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    Method of manufacturing printed board
    1.
    发明专利
    Method of manufacturing printed board 有权
    制造印版的方法

    公开(公告)号：JP2003318538A

    公开(公告)日：2003-11-07

    申请号：JP2002120250

    申请日：2002-04-23

    Applicant: Denso Corp ,  株式会社デンソー

    Inventor： HARADA TOSHIICHI ,  KAJINO HIDETADA ,  HASEGAWA KENICHIRO ,  NIWA TAKAO

    IPC: H05K1/02 ,  H05K3/00 ,  H05K3/46

    Abstract: PROBLEM TO BE SOLVED: To manufacture a multilayered printed wiring board by collectively bonding a plurality of resin films by heating and pressurizing the films while preventing defective connections in the conductor patterns formed on the films. SOLUTION: The multilayered printed board 100 is formed by laminating a plurality of one-sided conductor pattern films 21 each having a plurality of divided product areas 60 and slits between the areas 60 upon another and heating and pressurizing the laminate. Since the apparent size of the printed board 100 can be reduced when the slits 30 are formed, the amount of thermal expansion, etc., of each product area 60 can be reduced and the positional deviation of a conductor pattern 22 formed on a resin film 23 in each product area 60 hardly occurs. Consequently, the occurrence the defective connections can be prevented. COPYRIGHT: (C)2004,JPO

    Abstract translation: 要解决的问题：为了通过加热和加压膜来共同接合多个树脂膜来制造多层印刷线路板，同时防止形成在膜上的导体图案中的连接不良。 解决方案：多层印刷电路板100通过层叠多个分开的产品区域60的多个单面导体图案膜21和区域60之间的狭缝彼此叠置而形成，并对层压体进行加热和加压。 由于当形成狭缝30时可以减小印刷电路板100的表观尺寸，因此可以减少每个产品区域60的热膨胀量等，并且可以减小在树脂膜上形成的导体图案22的位置偏差 每个产品区域60中的23几乎不发生。 因此，可以防止出现故障连接。 版权所有（C）2004，JPO

    Multilayer substrate and its manufacturing method
    2.
    发明专利
    Multilayer substrate and its manufacturing method 审中-公开

    公开(公告)号：JP2004119508A

    公开(公告)日：2004-04-15

    申请号：JP2002278008

    申请日：2002-09-24

    Applicant: Denso Corp ,  株式会社デンソー

    Inventor： HARADA TOSHIICHI ,  MORI TAKAYUKI ,  HASEGAWA KENICHIRO

    IPC: H05K3/46

    Abstract: PROBLEM TO BE SOLVED: To provide a multilayer substrate with superior recyclability and its manufacturing method. SOLUTION: A resin film 2 is mutually bonded by laminating a plurality of one-surface conductor pattern films 1 and heating and pressing them at the same time to form a multilayer substrate 8. At this time, a releasing sheet 6 which is hard to stick on the resin film 2 and a heat radiation member 7 is previously provided between the one-surface conductor pattern films 1 and the heat radiation member 7 as a removal part of the multilayer substrate 8 in a bonding process. Consequently, the resin film 2 and the heat radiation member 7 can easily be separated from the surface of the releasing sheet 6 at the removal part, so the resin film 2 and the heat radiation member 7 can easily be recycled. COPYRIGHT: (C)2004,JPO

    多層基板およびその製造方法
    3.
    发明专利
    多層基板およびその製造方法 有权
    多层接线板及其制造方法

    公开(公告)号：JP2014220428A

    公开(公告)日：2014-11-20

    申请号：JP2013099586

    申请日：2013-05-09

    Applicant: 株式会社デンソー ,  Denso Corp

    Inventor： HARADA TOSHIICHI ,  YOKOCHI TOMOHIRO ,  HASEGAWA KENICHIRO ,  KASAMA YASUNORI

    IPC: H05K3/46

    CPC classification number: H05K3/46

    Abstract: 【課題】電子部品と基板内の配線との接続信頼性を向上させる。【解決手段】積層された複数の樹脂フィルム10と、複数の樹脂フィルム10のうち一部の樹脂フィルム10c〜10eが有する貫通孔11に挿入された電子部品20と、一部の樹脂フィルム10c〜10eに隣接する樹脂フィルム10fに設けられ、電子部品20の主面20aと接続された導電性の接続部材40fとを備える多層基板1において、貫通孔11を有する樹脂フィルム10d、10eの表面上であって、貫通孔11の隣の位置に、電子部品20の側面20cと接触するとともに、接続部材40fと導通する導体パターン30d、30eを設ける。【選択図】図1

    Abstract translation: 要解决的问题：提高电子部件和电路基板中的布线的连接可靠性。解决方案：多层电路板1包括多个层压树脂膜10，插入到形成在一些树脂中的通孔11中的电子部件20 多个树脂膜10中的膜10c-10e以及设置在与一些树脂膜10c-10e相邻的树脂膜10f上并与电子部件20的主表面20a连接的导电连接部件40f。导体图案30d 在与通孔11相邻的位置处，在与电子部件20的侧面20c接触并与连接部件40f导通的30e设置在具有通孔11的树脂膜10d，10e的表面上。

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