公开(公告)号：JP2019028031A

公开(公告)日：2019-02-21

申请号：JP2017150975

申请日：2017-08-03

Applicant: SOKEN INC ,  DENSO CORP

Inventor： MATSUMOTO TAKAFUMI ,  MATSUI HIROHITO ,  OZAKI YUKIKATSU ,  KAMIYA YASUTAKA

IPC: G01P5/12 ,  G01P13/00

Abstract: 【課題】熱伝導体の表面に配置された感温素子を用いて風速または風向を検出する技術において、周囲の熱源による外乱を低減する。【解決手段】風向風速計は、熱を伝導可能な熱伝導体2と、熱伝導体2の表面に配置される感温素子3−3、3−11と、感温素子3−3、3−11が検出した温度に基づいて、空気の風向および風速を検出する計測部と、感温素子3−3、3−11と処理部とを電気的に繋ぐ複数個の配線6と、赤外線反射部材25とを備える。赤外線反射部材25は、熱伝導体2の表面のうち、感温素子3−3、3−11が配置されている部分でも配線6が配置されている部分でもない部分を覆うと共に熱伝導体2よりも、赤外線によって運ばれるエネルギーの反射率が高い。【選択図】図4

公开(公告)号：JP2002299823A

公开(公告)日：2002-10-11

申请号：JP2001101609

申请日：2001-03-30

Applicant: DENSO CORP

Inventor： MIYAGE KATSUYUKI ,  KAMIYA YASUTAKA

IPC: H05K1/14 ,  H05K3/46

Abstract: PROBLEM TO BE SOLVED: To make the number of wiring layers different between the dense complicated portion and simple portion of a wiring constitution to be applied in a wiring board for gauge. SOLUTION: In the wiring board P for gauge, a flexible printed board 60 is provided with a thermoplastic resin plate 60a, a plurality of lines of wiring 60c formed on the plate 60a, another thermoplastic resin plate 60b provided on the plate 60a through the wiring 60c, and a plurality of lines of wiring 60d formed on the plate 60c. A CPU 71 is connected to its peripheral control circuit elements through the corresponding wiring 60d on the resin plate 60c. Each driving circuit for each rotary internal machine is connected to its corresponding wiring 60c on the resin plate 6a and the driving circuits are connected to the CPU 71 and their corresponding peripheral control circuit elements through the wiring 60c and 60d.

公开(公告)号：JP2002290047A

公开(公告)日：2002-10-04

申请号：JP2001086024

申请日：2001-03-23

Applicant: DENSO CORP

Inventor： KADOOKA KAZUKI ,  KAMIYA YASUTAKA

IPC: H05K3/40 ,  H05K3/36 ,  H05K3/46

Abstract: PROBLEM TO BE SOLVED: To provide a manufacturing method of a printed board wherein its connective reliability can be prevented from so reducing that its conductive paste is peeled in its via hole due to the deformation of its via hole when its layers are connected with each other. SOLUTION: In the manufacturing method of the printed board comprising two layers wherein single-sided conductor-pattern films are laminated, heated, and pressed, a land portion 32a of a conductor pattern 32 of the single-sided conductor-pattern film which is the lower layer of the two layers and is located under a via hole 24 is so formed that a plurality of recessed portions 32b are arranged in its peripheral portion. Therefore, when heating and pressing the printed board, even though the resin film of the periphery of the via hole 24 is deformed, the deformed film so penetrates the space portions formed out of the recessed portions 32b as to make reducible the deformation amount of the via hole 24.

公开(公告)号：JP2004047552A

公开(公告)日：2004-02-12

申请号：JP2002200089

申请日：2002-07-09

Applicant: Denso Corp ,  株式会社デンソー

Inventor： TAKEUCHI SATOSHI ,  KAMIYA YASUTAKA ,  TAKAHIRA MOTOKI

IPC: H05K1/05 ,  H05K1/18

Abstract: PROBLEM TO BE SOLVED: To provide a metal base printed circuit board which can reduce the stress-strains generated, when the temperature of the printed circuit board is changed and can prevent breakdown of the soldered portion.
SOLUTION: In the metal base printed circuit board, where an electronic component 1 is mounted on the board surface, a spot-facing portion 51 is formed by partially removing the area directly under the electronic component 1 of the metal base 5 as a heat sink. A length 1 of this spot-facing portion is set longer than a distance A between both end portions of a land portion 31 of a copper wiring 3, on which an electronic component is mounted and depth d of the spot-facing portion is set properly to almost a half of the thickness c of the heat sink 1. Accordingly, generation of stress-strain of the soldered portion 2, based on the difference in the thermal expansion resulting from the difference in materials, can be reduced.
COPYRIGHT: (C)2004,JPO

公开(公告)号：JP2004031778A

公开(公告)日：2004-01-29

申请号：JP2002187905

申请日：2002-06-27

Applicant: Denso Corp ,  株式会社デンソー

Inventor： KAMIYA YASUTAKA ,  OTSUKI YOSHITERU

IPC: H05K3/46

Abstract: PROBLEM TO BE SOLVED: To provide a printed board that can prevent the reliability of interlayer connection from being deteriorated by air left in via holes as voids at the time of performing the interlayer connection, and to provide a method of manufacturing the board.
SOLUTION: The printed board 100 is obtained by laminating a single-sided conductive pattern film 21 having the via holes 24 and another single-sided conductive pattern film 31 and heat-pressing the films 21 and 31. At the time of laminating the films 21 and 31 upon another, the lands 22a of the conductor pattern 22 are brought into contact with the lands 32a of the conductor pattern 32. Then the lands 22a are connected to the lands 32a by arranging conductive paste 50 on the via holes 24 of the printed board 100 and heating the paste 50. Since no insulating layer is exposed between the lands 22a and 32a, air can be prevented from being left in the via holes 24 as voids.
COPYRIGHT: (C)2004,JPO

公开(公告)号：JP2002280733A

公开(公告)日：2002-09-27

申请号：JP2001078732

申请日：2001-03-19

Applicant: DENSO CORP

Inventor： KADOOKA KAZUKI ,  KAMIYA YASUTAKA

IPC: H05K3/40 ,  H05K3/36 ,  H05K3/46

Abstract: PROBLEM TO BE SOLVED: To provide a printed board manufacturing method capable of preventing air from being left as voids in a viahole so as not to reduce the viahole in connection reliability when an interlayer connection is made through the viahole. SOLUTION: A single-sided conductor pattern film 21 provided with a viahole 24 and a single-sided conductor pattern film 31 are laminated and formed into a printed board 100 by thermocompression bonding. A conductive paste layer 50 is disposed on the viahole 24 provided to the printed board 100 and heated to connect a conductor pattern 22 to a conductor pattern 32. At this point, the viahole 24 is 0.5 mm or above in diameter, and the depth D of a resin film part into which the conductive paste 50 flows is set at 100 μm or below, so that air can be prevented from being left as voids inside the viahole 24.

公开(公告)号：JP2013238453A

公开(公告)日：2013-11-28

申请号：JP2012110587

申请日：2012-05-14

Applicant: Nippon Soken Inc ,  株式会社日本自動車部品総合研究所 ,  Denso Corp ,  株式会社デンソー

Inventor： MATSUI HIROHITO ,  HOSOI TSUTOMU ,  YORINAGA MUNEO ,  KATAGIRI MAKOTO ,  MIYATA DAISUKE ,  KAMIYA YASUTAKA

IPC: G01R33/02

Abstract: PROBLEM TO BE SOLVED: To provide a magnetic sensor that precisely measures magnetic flux density.SOLUTION: A magnetic sensor 10 includes a magnetic flux density sensor 15 for measuring magnetic flux density, and a magnetic field sensor 14 for measuring a magnetic field. The magnetic field sensor 14 includes one magnetic field detection element 20a, 20c arrange on a measure surface where the magnetic field is measured, and one or a plurality of magnetic field detection elements 20b, 20d arranged on a side opposite the measure surface with respect to the one magnetic field detection element. The magnetic flux density sensor 15 includes four probes 30a-30d, a first elastic body 31 for biasing the four probes, and second elastic bodies 32 arranged between each of the four probes 30a-30d and the first elastic body 31.

Abstract translation: 要解决的问题：提供精确测量磁通密度的磁传感器。解决方案：磁传感器10包括用于测量磁通密度的磁通密度传感器15和用于测量磁场的磁场传感器14。 磁场传感器14包括设置在测量磁场的测量表面上的一个磁场检测元件20a，20c和相对于测量表面相对设置的一个或多个磁场检测元件20b，20d 一个磁场检测元件。 磁通密度传感器15包括四个探针30a-30d，用于偏置四个探针的第一弹性体31和布置在四个探针30a-30d和第一弹性体31中的每一个之间的第二弹性体32。

公开(公告)号：JP2004031779A

公开(公告)日：2004-01-29

申请号：JP2002187906

申请日：2002-06-27

Applicant: Denso Corp ,  株式会社デンソー

Inventor： KAMIYA YASUTAKA ,  OTSUKI YOSHITERU

IPC: H05K1/11 ,  H05K3/00 ,  H05K3/46

Abstract: PROBLEM TO BE SOLVED: To provide a multilayered circuit board that can reduce the design man-hour for circuit arrangement, is high in degree of freedom for design, and is inexpensive; and to provide a method of manufacturing the circuit board. SOLUTION: In the multilayered circuit board 200 which is a component of a product having a plurality of designs and in which an electric circuit 120 divided into blocks classified by function is formed, the electric circuit 120 is classified into a modifiable circuit block for design 222 in which a wiring pattern is changed depending upon the design of the product, and a fixed circuit block 221 in which a wiring pattern is commonly used regardless of the design of the product. Upon a circuit board 202 on which the wiring pattern 232 corresponding to the modifiable circuit block for design 222 is formed, a circuit board 201 is laminated on which the wiring pattern 231 corresponding to the fixed circuit block 221 is formed. COPYRIGHT: (C)2004,JPO

公开(公告)号：JP2003273511A

公开(公告)日：2003-09-26

申请号：JP2002100113

申请日：2002-04-02

Applicant: Denso Corp ,  株式会社デンソー

Inventor： HARADA TOSHIICHI ,  KAMIYA YASUTAKA ,  NAKAMURA KAZUYOSHI ,  SAKAI YOSHIAKI ,  KAJINO HIDETADA ,  ASANUMA SHINTARO

IPC: B29C43/18 ,  B29C43/20 ,  B29C43/32 ,  B29L9/00 ,  H05K1/11 ,  H05K3/28 ,  H05K3/40 ,  H05K3/46

Abstract: PROBLEM TO BE SOLVED: To bond a plurality of resin films in a batch by a heading/pressurizing process by preventing the occurrence of displacement in a conductor pattern formed on a resin film. SOLUTION: A plurality of single-sided conductor pattern films 21 are laminated, and heated/pressurized from both sides so that the conductor pattern films 21 can be bonded to each other to form a multi-layer board 100. In heating/ pressurizing those conductive pattern films, members 12a and 12b for press having buffering effects are interposed between thermal press boards 10a and 10b and the single-sided conductor pattern films 21. Thus, pressures to be applied to the respective parts of the laminated single-sided conductor pattern films 21 can be made almost uniform. Therefore, the whole laminated single-sided conductive pattern films 21 are almost simultaneously deformed so that the displacement in a conductor pattern 22 formed on each of those films 21 can be prevented. COPYRIGHT: (C)2003,JPO

Abstract translation: 要解决的问题：通过防止在形成在树脂膜上的导体图案中发生位移，通过航向/加压工艺来批量地粘合多个树脂膜。 解决方案：多个单面导体图案膜21被层叠并从两侧加热/加压，使得导体图案膜21可以彼此接合以形成多层板100.在加热/ 对这些导电图案膜进行加压，在热压板10a和10b与单面导体图案膜21之间插入具有缓冲效果的用于压制的构件12a和12b。因此，施加到层压单面的各个部分的压力 可以使导体图案膜21几乎均匀。 因此，整个层叠的单面导电图案膜21几乎同时变形，从而可以防止形成在每个膜21上的导体图案22中的位移。 版权所有（C）2003，JPO

公开(公告)号：JP2003037361A

公开(公告)日：2003-02-07

申请号：JP2001222060

申请日：2001-07-23

Applicant: Denso Corp ,  株式会社デンソー

Inventor： HARADA TOSHIICHI ,  KAMIYA YASUTAKA

IPC: H05K3/46

Abstract: PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayer board, where laminated resin films can be prevented from getting out of position, and the laminated conductor patterns of the multilayer board are surely interconnected. SOLUTION: Laminated resin films 23 are partially melted by heating so as to be temporarily fixed before the resin films 23 are positioned, laminated, and bonded together through a thermocompression bonding process in a case of laminating resin films 23 of thermoplastic resin into a multilayer board 10. By this setup, the laminated resin films 23 can be easily, surely, and temporarily fixed, so that the laminated resin films 23 can be prevented from getting out of position.

Abstract translation: 要解决的问题：提供一种制造多层板的方法，其中可以防止层压树脂膜脱离位置，并且多层板的层压导体图案可靠地互连。 解决方案：在将热塑性树脂的树脂薄膜23层合成多层板的情况下，通过加热将层压树脂薄膜23部分熔融，以便在树脂薄膜23定位，层压和粘接在一起之前暂时固定， 通过该设置，可以容易且可靠地暂时地固定层叠树脂膜23，从而可以防止层叠树脂膜23脱离位置。