Abstract:
PROBLEM TO BE SOLVED: To protect a circuit surface of a bumped wafer using a surface protective sheet, prevents collapse of bumps on the circuit surface during grinding of a back surface, and suppresses occurence of dimples and cracks on a grinding surface.SOLUTION: A substrate film according to the present invention, which is a substrate film of an adhesive sheet attached to a semiconductor wafer, comprises: (A) a layer formed of a hardener obtained by hardening a composition containing an urethane (meth)acrylate oligomer and a thiol group-containing compound with an energy line; and (B) a layer formed of a thermoplastic resin.
Abstract:
PROBLEM TO BE SOLVED: To provide an inexpensive sheet having heat resistance and capable of inhibiting the generation of an outgas, and an adhesive sheet using the sheet.SOLUTION: This sheet can be produced by curing an energy ray-curable composition containing a urethane acrylate-based oligomer and a compound having a thiol group in the molecule thereof, wherein the content of the thiol group-containing compound is 2-100 mmol based on 100 g of the urethane acrylate-based oligomer, and the modulus of elongation is 10-1,000 MPa.
Abstract:
PROBLEM TO BE SOLVED: To provide an inexpensive sheet having heat resistance and capable of inhibiting the generation of an outgas, and an adhesive sheet using the sheet. SOLUTION: This inexpensive sheet capable of inhibiting the generation of an outgas even when the sheet is used in a production process for a semiconductor device using heating can be produced by curing an energy ray-curable composition containing an urethane acrylate-based oligomer and a compound having a thiol group in the molecule thereof, and this adhesive sheet can be produced using the sheet. COPYRIGHT: (C)2011,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a sheet obtained by curing an energy ray-curable composition containing urethane acrylate oligomers and a compound having a thiol group in one molecule thereof, to provide a self-adhesive sheet obtained by using the sheet as a constituent layer, and to improve preservation stability of raw materials of the sheet.SOLUTION: The sheet comprises a cured product obtained by curing a blended product, which contains urethane (meth)acrylate oligomers, the compound having the thiol group in one molecule thereof and an N-nitrosoamine-based polymerization inhibitor and/or an N-oxyl compound-based polymerization inhibitor, by using an energy ray.
Abstract:
PROBLEM TO BE SOLVED: To provide a base film and a pressure-sensitive adhesive sheet provided with the base film which protects a circuit surface of a bump-bearing wafer by using a surface protective sheet, at the same time, prevents bumps on the circuit surface from being crushed when grinding the rear surface and, moreover, suppresses the formation of dimples and cracks on the ground surface.SOLUTION: The base film is a base film for the pressure-sensitive adhesive sheet to be bonded to a semiconductor wafer and is composed of: a layer (A) made of a cured material prepared by curing a formulation containing a polyether polyol urethane (meth)acrylate oligomer and an energy-ray curable monomer with energy rays; and a layer (B) made of a thermoplastic resin.
Abstract:
PROBLEM TO BE SOLVED: To provide a plastic film having all of an antistatic performance, solvent resistance and blocking resistance and excellent transparency, and to provide a composition for forming an antistatic layer, from which the plastic film can be formed. SOLUTION: The following composition for forming the antistatic layer is used. The composition comprises: (a) a quaternary ammonium salt type cationic polymer compound having active hydrogen in the molecule; (b) at least one kind selected from a group consisting of acrylic resin, polyurethane resin, polyamide resin, polyester resin and polyether resin having active hydrogen in the molecule; (c) polyisocyanate compound; and as necessary, (d) silane-modified epoxy resin; and/or (f) a compound having at least two active hydrogen atoms. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To obtain an active energy ray-curable resin composition for forming a protective layer having excellent curing properties, scuff resistance, hardness, adhesiveness, transparency, etc., on the surface of a cyclic olefin-based substrate. SOLUTION: The active energy ray-curable resin composition for protecting the surface of a cyclic olefin-based substrate comprises (A) 40-60 wt.% of a polyfunctional monomer having ≤37mN/m surface tension and containing three or more acryloyl groups, (B) 10-60 wt.% of a polymer acrylate obtained by adding acrylic acid to a glycidyl (meth)acrylate-based polymer and (C) 0-50 wt.% of another acrylic oligomer (the total of the components is 100 wt.%). COPYRIGHT: (C)2007,JPO&INPIT
Abstract translation:要解决的问题:为了获得在环状烯烃类基材的表面上形成具有优异的固化性,耐磨损性,硬度,粘合性,透明性等的保护层的活性能量射线固化树脂组合物 。 解决方案:用于保护环状烯烃类基材的表面的活性能量射线固化型树脂组合物包含(A)40-60重量%的表面张力≤37mN/ m 3的多官能单体,并含有三个以上 丙烯酰基,(B)10-60重量%的通过将丙烯酸加入到(甲基)丙烯酸缩水甘油酯基聚合物中而得到的聚合物丙烯酸酯和(C)0-50重量%的另一个丙烯酸低聚物 组分为100重量%)。 版权所有(C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a molded article which is provided with a fine rugged shape and is excellent in surface hardness in addition to chemical resistance and scratch resistance, to provide a molded article provided with a shaped layer having satisfactory shaping property and shape retention property to be used for obtaining the molded article and, further, to provide an active energy ray curable shaping resin composition capable of forming a shaping layer suited for a nanoimprint. SOLUTION: The active energy ray curable shaping resin composition contains a reaction product (B) obtained by reacting radically polymerizable vinyl monomer (b) having carboxyl group with a polymer (A) of radical polymerization component (a) containing radically polymerizable vinyl monomer (a1) having epoxy group. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a stable, electroconductive polymer/dopant complex organic solvent dispersion which is obtained by dispersing an electroconductive polymer and a dopant in an organic solvent. SOLUTION: The elctroconductive polymer/dopant complex organic solvent dispersion contains (a1) an electroconductive polymer, (a2) a dopant and (B) a dispersing agent containing at least one kind selected from the group consisting of amines and nonionic surfactants, and has a water content of 20% by weight or less; the method for manufacturing the electroconductive polymer/dopant complex organic solvent dispersion is characterized by removing water by spray drying from the aqueous dispersion of (A) an electroconductive polymer/dopant complex consisting of (a1) an electroconductive polymer and (a2) a dopant to thereby give a dry solid, and by carrying out the dispersing treatment after adding to the above dry solid (D) an organic solvent and (B) a dispersing agent containing at least one kind selected from the group consisting of amines and nonionic surfactants. COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To obtain a stable, electroconductive polymer/dopant complex organic solvent dispersion which is obtained by dispersing an electroconductive polymer and a dopant in an organic solvent.SOLUTION: The method for producing the electroconductive polymer/dopant complex organic solvent dispersion having a water content of ≤20 wt.% is characterized by removing water by spray drying from an aqueous dispersion of an electroconductive polymer/dopant complex (A) to thereby give a dry solid, and by carrying out dispersing treatment after adding to the dry solid an organic solvent (D) and a dispersing agent (B) containing at least one kind selected from the group consisting of amines and nonionic surfactants. According to another embodiment, the method for producing the electroconductive polymer/dopant complex organic solvent dispersion having a water content of ≤20 wt.% is characterized by adding a precipitating agent (C) or an organic solvent (D) to an aqueous dispersion of the above (A), removing water from the resulting gelatinous swollen body, adding the organic solvent (D) and the above dispersing agent (B), and carrying out dispersing treatment.