Abstract:
PROBLEM TO BE SOLVED: To provide a method of effectively reducing the size of an ignition coil which comprises a coil case for storing a coil section, and a connector having a connector terminal to be electrically connected to the coil section. SOLUTION: Inside a shell 7 of a connector 5, a pin 31 extended at the center of an opening 13a is inserted, and a terminal 41 is formed in an end face of an igniter 11 at the opening section 13a side of the coil case 3. A second flat section 33 and a flat section 41a are formed in a base end (opening 13a side) of the pin 31 and in the terminal 41 respectively in parallel with the insertion direction of the pin 31 and with the storage direction of the igniter 11 respectively, are connected to each other by projection welding, and then are molded by resin. Due to this structure, the inside of the opening 13a can be effectively used, resulting in the reduction in size.
Abstract:
PROBLEM TO BE SOLVED: To miniaturize a circuit enclosure by integrally disposing a connector near the opening section of a circuit housing section and arranging a connector terminal perpendicularly to the direction of the housing of a circuit to the circuit housing section. SOLUTION: A coil case is molded integrally with the shell 7 of a connector 5 with resin. Four pins 31 extended to the center of an opening section 13a are inserted into the shell 7, and four terminals 41 are formed to the opening surface of an igniter 11. Second plane sections 33 are formed in parallel with the direction of the insertion of the pins 31 and the direction of the housing of the igniter 11 in the base end sections (the opening 13a sides) of the pins 31 and plane sections 41a in each terminal 41 respectively, and the plane sections 33 and the plane sections 41a are connected mutually by welding. Accordingly, the insides of the opening sections 13a can be utilized effectively while conductive paths from the terminals 41 to the front ends of the pins 31 are shortened, and the coil case can be miniaturized.
Abstract:
PROBLEM TO BE SOLVED: To provide a cart capable of preventing any damage such as crack or chip in an object A to be conveyed. SOLUTION: The cart comprises a cart base 10, wheels 20 mounted on a lower part of the cart base 10, and vibration absorbing and damping means 30 which are mounted on an upper part of the cart base 10 and loaded with the object A and capable of suppressing the vibration propagated to the object A. Four vibration absorbing and damping means 30 as one set are provided on the front and rear sides and right and left sides. At least one set is provided. The vibration absorbing and damping means 30 comprises a coil spring 31, a bellows 32, an upper end plate 33 and a lower end plate 34. A throttling hole 35 for regulating (throttling) the distribution amount of air inside the bellows 32 is formed in the lower end plate 34. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To prevent void connection of soldering and improve reliability of the connection. SOLUTION: BGA (Ball Grid Array) component 21 comprises a grid of bump solder and are connected to the first and second pad, 33 and 34, of the multilayer wiring board 22 by the solder connection 25. The first pad 33 positioned in the outside 2 row is connected to the surface conductor pattern 29. The second pad 34 positioned inside of the pad 33 is connected to the concave viahole formed nearby through the connection 36 and connected to the inner layer conductor pattern 30. The viahole 35 is disposed at an angle of 45 deg. from the second pad 34 and disposed between the pad 33 and 34. The periphery of the connection 36 and viahole 35 is covered by the solder resist 37. As the surface of the first and second pad, 33 and 34, are flat no air is left and the cream solder is printed.
Abstract:
PROBLEM TO BE SOLVED: To improve the connection reliability of soldered joints by preventing the occurrence of voids in the joints. SOLUTION: BGA(ball grid array) parts 21 on which solder bumps are arranged in a grid-like state are connected to the first and second pads 33 and 34 of a multilayered wiring board 22 through soldered joints 25. The first pads 33 which are arranged in two rows on the outside are constituted in surface solid pads connected to a surface conductor pattern 29. The second pads 34 arranged in two rows on the inside are connected to an internal layer conductor pattern 30 through blind via holes 35 formed through a surface-side insulating layer 27. The sizes of the second pads 34 become larger than those of the first pads 33, but the sizes of the exposed parts of the pads 34 are made equivalent to those of the pads 33 with a solder resist 36. The multilayered wiring board 22 is manufactured by a subtractive method. Since both the first and second pads 33 and 34 have flat surfaces, cream solder can be printed on the pads 33 and 34 without leaving any air in the printed solder.
Abstract:
PROBLEM TO BE SOLVED: To curtail a preparation time for detaching a mold from a molding machine and to reduce the defects of a molding. SOLUTION: A method for detaching the mold 5 from the molding machine 1 comprises the honeycomb structure extrusion molding machine 1 and the mold 5 clamped to the mold fitting end surface part 4 of the molding machine 1 by a clamp device 20, wherein the mold 5 is detached from the mold fitting end surface part 4. The mold 5 is unclamped instantaneously from the mold fitting end surface part 4. The mold 5 is slid in the kneaded earth 9 extrusion direction by the residual pressure of the clay paste 9 in the molding machine 1 to separate the mold 5 from the mold fitting end surface part 4. After that, the clay paste 9 of a part connected to the mold 5 and the mold fitting end surface part 4 is cut by sliding the mold 5 along the mold fitting end surface part 4, or by a cutting means of small cutting resistance such as a wire 30, and the mold 5 is detached from the molding machine 1. COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To curtail a working time for fitting a die to a molding machine and to reduce the defects of moldings. SOLUTION: The extrusion molding die 5 is arranged at a position of the same height as that of the fitting position of the die fitting end surface part 4 of the honeycomb structure extrusion molding machine 1. The die 5 is slid at a prescribed height on roller conveyers 21 and 31 along the surface of the die fitting end surface part 4 and stopped at a prescribed horizontal position of the die fitting end surface part 4 by a stopper 13, After that, the die 5 is fixed uniformly and firmly over the entire circumference to the mold fitting end surface part 4 by a clamp device 40. COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide an extrusion-molding apparatus capable of achieving more stabilization of a shape of an extrusion-molded body by making a velocity of a ceramic material in a resistance pipe uniform, and coping with molding the molded bodies of various shapes without a change of the shape of the resistance pipe. SOLUTION: The extrusion-molding apparatus 1 includes a molding die 3 attached to a tip end of an approximately annular pipe-like barrel 13 via the resistance pipe 14, and a screw 12 kneading the ceramic material 4 supplied from the base end of the barrel 13 in the barrel 13 and force-feeding it to the molding die 3, and extrudes the ceramic material 4 from the molding die 3 and shapes the ceramic molded body 42 wherein the inner diameter of the resistance pipe 14 is constant. COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide an extrusion molding apparatus which quickly stabilizes the temperature of a ceramic material and reduces the waste of the material and a method for producing a honeycomb structure of high productivity using the apparatus. SOLUTION: The extrusion molding apparatus 1 includes a mold 3 fitted to the tip of an approximately circular tube-shaped barrel 13 via a resistance tube 14, a screw 12 which kneads the ceramic material 4 charged from the base end of the barrel 13 in the barrel 13 and pressure feeds it toward the mold 3, and material temperature adjustment means 17 and 18 which adjust the temperature of the ceramic material 4 from the circumferences of the barrel 13 and the resistance tube 14 by using heat media 131 and 141; and molds a ceramic molding 42 in a desired shape by extruding the ceramic material 4 from the mold 3. A plurality of heat exchanging parts 132 and 142 for heat-exchanging between the heating media 131 and 141 and the ceramic material 4 are set, and heat exchange is carried out independently in the respective heat exchange parts 132 and 142. COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a method for jointing a connector 6, capable of securing jointing strength and position accuracy without using components unnecessary for product performance. SOLUTION: A jointing element 6b is annularly provided in a seat face side of the connector 6 for piping connection. The jointing element 6b is formed to have a tapered shape such that the thickness is gradually reduced toward the tip side, and a projecting part 6c is provided in the tip part. On a flat outer peripheral face of a common rail 1, a ring-shaped groove 1b ruggedly fitted into the projecting part 6c of the connector 6 is formed. Due to the above construction, the connector 6 is positioned in a predetermined position of the common rail 1 by fitting the projecting part 6c of the connector 6 into the ring-shaped groove 1b formed on the common rail 1. In addition, since the thickness of the jointing element 6b is gradually reduced toward the tip side in which the projecting part 6c is provided, sufficient jointing strength can be obtained by increasing current density by concentration of a current on the projecting part 6c. COPYRIGHT: (C)2006,JPO&NCIPI