公开(公告)号：JP2009120869A

公开(公告)日：2009-06-04

申请号：JP2007293072

申请日：2007-11-12

Applicant: Ast:Kk ,  Okuno Chem Ind Co Ltd ,  奥野製薬工業株式会社 ,  株式会社エーエステー

Inventor： HIROSE TOSHIYUKI ,  HARA KENJI ,  YAMATO SHIGERU

IPC: C25D5/42

Abstract: PROBLEM TO BE SOLVED: To provide a plating method of a magnesium alloy base material by which excellent adhesion of the plating film is attained and plating swelling is surely prevented by carrying out the plating after inclusion such as the soiling on the surface is removed in a pretreatment in the plating of the surface of the magnesium alloy base material.
SOLUTION: The plating pretreatment comprising: an etching step of removing an anodized film; a successive desmutting step; and a metal substitution treatment is applied successively after an anodizing treatment of a magnesium alloy base material which is applied with a pretreatment before a plating step. Then, excellent adhesion of the plating film is attained and plating swelling is surely prevented because the plating is carried out after inclusion such as the soiling on the surface is removed in the pretreatment in the plating of the surface of the magnesium alloy base material.
COPYRIGHT: (C)2009,JPO&INPIT

Abstract translation: 要解决的问题：为了提供一种镁合金基材的镀覆方法，通过在表面上的污渍等包含物之后，通过进行镀覆来确保电镀膜的优异粘合性和电镀溶胀性，可以确保电镀溶胀性 在镁合金基材的表面的电镀中的预处理中除去。 电镀预处理包括：去除阳极氧化膜的蚀刻步骤; 一个连续的desmutting步骤; 在对电镀工序前进行预处理的镁合金基材进行阳极氧化处理后，依次进行金属取代处理。 然后，通过在镁合金基材的表面的电镀中的预处理中除去表面上的污渍等包覆后进行镀覆，可以确保镀膜的良好的附着性，并可靠地防止电镀溶胀。 版权所有（C）2009，JPO＆INPIT