Abstract:
PROBLEM TO BE SOLVED: To provide a coil which can increase a space factor and a flat coil with high space factor.SOLUTION: A coil includes a plurality of coil sections 10a to 10d connected with each other. Each of the coil sections includes a main body, and at least one connection part 11 provided on one side of the main body and connected to one of other coil sections. The plurality of coil sections form at least one circle electric circuit surrounding a center axis of the coil. Two coil sections connected with each other form only one overlapping surface in the connection of the respective connection parts. In the plurality of main bodies in the one circle electric circuit, a first end of one main body is adjacent to a second end of another main body, and a virtual stretching surface of the second end stretches to the first end side along the circle electric circuit.
Abstract:
A winding includes a wound electrical conductor having an electrical insulator. A method is also provided for producing a winding. The winding can be produced as a single piece by using a support on which the electrical conductor can be disposed and electrically insulated. The support is particularly implemented in the form of a cylindrical spiral as a coil, and thereby allows practically unlimited single-piece production of the winding. The cross section and/or the width of the electrical conductor can simultaneously be varied by location on the support.
Abstract:
PROBLEM TO BE SOLVED: To provide an inductor element formed on a semiconductor substrate, which is applicable in particular to a high-frequency module or a voltage conversion module used for a portable information communication device, wireless LAN (local area network), or the like, can be miniaturized and suppress an increase in resistance loss, and to provide a manufacturing method thereof. SOLUTION: The inductor element 20 formed on the semiconductor substrate 11 is provided with: an inductor body 61 penetrating through the semiconductor substrate 11, spirally formed and having conductivity; and an insulating film 12 provided between the side surface of the inductor body 61 and the semiconductor substrate 11. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide an insulation system and an insulation method for a transformer containing a magnetic core. SOLUTION: A transformer (10) contains a magnetic core (14) that includes multiple laminate stacks having at least one opening. The transformer (10) also contains a winding (30) comprising a conductive material that is provided around the magnetic core (14) through the at least one opening (20) and is surrounded by an insulating layer (54) having a dielectric constant that varies as a function of voltage. COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a method for curing a coating on a metal conductor (14). SOLUTION: The method includes a step (a) of connecting the metal conductor and a power transformer (12) in series, and a step (b) of passing a current through the metal conductor so as to obtain a sufficient temperature for curing the coating. COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a winding method of a transformer for preventing the problem of enamel slipping off and forming a short circuit in a coil in a process of secondary coil winding. SOLUTION: The winding method winds a primary coil of at least one layer on the bottom layer of a winding area of a winding shaft, coat the primary coil with a first insulating layer of one layer after completing winding of the primary coil, further winds a secondary coil for several layers on the first insulating layer, coats a part between the secondary coils of each one layer with a second insulating layer. Alternatively, the method winds the primary coil of at least one layer on one arbitrary winding area of two winding areas on the winding shaft, winds the secondary coil for several layers on another winding area, and coats a part between the secondary coils of each one layer with the second insulating layer. COPYRIGHT: (C)2004,JPO