公开(公告)号：JP2011222554A

公开(公告)日：2011-11-04

申请号：JP2010086347

申请日：2010-04-02

Applicant: Denso Corp ,  株式会社デンソー

Inventor： HIROSE SHINICHI ,  MAEDA YUKIHIRO ,  NAKANO TAKASHI ,  FUJII TETSUO ,  HARADA YOSHIHARU

IPC: H05K3/46 ,  H01L23/12

CPC classification number: H01L2224/16225 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To provide a wiring board with a built-in semiconductor chip for simplifying a manufacture process and eliminating the lack of current capacity without increasing a body size while a power transistor and a signal processing circuit portion coexist in a chip.SOLUTION: A large current electrode and a plurality of small current electrodes whose flowing current is smaller than the large current electrode are formed on one face of a semiconductor chip embedded in an insulating substrate including thermoplastic resin. Wiring portions connected to the small current electrodes are positioned just above the small current electrodes, have first pads formed of a conductor pattern connected to the small current electrodes and includes a plurality of first pads positioned just above the adjacent small current electrodes and on the same layer as the first pads. Wiring portions connected to the large current electrode are made of metal pieces and include lateral wiring portions positioned on the same layer as the plurality of first pads. The metal piece is positioned just above the large current electrode and serves as a second pad and is thicker than the first pad positioned on the same layer.

Abstract translation: 要解决的问题：为了提供具有内置半导体芯片的布线板，用于在功率晶体管和信号处理电路部分共存的同时简化制造工艺并消除电流容量的不足而不增加体积 芯片。 解决方案：在包含热塑性树脂的绝缘基板中的半导体芯片的一个面上形成有大电流电极和流动电流小于大电流电极的多个小电流电极。 连接到小电流电极的接线部分位于小电流电极的正上方，具有由连接到小电流电极的导体图案形成的第一焊盘，并且包括位于相邻的小电流电极正上方的多个第一焊盘 层作为第一垫。 连接到大电流电极的接线部分由金属片制成，并且包括位于与多个第一焊盘相同的层上的横向布线部分。 金属片位于大电流电极正上方，用作第二焊盘，并且比位于同一层上的第一焊盘更厚。 版权所有（C）2012，JPO＆INPIT

公开(公告)号：JP2009026791A

公开(公告)日：2009-02-05

申请号：JP2007185392

申请日：2007-07-17

Applicant: Denso Corp ,  株式会社デンソー

Inventor： HARADA YOSHIHARU ,  IMAIZUMI NORIHISA ,  SANADA SUKENORI

IPC: H01L23/28

CPC classification number: H01L24/97 ,  H01L2224/48091 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To make heat during welding hard to be conducted to mold resin when a lead portion and a member to be bonded are welded in an outer leadless type mold package. SOLUTION: The outer leadless type mold package 100 such that the lower surface 32 of a lead portion 30 exposed on the lower surface 42 of the mold resin 40 is welded to the member 200 to be joined is provided with a gap portion 60 as a low-heat-conduction portion which is lower in heat conductivity than the mold resin 40 between the top surface 31 of the lead portion 30 on the opposite side from the lower surface 32, and mold resin 40. COPYRIGHT: (C)2009,JPO&INPIT

Abstract translation: 要解决的问题：当在外部无引线型模具包装中焊接引线部分和待接合部件时，使焊接期间的热量难以导入模制树脂。 解决方案：外部无引线型模具包装100使得露出在模制树脂40的下表面42上的引线部分30的下表面32焊接到待接合的构件200上，设置有间隙部分60 作为导热率低于与下表面32相反的一侧的引线部分30的顶表面31之间的模制树脂40的低导热部分和模制树脂40。（版权所有： C）2009年，JPO＆INPIT

公开(公告)号：JP2008171976A

公开(公告)日：2008-07-24

申请号：JP2007003177

申请日：2007-01-11

Applicant: Denso Corp ,  株式会社デンソー

Inventor： HARADA YOSHIHARU ,  IMAIZUMI NORIHISA ,  SANADA SUKENORI

IPC: H01L23/40

CPC classification number: H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/19105 ,  H01L2924/00014

Abstract: PROBLEM TO BE SOLVED: To prevent sticking of splashing objects from a resin member to a heat sink, in a method of manufacturing a semiconductor device in which the heat sink and a ceramic substrate are assembled together through a thermo-setting type resin member that elastically relaxes a stress acting between the heat sink and the ceramic substrate. SOLUTION: A resin member 70 is applied on a heat sink 10, among the heat sink 10 and a ceramic substrate 20, while the resin member 70 is heated and solidified. Then, the ceramic substrate 20 is assembled to the heat sink 10 through the solidified resin member 70. Since the resin member 70 is solidified in advance not to generate splashing objects before both members 10 and 20 are assembled, sticking of the splashing objects to the heat sink 10 is prevented. COPYRIGHT: (C)2008,JPO&INPIT

Abstract translation: 要解决的问题为了防止溅射物体从树脂部件粘附到散热器，在制造半导体器件的方法中，其中散热器和陶瓷基板通过热固性树脂组装在一起 弹性地松弛在散热器和陶瓷基板之间作用的应力的构件。 解决方案：在树脂构件70被加热和固化的同时，在散热器10和陶瓷基板20之间的散热片10上施加树脂构件70。 然后，通过凝固树脂部件70将陶瓷基板20组装到散热片10.由于树脂部件70在组装两个部件10和20之前被预先固化，不会产生飞溅物体，所以将飞溅物体粘附到 防止散热片10。 版权所有（C）2008，JPO＆INPIT

公开(公告)号：JP2008112924A

公开(公告)日：2008-05-15

申请号：JP2006296198

申请日：2006-10-31

Applicant: Denso Corp ,  株式会社デンソー

Inventor： YAMAGISHI TETSUTO ,  HARADA YOSHIHARU ,  HIROSE SHINICHI ,  IMAIZUMI NORIHISA

IPC: H01L21/56

CPC classification number: H01L24/97 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2224/85 ,  H01L2924/00014

Abstract: PROBLEM TO BE SOLVED: To maximally prevent the occurrence of voids between semiconductor elements or the flow of a wire located between the semiconductor elements owing to a resin flow-velocity difference between each path on an element and each path outside an element in a manufacturing method for a semiconductor device composed by sealing a plurality of semiconductor elements arrayed on a lead frame with a resin. SOLUTION: Each projection 700, projecting from each portion corresponding to each path 602 outside an element on the inner face of a cavity 503, is provided to a die 500 so that a flow velocity of the resin 50 flowing in each path 601 on an element has magnitude being the same or more than that of a flow velocity of the resin 50 flowing in each path 602 outside an element. Sealing by the resin 50 is executed while using the die 500 provided with each projection 700. COPYRIGHT: (C)2008,JPO&INPIT

Abstract translation: 要解决的问题：为了最大程度地防止半导体元件之间的空隙的发生或位于半导体元件之间的导线的流动，这是由于元件上的每个路径和元件外部的每个路径之间的树脂流速差异 一种半导体器件的制造方法，其通过用树脂密封排列在引线框架上的多个半导体元件。 解决方案：从腔503的内表面上的元件外部的每个路径602的每个部分突出的每个突起700被提供给模具500，使得在每个路径601中流动的树脂50的流速 在元件上的量值与在元件外部的每个路径602中流动的树脂50的流速相同或更大。 在使用设置有每个突起700的模具500的同时，通过树脂50进行密封。版权所有（C）2008，JPO＆INPIT

公开(公告)号：JP2007287765A

公开(公告)日：2007-11-01

申请号：JP2006110449

申请日：2006-04-13

Applicant: Denso Corp ,  株式会社デンソー

Inventor： MIZUTANI KOJI ,  HIROSE SHINICHI ,  HARADA YOSHIHARU

IPC: H01L23/50

CPC classification number: H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To provide a structure of an outer lead suitable for securing lead recognition property and solder wettability while resin adhesiveness is secured in a resin-sealed semiconductor device.
SOLUTION: In the semiconductor device 100, a lead frame 30 and a semiconductor element 20 are electrically connected and they are sealed with molded resin 50. A surface of an inner lead 31 is formed of a roughened plated film 331 roughened much more than a surface of a base material 30a of the lead frame 30 and an outer lead 32 is soldered with a printed board. A surface of the outer lead 32 is formed of a roughened plated film 332 roughened much more than the surface of the base material 30a of the lead frame 30. Roughness of the roughened plated film 331 in the inner lead 31 is made higher than that of the roughened plated film 332 in the outer lead 32.
COPYRIGHT: (C)2008,JPO&INPIT

Abstract translation: 要解决的问题：提供一种外部引线的结构，其适用于确保引线识别性能和焊料润湿性，同时树脂密封性确保在树脂密封半导体器件中。 解决方案：在半导体器件100中，引线框架30和半导体元件20电连接并且用模制树脂50密封。内引线31的表面由粗糙化的电镀膜331形成，其粗糙度更高 比引线框架30的基材30a的表面和外引线32与印刷板焊接。 外引线32的表面由比引线框架30的基材30a的表面更加粗糙化的粗糙化的电镀膜332形成。内引线31的粗糙化电镀膜331的粗糙度比 外引线32中的粗糙化的电镀膜332。版权所有（C）2008，JPO＆INPIT

公开(公告)号：JP2007173877A

公开(公告)日：2007-07-05

申请号：JP2007084580

申请日：2007-03-28

Applicant: Denso Corp ,  株式会社デンソー

Inventor： HARADA YOSHIHARU ,  SUZUKI TOSHIO ,  IWAMIYA HIROKI

IPC: H01L23/36

CPC classification number: H01L2224/48091 ,  H01L2224/73204 ,  H01L2924/19105 ,  H01L2924/00014

Abstract: PROBLEM TO BE SOLVED: To dissipate heat of a semiconductor element mounted on a wiring board via a through hole with reliability. SOLUTION: In a printed circuit board 41, a heat sink layer 42 is formed by an inner layer wiring, and a through hole 43 is formed so as to penetrate the heat sink layer 42. The interior of the through hole 43 is filled with a solder 44 almost perfectly without void. In the printed circuit board 41, an IC chip 45 is mounted at a position on the top of the through hole 43, and a wire 46 connects the IC chip 45 to the printed circuit board 41. Therefore, the heat of the IC chip 45 can be dissipated via the solder 44 filled in the through hole 43 to the back of the printed circuit board 41 and the heat sink layer 42 effectively. COPYRIGHT: (C)2007,JPO&INPIT

Abstract translation: 要解决的问题：通过通孔可靠地消散安装在布线板上的半导体元件的热量。 解决方案：在印刷电路板41中，通过内层布线形成散热层42，并且形成通孔43以穿透散热层42.通孔43的内部为 充满焊锡44几乎完美无空隙。 在印刷电路板41中，IC芯片45安装在通孔43的顶部的位置，导线46将IC芯片45连接到印刷电路板41.因此，IC芯片45的热量 可以通过填充在通孔43中的焊料44有效地消散到印刷电路板41和散热层42的背面。 版权所有（C）2007，JPO＆INPIT

公开(公告)号：JP2006303215A

公开(公告)日：2006-11-02

申请号：JP2005123390

申请日：2005-04-21

Applicant: Denso Corp ,  株式会社デンソー

Inventor： MIZUTANI KOJI ,  HARADA YOSHIHARU

IPC: H01L23/50

CPC classification number: H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To compatibly secure the resin adhesion of a lead frame and secure lead recognizability in a resin-sealed semiconductor device for which a semiconductor element and the lead frame electrically connected to each other are sealed with a molded resin, and the surface of the lead frame is constituted of a plating film for improving the resin adhesion. SOLUTION: In the resin-sealed semiconductor device, the lead frame 30 and the semiconductor element 20 are electrically connected to each other, the semiconductor element 20 and the lead frame 30 are sealed with the molded resin 50, a part of the lead frame 30 is projected from the molded resin 50 as an outer lead 32, and the entire surface of the lead frame 30 is formed of the plating film 33 for improving the adhesion with the molded resin 50. The specific surface area of the plating film 33 is ≥1.05 and COPYRIGHT: (C)2007,JPO&INPIT

Abstract translation: 要解决的问题为了兼容地确保引线框架的树脂粘合性，并且通过模塑树脂密封其中彼此电连接的半导体元件和引线框架的树脂密封半导体器件中的引线可识别性， 引线框架的表面由用于提高树脂粘合性的镀膜构成。 解决方案：在树脂密封半导体器件中，引线框架30和半导体元件20彼此电连接，半导体元件20和引线框架30被模制树脂50密封，部分 引线框架30从作为外引线32的模制树脂50突出，并且引线框架30的整个表面由用于改善与模制树脂50的粘附性的镀膜33形成。镀膜的比表面积 33在整个引线框架30上≥1.05和<1.3。版权所有（C）2007，JPO＆INPIT

公开(公告)号：JP2003086756A

公开(公告)日：2003-03-20

申请号：JP2001275201

申请日：2001-09-11

Applicant: DENSO CORP

Inventor： HIROSE SHINICHI ,  HARADA YOSHIHARU

IPC: C23C30/00 ,  H01L23/50 ,  H01L25/00

Abstract: PROBLEM TO BE SOLVED: To assure connection reliability of each section of an IC package with a built-in chip capacitor for an IC chip of higher power. SOLUTION: A heatsink 20 on which an IC chip 10 is mounted is connected to a lead frame 30 on which a chip capacitor 50 is mounted with a conductive adhesive using a bonding wire 80 of Al. A mold resin 40 is used for sealing to enclose the heatsink, the IC chip, the bonding wire, and the lead frame. The entire one face of the lead frame 30 is plated with Ni, with the bonding wire 80 connected to the surface of Ni plating. A section of one face of the lead frame 30 where a conductive adhesive is arranged is placed with Ag, with the capacitor 50 bonded to the surface plated with Ag through the conductive adhesive.

公开(公告)号：JP2000223895A

公开(公告)日：2000-08-11

申请号：JP1885399

申请日：1999-01-27

Applicant: DENSO CORP

Inventor： NAGATANI TOSHIHIRO ,  IWAMIYA HIROKI ,  HARADA YOSHIHARU

IPC: H05K13/04

Abstract: PROBLEM TO BE SOLVED: To prevent pin connections from receiving burdens from the displacement of each connected member caused by expansion and contraction in an electronic parts connecting structure using an aligning member which aligns a plurality of pins electrically connecting electronic parts to a printed board. SOLUTION: An aligning member 50 is provided with a plurality of pin guiding sections 51 each of which has a hole 20 for inserting a pin 20 and is aligned separately from the other sections 51 and a frame section 52 which holds the pin guiding sections 51 in connected states and controls the aligned states of the sections 51. After the other ends of the pins 20 one ends of which are connected to electronic parts are respectively inserted into the holes of the pin guiding sections 31 and connected to a printed wiring board 30 in an aligned state, the frame section 52 is removed from the pin guiding sections 51 by cutting the connecting sections of the frame section 52 for the pin guiding sections 51.

公开(公告)号：JP2008282904A

公开(公告)日：2008-11-20

申请号：JP2007124299

申请日：2007-05-09

Applicant: Denso Corp ,  株式会社デンソー

Inventor： SANADA SUKENORI ,  IMAIZUMI NORIHISA ,  HARADA YOSHIHARU

IPC: H01L23/28 ,  H01L21/56

CPC classification number: H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/00014

Abstract: PROBLEM TO BE SOLVED: To connect leads by welding from both surface sides of one surface and the other surface of a molding resin in an outer leadless type molded package. SOLUTION: In the outer leadless type molded package 100, the undersides 32 of leads 30 are exposed to a peripheral section in the underside 42 of the molding resin 40. In the outer leadless type molded package 100, the peripheral section of the top face 41 of the molding resin 40 is formed in a notched shape on the top face 41 side of the molding resin 40. In the outer leadless type molded package 100, parts of the top faces 31 of the leads 30 are configured as exposed sections 31a exposed on the top face 41 side of the molding resin 40 through the notched section. COPYRIGHT: (C)2009,JPO&INPIT

Abstract translation: 要解决的问题：通过外部无引线型模制包装中的一个表面和模制树脂的另一个表面的两个表面侧的焊接来连接引线。 解决方案：在外部无引线型模制封装100中，引线30的下侧32暴露于模制树脂40的下侧42中的周边部分。在外部无引线型模制封装100中， 模制树脂40的顶面41在模制树脂40的顶面41侧上形成为切口形状。在外部无引线型模制包装100中，引线30的顶面31的一部分被构造为暴露部分 31a通过切口部分暴露在模制树脂40的顶面41侧上。 版权所有（C）2009，JPO＆INPIT