Separation mechanism of space structure
    8.
    发明专利
    Separation mechanism of space structure 有权
    空间结构的分离机制

    公开(公告)号:JP2014124959A

    公开(公告)日:2014-07-07

    申请号:JP2012280559

    申请日:2012-12-25

    Inventor: HORIE YOICHI

    CPC classification number: B64G1/222 B64G1/64 B64G1/641 B64G1/645 Y10T225/321

    Abstract: PROBLEM TO BE SOLVED: To provide a separation mechanism of a space structure which has a good responsibility.SOLUTION: A separation mechanism 1A of a space structure for separating a second structure 3 from a first structure 2 in a space, comprises a first component 4 fixed to the first structure 2, and a second component 5 fixed to the second structure 3. Both the first component 4 and the second component 5 are made from an insulative material having a relatively low heat conductivity. A current-carrying layer 6 is interposed between he first component 4 and the second component 5, and the first component 4 or the second component 5 is jointed to the current-carrying layer 6 by a junction layer 7. The current-carrying layer 6 is so configured that the layer 6 breaks or dissolves the junction layer 7 by exothermic heat, when an electric current is carried through the current-carrying layer 6.

    Abstract translation: 要解决的问题:提供一种具有良好责任的空间结构的分离机构。解决方案:用于将第二结构3与第一结构2在空间中分离的空间结构的分离机构1A包括第一部件4 固定在第一结构体2上,第二部件5固定在第二结构体3上。第一部件4和第二部件5由导热率相对较低的绝缘材料构成。 载流层6介于其第一部件4和第二部件5之间,第一部件4或第二部件5通过结层7连接到载流层6.载流层6 被配置为当电流通过载流层6时,层6通过放热来破坏或溶解接合层7。

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