held on a chuck table, and that the plate so held on the chuck table is irradiated with a transmissible laser beam along these lines to form an alteration layer along the lines inside the plate. The method includes a process for detecting a height position of the surface to be irradiated with the laser beam along the lines of the plate held on the chuck table, and a process for emitting the laser beam along the lines while the focal position of the laser beam is controlled corresponding to the height position detected by the detecting process. COPYRIGHT: (C)2005,JPO&NCIPI

    Abstract translation: 解决的问题：提供一种激光束加工方法和装置，通过该激光束加工方法和装置，即使在板的厚度变化的情况下也可以在板的期望位置形成改变层。 ＆lt;解决方案＆gt;解决方案：激光束加工方法是将形成有表面上的预定分割线（线）的格子的板保持在卡盘台上，并且将如此保持在卡盘台上的板照射 沿着这些线的透射激光束，沿着板内的线形成改变层。 该方法包括用于检测沿着保持在卡盘台上的板条的激光束被照射的表面的高度位置的处理，以及用于沿激光束发射激光束的过程，同时激光的焦点位置 对应于由检测过程检测到的高度位置控制光束。 版权所有（C）2005，JPO＆NCIPI

    Optical fiber cutter
    66.
    发明专利
    Optical fiber cutter 有权

    公开(公告)号：JP5217011B2

    公开(公告)日：2013-06-19

    申请号：JP2011059593

    申请日：2011-03-17

    Applicant: Seiオプティフロンティア株式会社

    Inventor： 昌弘 長谷川 ,  弘康 豊岡 ,  弘志 中村

    IPC: G02B6/00

    CPC classification number: G02B6/25 ,  B26D3/08 ,  B26D7/2635 ,  Y10S83/955 ,  Y10T83/0393 ,  Y10T225/321

    Abstract: A slider is attached to a cutter main body of an optical fiber cutter in a forward/backward movable state. A round blade member for making a scratch in an optical fiber is attached to the slider in a rotatable state. An operation lever pin for changing over rotation operation modes from one to another is attached to one end side of a pin member which penetrates a wall of the cutter main body. The rotation operation modes include a non-rotation mode for preventing the round blade member from being rotated and a continuous rotation mode for rotating the round blade member by a predetermined angle with every backward movement of the slider.

    Optical fiber cutting device
    67.
    发明专利
    Optical fiber cutting device 审中-公开
    光纤切割设备

    公开(公告)号：JP2012237850A

    公开(公告)日：2012-12-06

    申请号：JP2011106250

    申请日：2011-05-11

    Applicant: Fujitsu Telecom Networks Ltd ,  富士通テレコムネットワークス株式会社

    Inventor： AOKI FUMIO

    IPC: G02B6/00 ,  G02B6/255

    CPC classification number: G02B6/25 ,  Y10T225/321

    Abstract: PROBLEM TO BE SOLVED: To provide an optical fiber cutting device capable of applying a tensile stress and a flexural stress to a glass core wire evenly on right and left sides when cutting an optical fiber by pressing a top face of the glass core wire corresponding to a start point scratch with a pad.SOLUTION: An optical fiber cutting device comprises: a fiber holding part that holds a coating part of an optical fiber to be cut; a fiber holding part that is arranged apart from the fiber holding part with a predetermined interval and holds a glass core wire part of the optical fiber with the coating removed; a round blade unit including a round blade that puts a start point scratch on a bottom face of the optical fiber glass core wire held by the fiber holding parts; and a pad that presses a top face of the glass core wire corresponding to the start point scratch from above, applying a tensile stress and a flexural stress to the glass core wire. In the pad, at least an end surface that presses the glass core wire is made of a hard material, is formed in R-shape along a shaft direction of the glass core wire, and is processed to have a smooth surface.

    Abstract translation: 解决的问题：提供一种能够通过按压玻璃芯的顶面来切割光纤时能够在左右两侧均匀地对玻璃芯线施加拉伸应力和弯曲应力的光纤切断装置 线对应于起始点划线与焊盘。 解决方案：一种光纤切割装置，包括：保持要切割的光纤的涂覆部分的光纤保持部; 纤维保持部，其以规定的间隔与纤维保持部分隔开，并且保持除去了涂层的光纤的玻璃芯线部分; 包括圆形刀片的​​圆刀刀片单元，其在由所述纤维保持部件保持的所述光纤玻璃芯线的底面上开始划痕; 以及衬垫，其对应于起始点刮擦的玻璃芯线的顶面从上方施加拉伸应力和弯曲应力到玻璃芯线。 在该垫中，至少压入玻璃芯线的端面由硬质材料构成，沿着玻璃芯线的轴方向形成为R字状，并且被加工成具有光滑的表面。 版权所有（C）2013，JPO＆INPIT

    Wafer dicing press apparatus and semiconductor wafer dicing system using wafer dicing press apparatus
    70.
    发明专利
    Wafer dicing press apparatus and semiconductor wafer dicing system using wafer dicing press apparatus 有权
    使用滚筒式压力机的波峰压力装置和半导体波峰定位系统

    公开(公告)号：JP2012160711A

    公开(公告)日：2012-08-23

    申请号：JP2011285725

    申请日：2011-12-27

    Applicant: Samsung Electronics Co Ltd ,  三星電子株式会社Samsung Electronics Co.,Ltd.

    Inventor： LIM WON-CHOL

    IPC: H01L21/301

    CPC classification number: H01L21/78 ,  B28D5/0011 ,  H01L21/00 ,  H01L21/67 ,  H01L21/67011 ,  H01L21/673 ,  H01L21/6835 ,  H01L21/6836 ,  Y10T225/321

    Abstract: PROBLEM TO BE SOLVED: To provide a wafer dicing press apparatus which can improve productivity.SOLUTION: A wafer dicing press apparatus 100 comprises a support member 10 supporting a first surface of a wafer W and a pressure device 20 applying pressure to a second surface of the wafer W. The pressure device 20 includes a pressure dispersion device 22 applying pressure generated by a pressure generation device 21 to the second surface of the wafer W. The pressure dispersion device 22 transmits the pressure generated by the pressure generation device 21 to the wafer W by a diaphragm 221. At this time, the diaphragm 221 is firmly attached to the wafer W with being deformed to the wafer W side by pressure of a working fluid 1 in a frame 211 to apply the pressure of the working fluid 1 to the wafer W in an uniformly dispersed manner. Accordingly, cracks grow inside the wafer W starting from a laser damaged layer formed inside the wafer W, which serves as a division starting point, and thereby a number of semiconductor elements formed on the wafer W are divided into individual pieces.

    Abstract translation: 解决的问题：提供一种能够提高生产率的晶片切割加压装置。 解决方案：晶片切割加压装置100包括支撑晶片W的第一表面的支撑构件10和向晶片W的第二表面施加压力的压力装置20.压力装置20包括压力分散装置22 将由压力产生装置21产生的压力施加到晶片W的第二表面。压力分散装置22通过隔膜221将由压力产生装置21产生的压力传递到晶片W.此时，隔膜221是 通过框架211中的工作流体1的压力将晶片W牢固地附着到晶片W上，以将工作流体1的压力以均匀分散的方式施加到晶片W. 因此，从作为分割起始点的晶片W内形成的激光损伤层开始，晶片W内产生裂纹，从而将形成在晶片W上的多个半导体元件分割成单独的片。 版权所有（C）2012，JPO＆INPIT

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