公开(公告)号：JP2003332502A

公开(公告)日：2003-11-21

申请号：JP2002134450

申请日：2002-05-09

Applicant: Denso Corp ,  株式会社デンソー

Inventor： TAKEUCHI SATOSHI ,  MIYAKE TOSHIHIRO ,  AOYAMA MASAYUKI

IPC: H01L23/36 ,  H01L23/40

CPC classification number: H01L2224/16

Abstract: PROBLEM TO BE SOLVED: To provide a printed board with a heat sink wherein heat generated from a semiconductor chip 2 can be effectively conducted to the heat sink 3, and it is prevented that electric connection between the semiconductor chip 2 and copper wiring 6 is separated by thermal stress. SOLUTION: In the printed board with a heat sink wherein the semiconductor chip is mounted in a resin part of the printed board, and wiring is connected with an electrode bump of the semiconductor chip, the wiring of the semiconductor chip is arranged on the side opposite to the heat sink. COPYRIGHT: (C)2004,JPO

Abstract translation: 要解决的问题：为了提供具有散热器的印刷电路板，其中从半导体芯片2产生的热可以有效地传导到散热器3，并且防止了半导体芯片2和铜布线之间的电连接 6由热应力分离。 解决方案：在具有散热器的印刷电路板中，半导体芯片安装在印刷电路板的树脂部分中，并且布线与半导体芯片的电极凸块连接，半导体芯片的布线布置在 与散热器相对的一侧。 版权所有（C）2004，JPO

公开(公告)号：JPH11233926A

公开(公告)日：1999-08-27

申请号：JP3174698

申请日：1998-02-13

Applicant: DENSO CORP

Inventor： KONDO KENJI ,  AOYAMA MASAYUKI ,  TSUKAMOTO AKIRA

IPC: H05K3/34 ,  H01L21/60 ,  H05K1/18

Abstract: PROBLEM TO BE SOLVED: To enable formation of a drum-shaped bump in a required region without increasing the number of steps, such as a step of applying an adhesive for securing a gap between an electronic component and a mounting board. SOLUTION: An electronic component 2 is prepared of which, of electrodes 1 arranged in an array, a corner electrode 1a located at each corner has a greater area than a non-corner electrode 1b. After solder balls of sizes equivalent to respective first electrodes 1 including the corner electrode 1a are attached to the respective first electrodes 1, the solder balls are melted to form solder bumps. At this time, the absolute quantity of solder with respect to the area of the corner electrode 1a becomes smaller than the absolute quantity of solder with respect to the area of the other electrode 1b. Then, after a ball grid array(BGA) package 2 is mounted on a multilayered printed wiring board, the solder bumps are melted to joint the electrodes 1 with electrodes formed on the multilayer printed wiring board.

公开(公告)号：JPH1197574A

公开(公告)日：1999-04-09

申请号：JP25556897

申请日：1997-09-19

Applicant: DENSO CORP

Inventor： KONDO KENJI ,  AOYAMA MASAYUKI ,  KONDO KOJI

IPC: H01L21/60 ,  H01L23/12 ,  H05K1/11 ,  H05K3/34

Abstract: PROBLEM TO BE SOLVED: To provide a package structure which can prevent a contact failure by preventing a solder bump from being stripped out of the electrode on the backside of a BGA package even if an external shock is applied thereto. SOLUTION: In an outermost electrode 11a at the outer periphery of a plurality of electrodes 11 arranged in an array on the backside of an interposer 3, its contact part with a solder bump 8 ends at the outermost periphery thereof. To be specific, the outermost electrode 11a is not covered with solder resist 13. In this arrangement, the solder bump 8 is bonded not only to the surface of the outermost electrode 11a but also to the end of the outermost periphery, and hence the solder bump 8 is bonded more strongly than it ends in the electrodes. This can prevent the solder bump 9 from being stripped out of the outermost electrode 11a by an external impact and hence prevent a contact failure.

公开(公告)号：JP2017115651A

公开(公告)日：2017-06-29

申请号：JP2015250771

申请日：2015-12-23

Applicant: 株式会社デンソー ,  Denso Corp

Inventor： AOYAMA MASAYUKI

IPC: F02D41/18 ,  F02D45/00

Abstract: 【課題】吸気通路に脈動が生じている場合でも、精度の高い充填空気量を取得してエンジンを適正に制御することができるエンジン制御装置を提供する。【解決手段】エンジン制御装置10は、吸気通路において気筒よりも上流側に配置され吸気通路の物理量を検出する検出装置と、吸気弁の開閉時期を調整する吸気弁駆動装置と、を備えるエンジンを制御する。このエンジン制御装置10は、検出装置からの検出値に基づいて吸気通路の検出流量を取得する流量取得部11と、吸気通路における脈動の増幅度に基づいて、検出流量を補正する補正部14と、補正後の検出流量に基づいて、気筒の充填空気量を取得する充填空気量取得部25と、を有する。【選択図】図2

公开(公告)号：JP2006190901A

公开(公告)日：2006-07-20

申请号：JP2005002944

申请日：2005-01-07

Applicant: Denso Corp ,  株式会社デンソー

Inventor： KAWABATA AKIRA ,  KAMIMURA RIKIYA ,  AOYAMA MASAYUKI

IPC: H05K1/18 ,  H01L23/12 ,  H05K1/11 ,  H05K1/16

CPC classification number: H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/13091 ,  H01L2924/15174 ,  H01L2924/15184 ,  H01L2924/00014 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To provide a circuit board having a high heat dissipation property and a method of manufacturing the same, and also to provide an electronic circuit device. SOLUTION: The circuit board 100 comprises a ceramic substrate 10, thermoplastic resins 20a and 20b, heating circuit element 30, IC 40, etc. On the ceramic substrate 10, a conductor pattern 11 is formed and the heating circuit element 30 such as MOSFET which generates heat in a conducting state is mounted via the conductor pattern 11. On the ceramic substrate 10 whereon the conductor pattern 11 and the heating circuit element 30 are formed, the thermoplastic resins 20a and 20b are stacked wherein a conductor pattern 21 and an interlayer connecting portion 22 are formed. On the thermoplastic resin 20b, a circuit element such as IC 40 is mounted. COPYRIGHT: (C)2006,JPO&NCIPI

Abstract translation: 要解决的问题：为了提供具有高散热性的电路板及其制造方法，并且还提供一种电子电路装置。 电路板100包括陶瓷基板10，热塑性树脂20a和20b，加热电路元件30，IC 40等。在陶瓷基板10上，形成导体图案11，并且加热电路元件30 因为通过导体图案11安装产生导通状态的热的MOSFET。在形成导体图案11和加热电路元件30的陶瓷基板10上层叠热塑性树脂20a，20b，其中导体图案21和 形成层间连接部22。 在热塑树脂20b上安装诸如IC40的电路元件。 版权所有（C）2006，JPO＆NCIPI

公开(公告)号：JP2000114315A

公开(公告)日：2000-04-21

申请号：JP27608098

申请日：1998-09-29

Applicant: DENSO CORP

Inventor： AOYAMA MASAYUKI ,  MATSUNAGA YASUAKI ,  AKITA NAOYUKI ,  KONDO KOJI ,  HIRAMATSU TOMOYUKI

IPC: H05K1/18 ,  H01L21/60 ,  H01L23/12 ,  H01L23/498 ,  H05K3/34

Abstract: PROBLEM TO BE SOLVED: To prolong the service lives of solder bumps which bond a BGA(ball grid array) package to a multilayered printed wiring board. SOLUTION: Of outermost peripheral electrodes 3b and 3c in an array-like arrangement, arranged in such a way that the end sections of the electrodes 3b and 3c positioned to the outermost side of the array-like arrangement, are positioned to the outer side of the end sections of outermost peripheral electrodes 1b positioned to the outermost side of the array-like arrangement. More specifically, the surfaces of the electrodes 3b and 3c are made to cross the surfaces of solder bumps 9 at acute angles in the outermost end section of the array-like arrangement. By making a mounting structure for electronic components constructed in this way, the service lives of the solder bumps 9 can be prolonged, because the stresses to the junctions between the electrodes 3b and 3c and solder bumps 9 can be relaxed.

公开(公告)号：JPH11284029A

公开(公告)日：1999-10-15

申请号：JP8201398

申请日：1998-03-27

Applicant: DENSO CORP

Inventor： MATSUNAGA YASUAKI ,  KONDO KENJI ,  AOYAMA MASAYUKI ,  KONDO KOJI

IPC: H05K1/18 ,  H01L21/60 ,  H01L23/12

Abstract: PROBLEM TO BE SOLVED: To provide a mounting structure, which is capable of preventing a contact failure from occurring between a ball grid array(BGA) package and a multilayer printed wiring board, even if an external shocks are given. SOLUTION: Bumps 7, formed of resin balls 7a each coated with a tin plating 7b, are arranged in an array. In this way, the resin balls 7a are each coated with a tin plating 7b for the formation of the bumps 7, and a BGA package 1 and a multilayer printed wiring board 3 are jointed together with the bumps 7, even when a product equipped with the BGA package 1 and the multilayer printed wiring board is dropped down to the floor and given external shocks, the resin balls 7a are elastically transformed by stresses applied to the bumps 7, so that the bumps 7 can be protected against fissures. As a result, contact failures caused by an external shock can be prevented.

公开(公告)号：JPH11274699A

公开(公告)日：1999-10-08

申请号：JP7921898

申请日：1998-03-26

Applicant: Denso Corp ,  株式会社デンソー

Inventor： SUZUKI TADAO ,  AOYAMA MASAYUKI ,  KONDO KOJI

IPC: H05K3/28 ,  H05K3/22 ,  H05K3/24 ,  H05K3/34

Abstract: PROBLEM TO BE SOLVED: To effectively suppress the moisture absorption of an insulation board from between lands and solder resist.
SOLUTION: A Cu conductor pattern is provided on a surface part of an insulation base 15, and the entire surface of the conductor pattern is covered with a solder resist 16 except its land part 14. At that time, the surface of the land part 14 is formed into a rough surface 17 having a high surface roughness, the solder resist 16 is provided in the form of covering the end edges of the land part 14, and the surface roughness (the depth of the irregularity (height difference)) of the rough surface part 17 on the land part 14 surface is 3 μm or more. The rough surface part 17 is formed by applying the satin plating to the land 14 surface or etching the land 14 surface, using specified treating liq.
COPYRIGHT: (C)1999,JPO

Abstract translation: 要解决的问题：有效地抑制绝缘板从焊盘和阻焊剂之间的吸湿。 解决方案：在绝缘基体15的表面部分上设置Cu导体图案，除了其陆部14之外，其余的导体图案的整个表面都被阻焊剂16覆盖。此时，接地部分14的表面 形成具有高表面粗糙度的粗糙表面17，阻焊层16被设置成覆盖陆部14的端缘的形式，并且表面粗糙度（不规则度（高度差）的深度） 陆部14表面上的粗糙表面部分17为3μm以上。 通过使用特定的处理液将缎面镀层施加到焊盘14表面或蚀刻焊盘14表面来形成粗糙表面部分17。

公开(公告)号：JPH1154553A

公开(公告)日：1999-02-26

申请号：JP20472997

申请日：1997-07-30

Applicant: DENSO CORP

Inventor： KONDO KOJI ,  AOYAMA MASAYUKI ,  TAKEMOTO MASANORI

IPC: H01L21/60 ,  H01L23/12 ,  H05K1/02 ,  H05K1/11 ,  H05K3/34

Abstract: PROBLEM TO BE SOLVED: To prevent a defective contact of an electronic part and a mounting substrate by preventing the stripping of a solder bump from an electrode. SOLUTION: An outermost surface of a circuit wiring 6 formed on the surface of an interposer 5 bonded to a solder bump 9 is formed of ductility metal. That is to say, when the junction interface of the circuit wiring 6 and the solder bump 9 is formed of an alloy layer comprising metal having ductility, the alloy at the junction interface of the circuit wiring 6 and the solder bump 9 is not broken by stress, and the stripping of the solder bump 9 from the junction interface can be prevented. Thus, the defective contact between a BGA(ball grid array) package 1 and a multi-layer printed wiring substrate 3 can be prevented. In detail, in the circuit wiring 3, the part in junction with the solder bump 9 is constituted of copper, tin or palladium.

公开(公告)号：JPH10112581A

公开(公告)日：1998-04-28

申请号：JP15850697

申请日：1997-06-16

Applicant: DENSO CORP

Inventor： TAKEMOTO MASANORI ,  OSHIRO MASARU ,  AOYAMA MASAYUKI ,  KONDO KENJI ,  YOSHINO MUTSUMI

IPC: H05K3/34 ,  H05K3/30

Abstract: PROBLEM TO BE SOLVED: To make possible soldering of all the leads of an electronic component by surely absorbing the variations of its leads, even when there exist the variations in the heights of its leads for its soldering to a board. SOLUTION: Interposing an adsorbent between an electronic part 100, its main body 101 and a board 200, the viscosity of the adsorbent is made reductive when heating the solder. That is, in the case of soldering, expanding the adsorbent along the whole surface of the board 200 and electronic component 100, as a result, the electronic component 100 is attracted to the side of the board 200 by the capillary force of the adsorbent to deform leads 102 by this attractive force and absorb the variations in the heights of the leads 102.