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公开(公告)号:JP2018088474A
公开(公告)日:2018-06-07
申请号:JP2016230792
申请日:2016-11-29
申请人: 株式会社ディスコ
发明人: ベ テウ
IPC分类号: B23K26/53 , H01L21/301
CPC分类号: H01L21/268 , B23K26/0006 , B23K26/53 , B23K2101/40 , B23K2103/56 , H01L21/304 , H01L21/67092 , H01L21/6836 , H01L21/78 , H01L23/544 , H01L23/562 , H01L2221/68327 , H01L2221/6834 , H01L2223/5446
摘要: 【課題】劈開方向に対して45°傾いた複数のストリートを有するウェーハを適切に分割できるように加工するウェーハの加工方法を提供する。 【解決手段】劈開方向に対して45°傾いた複数のストリートを有するウェーハの加工方法であって、ウェーハに対して透過性を有する波長のレーザビームの集光点をウェーハの内部に位置づけるとともに該レーザビームを該ストリートに沿って照射してウェーハの厚み方向に重なる複数の改質層を該ストリートに沿ってウェーハの内部に形成するレーザ加工ステップを含み、該レーザ加工ステップでは、劈開方向に対して平行な複数のストリートを有するウェーハを分割する際にウェーハの厚み方向に重ねて形成する必要のある改質層の数をn層(nは自然数)として、m層(mはn・√2以上の整数)の改質層をウェーハの厚み方向に重ねて形成する。 【選択図】図1
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公开(公告)号:JP6325432B2
公开(公告)日:2018-05-16
申请号:JP2014262026
申请日:2014-12-25
申请人: 信越化学工業株式会社
IPC分类号: H01L21/683 , C09J7/00 , C09J183/04 , H01L21/304
CPC分类号: H01L21/6836 , B32B7/12 , B32B2250/02 , B32B2255/26 , B32B2457/14 , C08G77/12 , C08G77/20 , C08G77/52 , C08K5/56 , C08L83/00 , C09J183/04 , H01L21/304 , H01L21/30625 , H01L21/6835 , H01L2221/68327 , H01L2221/6834 , H01L2221/68381
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公开(公告)号:JP6324438B2
公开(公告)日:2018-05-16
申请号:JP2016113001
申请日:2016-06-06
申请人: リンテック株式会社
IPC分类号: B23K26/53 , C09J201/00 , H01L23/00 , H01L21/301
CPC分类号: H01L21/6836 , B23K26/53 , B32B27/08 , B32B27/16 , B32B2307/50 , B32B2307/548 , B32B2457/14 , C08J7/042 , C08J2333/10 , C08J2363/00 , C08J2363/04 , C09D133/10 , C09D163/00 , C09D163/04 , C09J7/29 , C09J133/10 , C09J163/00 , C09J163/04 , C09J2201/28 , C09J2203/326 , H01L21/268 , H01L21/78 , H01L2221/68313 , H01L2221/68327 , H01L2221/68336 , H01L2221/6834 , H01L2221/68377
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公开(公告)号:JP6316585B2
公开(公告)日:2018-04-25
申请号:JP2013264445
申请日:2013-12-20
IPC分类号: H01L21/768 , H01L23/522 , H01L27/10 , H01L25/065 , H01L25/07 , H01L25/18 , H01L21/3205
CPC分类号: H01L25/0657 , G11C8/00 , G11C16/08 , H01L21/6835 , H01L21/7684 , H01L21/76877 , H01L21/76898 , H01L23/3192 , H01L23/481 , H01L23/544 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/14 , H01L2221/68327 , H01L2221/6834 , H01L2223/54426 , H01L2223/54473 , H01L2224/02372 , H01L2224/03002 , H01L2224/03614 , H01L2224/03912 , H01L2224/0401 , H01L2224/05009 , H01L2224/05548 , H01L2224/05567 , H01L2224/05568 , H01L2224/0557 , H01L2224/05624 , H01L2224/05647 , H01L2224/06181 , H01L2224/11002 , H01L2224/11462 , H01L2224/1147 , H01L2224/1191 , H01L2224/13 , H01L2224/13024 , H01L2224/13082 , H01L2224/131 , H01L2224/13139 , H01L2224/13144 , H01L2224/13169 , H01L2224/14051 , H01L2224/14181 , H01L2224/16145 , H01L2224/16146 , H01L2224/16225 , H01L2224/16227 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06548 , H01L2225/06565 , H01L2225/06593 , H01L2924/0002 , H01L2924/15311 , H01L2924/00 , H01L2924/00014 , H01L2924/014
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公开(公告)号:JP6313251B2
公开(公告)日:2018-04-18
申请号:JP2015049947
申请日:2015-03-12
申请人: 東芝メモリ株式会社
IPC分类号: B24B7/04 , H01L21/02 , H01L27/12 , H01L21/304
CPC分类号: H01L31/18 , H01L21/304 , H01L21/6835 , H01L27/1464 , H01L27/14687 , H01L2221/68327 , H01L2221/6834
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公开(公告)号:JP6280400B2
公开(公告)日:2018-02-14
申请号:JP2014045119
申请日:2014-03-07
申请人: 日東電工株式会社
CPC分类号: H01L23/29 , C09J7/24 , C09J2203/326 , C09J2433/006 , H01L21/563 , H01L21/568 , H01L21/6835 , H01L21/6836 , H01L23/293 , H01L24/05 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L25/0657 , H01L25/50 , H01L2221/68327 , H01L2221/68336 , H01L2221/6834 , H01L2221/68377 , H01L2221/68381 , H01L2224/05155 , H01L2224/05644 , H01L2224/13025 , H01L2224/13082 , H01L2224/13111 , H01L2224/13144 , H01L2224/13147 , H01L2224/14181 , H01L2224/16145 , H01L2224/16227 , H01L2224/16245 , H01L2224/27002 , H01L2224/27003 , H01L2224/271 , H01L2224/27436 , H01L2224/2919 , H01L2224/2929 , H01L2224/29291 , H01L2224/293 , H01L2224/29311 , H01L2224/29316 , H01L2224/29318 , H01L2224/29324 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29364 , H01L2224/29371 , H01L2224/29387 , H01L2224/29393 , H01L2224/32145 , H01L2224/32225 , H01L2224/32227 , H01L2224/32245 , H01L2224/33181 , H01L2224/73104 , H01L2224/73204 , H01L2224/81127 , H01L2224/81191 , H01L2224/81193 , H01L2224/81203 , H01L2224/81204 , H01L2224/81815 , H01L2224/81907 , H01L2224/83127 , H01L2224/83191 , H01L2224/83203 , H01L2224/83204 , H01L2224/83862 , H01L2224/83907 , H01L2224/92 , H01L2224/9211 , H01L2224/94 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06565 , H01L2924/0635 , H01L2924/3512 , H01L2924/00 , H01L2224/27 , H01L2924/00014 , H01L2924/0665 , H01L2924/066 , H01L2924/014 , H01L2924/013 , H01L2924/01006 , H01L2924/05442 , H01L2924/00012 , H01L2924/01082 , H01L2924/01047 , H01L2924/01029 , H01L2924/0103 , H01L2924/01083 , H01L2224/81 , H01L2224/83 , H01L2224/11 , H01L2221/68304 , H01L21/78 , H01L2221/68386 , H01L21/304 , H01L2221/68368
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公开(公告)号:JP6256478B2
公开(公告)日:2018-01-10
申请号:JP2015550621
申请日:2014-10-30
申请人: JSR株式会社
CPC分类号: B32B7/06 , B32B7/12 , B32B27/08 , B32B27/18 , B32B27/308 , B32B27/36 , B32B37/1284 , B32B38/10 , B32B43/006 , B32B2037/268 , B32B2307/748 , B32B2457/14 , C08G77/18 , C08G2261/3324 , C08G2261/418 , C08L53/02 , C08L83/04 , C09D183/06 , C09J165/00 , H01L21/6835 , H01L21/6836 , H01L2221/68318 , H01L2221/68327 , H01L2221/6834 , H01L2221/68381 , H01L2221/68386
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公开(公告)号:JP6250265B2
公开(公告)日:2017-12-20
申请号:JP2012061097
申请日:2012-03-16
申请人: リンテック株式会社
IPC分类号: C09J7/02 , C09J11/06 , C09J133/00 , C09J163/00 , C09J163/10 , H01L21/301 , C09J7/00
CPC分类号: C09J133/00 , C09J133/06 , C09J133/066 , C09J133/14 , C09J133/24 , C09J143/04 , C09J5/00 , C09J7/35 , H01L21/6836 , H01L21/78 , H01L23/293 , H01L24/29 , H01L24/83 , H01L24/92 , H01L25/50 , H01L2221/68327 , H01L2221/68336 , H01L2221/6834 , H01L2221/68377 , H01L2221/68381 , H01L2224/27003 , H01L2224/27436 , H01L2224/2929 , H01L2224/29387 , H01L2224/2939 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/48227 , H01L2224/83 , H01L2224/83048 , H01L2224/83191 , H01L2224/83203 , H01L2224/8385 , H01L2224/83862 , H01L2224/83907 , H01L2224/92 , H01L2224/92247 , H01L2224/94 , H01L24/27 , H01L24/32 , H01L24/48 , H01L24/85 , H01L24/94 , H01L25/0657 , H01L2924/00014 , H01L2924/12042 , H01L2924/181 , Y10T428/2826
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公开(公告)号:JP6230381B2
公开(公告)日:2017-11-15
申请号:JP2013236374
申请日:2013-11-15
申请人: 株式会社ディスコ
IPC分类号: H01L21/304
CPC分类号: H01L21/6835 , H01L21/6836 , H01L23/544 , H01L2221/68327 , H01L2221/6834 , H01L2221/68381 , H01L2223/54493 , H01L2224/11 , H01L2924/0002
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公开(公告)号:JP6222941B2
公开(公告)日:2017-11-01
申请号:JP2013032386
申请日:2013-02-21
申请人: 日東電工株式会社
IPC分类号: C09J7/02 , C09J11/04 , C09J161/10 , C09J163/00 , C09J201/00 , H01L21/304 , H01L21/301 , H01L21/60
CPC分类号: H01L21/563 , B32B27/38 , C08G59/621 , C08J5/18 , C08L33/06 , C09J133/08 , C09J163/00 , H01L21/6836 , H01L23/293 , H01L23/3114 , H01L24/14 , H01L24/27 , H01L24/29 , H01L24/83 , B32B2264/102 , B32B2457/14 , C08J2333/08 , C08J2333/12 , C08J2361/10 , C08J2433/08 , C08J2433/12 , C08J2433/20 , C08J2463/00 , H01L2221/68327 , H01L2221/6834 , H01L2221/68377 , H01L2224/13111 , H01L2224/13144 , H01L2224/13147 , H01L2224/14181 , H01L2224/16225 , H01L2224/27436 , H01L2224/2919 , H01L2224/32225 , H01L2224/73104 , H01L2224/73204 , H01L2224/73253 , H01L2224/81191 , H01L2224/81193 , H01L2224/83191 , H01L2224/8385 , H01L2224/84862 , H01L23/562 , H01L24/13 , H01L24/73 , H01L24/81 , H01L2924/00011 , H01L2924/0132 , H01L2924/01322 , H01L2924/0133
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