Abstract:
PROBLEM TO BE SOLVED: To provide a plating method of a magnesium alloy base material by which excellent adhesion of the plating film is attained and plating swelling is surely prevented by carrying out the plating after inclusion such as the soiling on the surface is removed in a pretreatment in the plating of the surface of the magnesium alloy base material. SOLUTION: The plating pretreatment comprising: an etching step of removing an anodized film; a successive desmutting step; and a metal substitution treatment is applied successively after an anodizing treatment of a magnesium alloy base material which is applied with a pretreatment before a plating step. Then, excellent adhesion of the plating film is attained and plating swelling is surely prevented because the plating is carried out after inclusion such as the soiling on the surface is removed in the pretreatment in the plating of the surface of the magnesium alloy base material. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide: a composition for improving lightfastness of an article, obtained by subjecting aluminum to an anodic oxidation and dyeing treatment using an organic dye; a method for improving lightfastness using the same; and the article treated by the method. SOLUTION: The composition for improving lightfastness of an article, obtained by subjecting aluminum to an anodic oxidation and dyeing treatment, comprises an aqueous solution, which is obtained by preparing a solution containing a hindered amine-based light stabilizer being a compound with a hindered piperidinyl group and having a pH of ≤3, wherein the pH of the solution is adjusted to 1-9 as occasion demands by the addition of an alkali component. The method for improving lightfastness includes the step of bringing an article, obtained by subjecting aluminum or an aluminum alloy to an anodic oxidation and dyeing treatment, into contact with the composition. The article treated by the method is also provided. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a copper plating solution capable of forming a copper strike plating film which stably has good adhesion to a material of zinc-containing metal or magnesium-containing metal, the copper plating solution having little adverse effect to a human body and environment. SOLUTION: The copper strike plating solution for zinc-containing metal or magnesium-containing metal contains the following components (1) and (2) and has a pH in the range of 10.5-13. The component (1) is at least one divalent copper compound selected from the group consisting of copper oxide, copper hydroxide, copper carbonate, copper formate, and copper acetate. The component (2) is an organic phosphonic acid having two or more groups represented by the formula: -PO(-OM 1 )(-OM 2 ), wherein M 1 and M 2 are the same or different and each hydrogen or an alkali metal. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a surface treatment agent for a metal, which does not contain harmful hexavalent chromium and gives the metal the surface having corrosion resistance, color fastness, adhesiveness to paint, and wettability to solder, similar to those given by the surface treatment agent containing hexavalent chromium. SOLUTION: The surface treatment agent is an aqueous solution including a polymer containing at least one compound selected from the group consisting of vinylamine, allylamine, a salt of allylamine, diallylamine, a salt of diallylamine and a salt of diallylammonium, as a constituting monomer. COPYRIGHT: (C)2006,JPO&NCIPI