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公开(公告)号：JP5323461B2
公开(公告)日：2013-10-23
申请号：JP2008308500
申请日：2008-12-03
Applicant: 福田金属箔粉工業株式会社
Abstract: PROBLEM TO BE SOLVED: To obtain a flaky metal fine powder having characteristics suitable for conductive paint. SOLUTION: A manufacturing method of the flaky metal fine powder for conductive paint has: a first process of adding a reducing agent to a solution made by dispersing a metal compound into alcohol and depositing a metal ultra-fine particle aggregate with a primary particle diameter of 100 nm or below in the solution; a second process of oppositely colliding slurry including the metal ultra-fine particle aggregate; and a third process of mechanically processing the oppositely-collided metal ultra-fine particle aggregate into flaky shapes in the solution. When the flaky copper fine powder is applied for a conductive paint, a film coated with the conductive paint exhibits high conductivity even if the paint is coated at a fine pitch. COPYRIGHT: (C)2010,JPO&INPIT
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Patent Agency Ranking
公开(公告)号：JP5342603B2
公开(公告)日：2013-11-13
申请号：JP2011114330
申请日：2011-05-23
Applicant: 福田金属箔粉工業株式会社
Abstract: PROBLEM TO BE SOLVED: To provide a copper particulate for a paste for low temperature firing, which can form a dense and low-resistant fired film on a resin substrate, and to provide a method for forming a fired copper film. SOLUTION: In the paste containing copper particulates dispersed therein, which is used when a wiring pattern is applied on the substrate in screen printing and a conductive fired film is formed in a firing step, the copper particulate for the paste for low temperature firing contains 30-70 mass% of a copper particulate having an average particle diameter of 40 nm or less and 70-30 mass% of a copper particulate that has mass at least 100 times or more than that of the copper particulate and an average particle diameter of 200-800 nm. The method for forming the low-resistant fired film on the resin substrate comprises: using the paste which contains the copper particulates for the paste for low temperature firing dispersed therein; and firing the paste at a firing temperature of 250°C or lower in a hydrogen-containing nitrogen gas atmosphere. COPYRIGHT: (C)2013,JPO&INPIT
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公开(公告)号：JP4954559B2
公开(公告)日：2012-06-20
申请号：JP2006025968
申请日：2006-02-02
Applicant: 福田金属箔粉工業株式会社
IPC: C09D11/02 , C09D11/023 , C09D11/033 , C09D11/037
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公开(公告)号：JP5466862B2
公开(公告)日：2014-04-09
申请号：JP2009039693
申请日：2009-02-23
Applicant: 福田金属箔粉工業株式会社 , 地方独立行政法人 大阪市立工業研究所
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6.发明专利
公开(公告)号：JP5342597B2
公开(公告)日：2013-11-13
申请号：JP2011090592
申请日：2011-04-15
Applicant: 福田金属箔粉工業株式会社
Abstract: PROBLEM TO BE SOLVED: To provide an ultrafine copper particle dispersed paste, with which a dense low-resistance fired film can be easily obtained even at a low temperature of 300°C or below by using a normal reducing atmospheric firing furnace, and a method of forming a conductive film. SOLUTION: An ultrafine copper particle dispersed paste for low-temperature firing is paste in which ultrafine copper particles are wet-coated with glycol. The ultrafine copper particle dispersed paste for low-temperature firing contains 3-30 parts by mass of fatty acid with respect to 100 parts by mass of the ultrafine copper particles. A dense low-resistance fired film can be formed by printing a wiring pattern with the paste on a resin substrate, followed by low-temperature firing. COPYRIGHT: (C)2013,JPO&INPIT
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