公开(公告)号：JP2011228638A

公开(公告)日：2011-11-10

申请号：JP2011028680

申请日：2011-02-14

Applicant: Denso Corp ,  株式会社デンソー

Inventor： TONOMOTO MASAYA

IPC: H01L23/473 ,  H01L25/07 ,  H01L25/18

CPC classification number: H01L23/473 ,  H01L23/4012 ,  H01L23/4334 ,  H01L25/072 ,  H01L25/117 ,  H01L2224/291 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/014 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To relax the fact that the temperature of a semiconductor chip rises more on a lower stream side than on an upper stream side, for effective cooling of the semiconductor chips arranged on upper and lower streams.SOLUTION: A lower arm side whose heat resistance is low is positioned on the lower stream of a coolant flow. By this, the lower arm positioned on the lower stream side has higher cooling efficiency than an upper arm positioned on the upper stream side of the coolant flow. So, first and second semiconductor chips 8a and 8b arranged on the upper and lower streams can be effectively cooled by suppressing rising of a coolant temperature on the upper stream side. Otherwise, the semiconductor chips 8a and 8b arranged on the upper and lower streams can be effectively cooled by performing sufficient cooling based on a high cooling efficiency on the lower stream side even if the coolant temperature rises on the upper stream side. Therefor, in a semiconductor module 4 in which the semiconductor chips 8a and 8b are arranged side by side on the upper and lower streams of the coolant flow, rising of temperature of the semiconductor chips is relaxed on the lower stream side more than on the upper stream side.

Abstract translation: 要解决的问题：为了放松半导体芯片的温度在下游侧比在上游侧上升更多的事实，为了有效地冷却布置在上流和下流上的半导体芯片。

解决方案：耐热性低的下臂侧位于冷却剂流的下游。 由此，位于下游侧的下臂具有比位于冷却剂流的上游侧上的上臂更高的冷却效率。 因此，通过抑制上游侧的冷却剂温度上升，可以有效地冷却配置在上下流上的第一和第二半导体芯片8a，8b。 否则，即使在上游侧的冷却剂温度上升，也可以通过在下游侧基于高的冷却效率进行充分的冷却来有效地冷却配置在上下流上的半导体芯片8a，8b。 因此，在半导体模块4中，其中半导体芯片8a和8b并排设置在冷却剂流的上部和下部流上，半导体芯片的温度升高在下游侧比在上部 流边。 版权所有（C）2012，JPO＆INPIT

公开(公告)号：JP2011172314A

公开(公告)日：2011-09-01

申请号：JP2010031253

申请日：2010-02-16

Applicant: Denso Corp ,  株式会社デンソー

Inventor： KURIHARA TAKASHI ,  TONOMOTO MASAYA ,  OKAMURA MAKOTO

IPC: H02M7/48

Abstract: PROBLEM TO BE SOLVED: To provide a power conversion apparatus, capable of connecting a power terminal with a bus bar easily and reliably. SOLUTION: A power conversion apparatus is constituted by stacking a plurality of semiconductor modules 2 each having switching elements for constituting a power converting circuit and a plurality of cooling pipes 31 each cooling the plurality of semiconductor modules 2 alternately, and includes a bus bar 4 for electrically connecting the plurality of semiconductor modules 2 with outside. Each semiconductor module 2 includes a power terminal 22 to be connected with the bus bar 4, and the bus bar 4 includes a supporting plate 5 and a slide plate 6 which is piled on the supporting plate 5 and can slide on the supporting plate 5. The power terminal 22 is sandwiched and connected by the first risers 513 and 523 of the supporting plate 5 and the second risers 613 and 623 of the slide plate 6. COPYRIGHT: (C)2011,JPO&INPIT

Abstract translation: 要解决的问题：提供能够容易且可靠地将电源端子与母线连接的电力转换装置。 解决方案：电力转换装置通过堆叠多个半导体模块2构成，每个半导体模块2具有用于构成功率转换电路的开关元件和多个冷却多个半导体模块2的冷却管31，并且包括总线 条4用于将多个半导体模块2与外部电连接。 每个半导体模块2包括要与母线4连接的电源端子22，汇流条4包括一个支撑板5和一个滑动板6，该板6堆叠在支撑板5上并且能够在支撑板5上滑动。 电源端子22被支撑板5的第一上升板513和523以及滑板6的第二上升板613和623夹持并连接。（C）2011年，JPO和INPIT

公开(公告)号：JP2010258135A

公开(公告)日：2010-11-11

申请号：JP2009104904

申请日：2009-04-23

Applicant: Denso Corp ,  Nippon Soken Inc ,  株式会社デンソー ,  株式会社日本自動車部品総合研究所

Inventor： ASAKURA FUMIO ,  TONOMOTO MASAYA

IPC: H01L25/07 ,  H01L23/29 ,  H01L23/40 ,  H01L25/18 ,  H02M7/48

CPC classification number: H01L2224/48091 ,  H01L2224/48195 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To provide a semiconductor device for a power conversion for being further miniaturized and having an excellent noise-resistant performance. SOLUTION: The semiconductor device for the power conversion includes a pair of metallic electrode plates 2 (2a and 2b) oppositely arranged at a regular interval. Switching elements 3 electrically connected to a pair of the electrode plates 2 respectively are mounted between a pair of the electrode plates 2. A control circuit board 4 forming a control circuit controlling the switching elements 3 is mounted between a pair of the electrode plates 2. The control circuit board 4 is attached to either one of a pair of the electrode plates 2 through a shielding means 10 shielding electromagnetic noises. COPYRIGHT: (C)2011,JPO&INPIT

Abstract translation: 要解决的问题：提供用于进一步小型化并具有优异的抗噪声性能的功率转换用半导体器件。 解决方案：用于功率转换的半导体器件包括以规则间隔相对布置的一对金属电极板2（2a和2b）。 电连接到一对电极板2的开关元件3安装在一对电极板2之间。形成控制开关元件3的控制电路的控制电路板4安装在一对电极板2之间。 控制电路板4通过屏蔽电磁噪声的屏蔽装置10安装在一对电极板2中的任一个上。 版权所有（C）2011，JPO＆INPIT

公开(公告)号：JP2013021837A

公开(公告)日：2013-01-31

申请号：JP2011154053

申请日：2011-07-12

Applicant: Nippon Soken Inc ,  株式会社日本自動車部品総合研究所 ,  Denso Corp ,  株式会社デンソー

Inventor： TAKAHASHI YOSHIMITSU ,  WAKIMOTO TORU ,  TONOMOTO MASAYA

IPC: H02P27/06 ,  H02M7/48 ,  H02P29/00

Abstract: PROBLEM TO BE SOLVED: To provide a power conversion device that suppresses a surge voltage between windings of a motor without requiring new additional components.SOLUTION: In order to bring a resonance frequency of an LC resonant circuit comprising a stray capacitance C11 of an inverter circuit 10, a parasitic inductance L10 of wiring connecting the inverter circuit 10 to a motor M1, an inductance Lm1 of windings of the motor M1 and a stray capacitance C10 of the motor M1 at a frequency outside a predetermined frequency range out of the frequencies that the inverter circuit 10 can output, at least either the parasitic inductance L10 or the stray capacitance C11 is adjusted. The parasitic inductance L10 and the stray capacitance C10 are used to constitute an existing filter circuit. A common mode current can thus be suppressed without requiring new additional components. An increase in the common mode current due to resonance of the LC resonant circuit can also be suppressed. This suppresses a surge voltage between the phase windings of the vehicle drive motor M1.

Abstract translation: 要解决的问题：提供一种功率转换装置，其抑制电动机绕组之间的浪涌电压，而不需要新的附加部件。 解决方案：为了使包括逆变器电路10的杂散电容C11的LC谐振电路的谐振频率，将逆变器电路10连接到电动机M1的布线的寄生电感L10，绕组的电感Lm1 电动机M1和电动机M1的寄生电容C10在变频器电路10可以输出的频率之外的预定频率范围外的频率，调整寄生电感L10或杂散电容C11中的至少一个。 寄生电感L10和杂散电容C10用于构成现有的滤波电路。 因此可以抑制共模电流，而不需要新的附加组件。 也可以抑制由于LC谐振电路的共振引起的共模电流的增加。 这抑制了车辆驱动电动机M1的相绕组之间的浪涌电压。 版权所有（C）2013，JPO＆INPIT

公开(公告)号：JP2010252461A

公开(公告)日：2010-11-04

申请号：JP2009097559

申请日：2009-04-14

Applicant: Denso Corp ,  株式会社デンソー

Inventor： KIMURA MITSUNORI ,  NARUMI NORITOSHI ,  TONOMOTO MASAYA

IPC: H02M7/48

CPC classification number: H05K7/20927

Abstract: PROBLEM TO BE SOLVED: To provide an electric power converter with reduced temperature rise in a capacitor. SOLUTION: The electric power converter 1 includes a semiconductor module 2 having a semiconductor element integrally and at least a pair of semiconductor terminals 21, a capacitor 3 electrically connected to the semiconductor module 2, and a cooler 4 that thermally contacts at least one of multiple capacitor terminals 31 provided in the capacitor 3. The capacitor terminals 31 that thermally contact the cooler 4 are arranged between the cooler 4 and the capacitor 3. COPYRIGHT: (C)2011,JPO&INPIT

Abstract translation: 要解决的问题：提供一种在电容器中降低温升的电力转换器。 解决方案：电力转换器1包括半导体元件整体的半导体模块2和至少一对半导体端子21，与半导体模块2电连接的电容器3和至少热接触的冷却器4 设置在电容器3中的多个电容器端子31之一。与冷却器4热接触的电容器端子31布置在冷却器4和电容器3之间。版权所有（C）2011，JPO＆INPIT

公开(公告)号：JP2010252460A

公开(公告)日：2010-11-04

申请号：JP2009097558

申请日：2009-04-14

Applicant: Denso Corp ,  株式会社デンソー

Inventor： TONOMOTO MASAYA

IPC: H02M7/48 ,  H02M1/00

Abstract: PROBLEM TO BE SOLVED: To provide a power converter with excellent assemblability and reduced temperature rise in a capacitor. SOLUTION: The power converter 1 includes: a semiconductor module 2 incorporating a semiconductor element and having at least a pair of semiconductor terminals 21; a capacitor 3 having at least a pair of capacitor terminals 31 respectively electrically connected to the semiconductor terminals 21; and a cooler 4 that cools the semiconductor module 2. The semiconductor terminals 21 and the capacitor terminals 31 are brought into direct contact with each other and they are fixed in thermal contact with the cooler 4. COPYRIGHT: (C)2011,JPO&INPIT

Abstract translation: 要解决的问题：提供具有优异的组装性和降低电容​​器温度升高的功率转换器。 电源转换器1包括：半导体模块2，其包含半导体元件并具有至少一对半导体端子21; 电容器3具有分别电连接到半导体端子21的至少一对电容器端子31; 以及冷却半导体模块2的冷却器4.半导体端子21和电容器端子31彼此直接接触并且与冷却器4热接触固定。版权所有（C）2011年， JPO＆INPIT

公开(公告)号：JP2010109062A

公开(公告)日：2010-05-13

申请号：JP2008278209

申请日：2008-10-29

Applicant: Denso Corp ,  株式会社デンソー

Inventor： TONOMOTO MASAYA ,  NARUMI NORITOSHI ,  SAKAI YASUYUKI ,  KIMURA MITSUNORI ,  NOMURA YURIO

IPC: H01L25/07 ,  H01L25/18

CPC classification number: H01L24/33 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2924/13055 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012

Abstract: PROBLEM TO BE SOLVED: To provide a semiconductor module for electric power in which a distance between high-voltage terminals is reduced while sufficiently securing insulation between the terminals.
SOLUTION: The semiconductor module for electric power includes a semiconductor element 2 for electric power, and a first high-voltage terminal 11 and a second high-voltage terminal 12 which are adjacently disposed at a predetermined interval. The semiconductor element 2 for electric power is sealed in a sealing member 3. The first high-voltage terminal 11 and second high-voltage terminal 12 are sealed in the sealing member 3 in such a manner that parts of the terminals excluding predetermined exposed surfaces for terminal connection are covered with an insulating material. A first terminal connection hole 41 is formed in the sealing member 3 to expose the exposed surface 11a of the first high-voltage terminal 11 at a position of predetermined depth from the surface of the sealing member 3, and a second terminal connection hole 42 is formed in the sealing member 3 to expose the exposed surface 12a of the second high-voltage terminal 12 at a position of predetermined depth from the surface of the sealing member 3.
COPYRIGHT: (C)2010,JPO&INPIT

Abstract translation: 要解决的问题：提供一种在充分确保端子之间的绝缘的同时降低高压端子之间的距离的电力用半导体模块。 解决方案：用于电力的半导体模块包括用于电力的半导体元件2和以预定间隔相邻地布置的第一高压端子11和第二高压端子12。 用于电力的半导体元件2被密封在密封构件3中。第一高压端子11和第二高压端子12以这样的方式密封在密封构件3中，使得端子的部分不包括用于 端子连接用绝缘材料覆盖。 第一端子连接孔41形成在密封构件3中，以使第一高压端子11的暴露表面11a在距密封构件3的表面预定深度的位置处露出，第二端子连接孔42 形成在密封构件3中，以在距密封构件3的表面预定深度的位置露出​​第二高压端子12的暴露表面12a。（C）2010，JPO＆INPIT

公开(公告)号：JP2012231593A

公开(公告)日：2012-11-22

申请号：JP2011098111

申请日：2011-04-26

Applicant: Nippon Soken Inc ,  株式会社日本自動車部品総合研究所 ,  Denso Corp ,  株式会社デンソー

Inventor： TAKAHASHI YOSHIMITSU ,  WAKIMOTO TORU ,  TONOMOTO MASAYA

IPC: H02M7/48 ,  H02M1/00

Abstract: PROBLEM TO BE SOLVED: To provide a power conversion device that suppresses a switching surge without requiring new components to be added.SOLUTION: A motor control device 1 includes power wiring 10, a smoothing capacitor 11, an inverter circuit 12 and a control circuit 13. The smoothing capacitor 11 comprises capacitors 110, 111 connected in parallel by parallel connection wiring 112, 113. An inductance Ls1 of the parallel connection wiring 113 and the capacitors 110, 111 are connected in a loop to constitute an LC resonance circuit. At least one of the inductance Ls1 and the capacitance of the capacitors 110, 111 is adjusted such that a resonance frequency of the LC resonance circuit becomes a predetermined frequency to be suppressed out of frequency components included in a surge voltage. The power conversion device can thus suppress a switching surge without requiring new components to be added.

Abstract translation: 要解决的问题：提供抑制开关浪涌而不需要添加新的组件的电力转换装置。 电动机控制装置1包括电力配线10，平滑电容器11，逆变器电路12和控制电路13.平滑电容器11包括由并联连接线112,113并联连接的电容器110,111。 并联连接布线113和电容器110,111的电感Ls1以环路连接构成LC谐振电路。 调整电感Ls1和电容器110,111的电容中的至少一个，使得LC谐振电路的谐振频率成为在浪涌电压中包含的频率成分之外的预定频率。 因此，功率转换装置可以抑制开关浪涌而不需要添加新的组件。 版权所有（C）2013，JPO＆INPIT

公开(公告)号：JP2011211017A

公开(公告)日：2011-10-20

申请号：JP2010078254

申请日：2010-03-30

Applicant: Denso Corp ,  株式会社デンソー

Inventor： TONOMOTO MASAYA

IPC: H01L23/29 ,  H01L23/473 ,  H01L25/07 ,  H01L25/18

CPC classification number: H01L2224/40 ,  H01L2224/40245 ,  H01L2224/83801 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: PROBLEM TO BE SOLVED: To obtain efficient cooling performance by increasing efficiency of the area to be used of a heat sink.SOLUTION: The heat sink 10c bonded to a semiconductor chip 8b of a lower arm is made smaller than the heat sink 10a bonded to a copper block 9a of a semiconductor chip 8a of an upper arm. More specifically, width of the heat sink 10a that is directly bonded to the semiconductor chip 8a and has thermal diffusion occurring in a relatively wide range is increased, and width of the heat sink 10c that is bonded to a copper block 9b and has heat diffusion occurring only in a relatively narrow range is decreased, thus narrowing a portion not contributing to heat dissipation of the heat sink 10c, and giving sufficient width to the heat sink 10a for heat dissipation. Thus, the efficiency of the area to be used of the heat sinks 10a, 10c is increased, and the total area to be used in the heat sinks 10a, 10c is made equal to or larger than before and efficient cooling performance is obtained.

Abstract translation: 要解决的问题：通过提高使用散热片的面积的效率来获得有效的冷却性能。解决方案：将结合到下臂的半导体芯片8b的散热片10c制成小于与 上臂的半导体芯片8a的铜块9a。 更具体地，直接接合到半导体芯片8a并且在相对宽的范围内发生热扩散的散热片10a的宽度增加，并且结合到铜块9b并具有热扩散的散热片10c的宽度 仅在相对狭窄的范围内发生，从而使对散热片10c的散热不起作用的部分变窄，并且向散热片10a提供足够的宽度以进行散热。 因此，散热器10a，10c的使用面积的效率提高，并且使散热器10a，10c中使用的总面积等于或大于以前，并且获得了有效的冷却性能。

公开(公告)号：JP2011135642A

公开(公告)日：2011-07-07

申请号：JP2009290801

申请日：2009-12-22

Applicant: Denso Corp ,  Nippon Soken Inc ,  株式会社デンソー ,  株式会社日本自動車部品総合研究所

Inventor： NARUMI NORITOSHI ,  WAKIMOTO TORU ,  TONOMOTO MASAYA ,  HOSONO YUKIO

IPC: H02P27/06 ,  B60L15/20 ,  B60W10/08 ,  B60W20/00

CPC classification number: Y02T10/644 ,  Y02T10/7241 ,  Y02T10/7275

Abstract: PROBLEM TO BE SOLVED: To respond to a driver's request such as an increase in acceleration of a vehicle by driving a motor so that a driving torque does not drop even under a low atmospheric pressure environment. SOLUTION: An ECU 40 controls a power conversion operation of an inverter 30 based on a normal setting, where the maximum voltage difference ΔV1 inside the motor, namely the maximum voltage difference of a voltage difference between coils of a motor generator (motor) MG, is lower than a partial discharge starting voltage DN, namely a starting voltage of discharge partially occurring between the coils, and a voltage value for obtaining a prescribed required torque in the motor MG is applied when a prescribed normal atmospheric pressure. The ECU 40 controls power conversion operation of the inverter 30 so that current supplied to the motor MG takes an effective value and a phase that are required for allowing at least the motor generator MG to generate a required torque when the partial discharge starting voltage DL is lower than the maximum voltage difference ΔV1 inside the motor in the normal setting under a low atmospheric pressure lower than a normal atmospheric pressure. COPYRIGHT: (C)2011,JPO&INPIT

Abstract translation: 要解决的问题：通过驱动电动机来响应驾驶员的要求，例如车辆的加速度的增加，使得即使在低的大气压环境下，驱动转矩也不会下降。 解决方案：ECU40基于正常设置来控制逆变器30的电力转换操作，其中电动机内部的最大电压差ΔV1，即电动发电机（电动机）的线圈之间的电压差的最大电压差 ）MG低于部分放电起始电压DN，即在线圈之间部分发生的放电的起始电压，并且在规定的正常大气压下施加用于在电动机MG中获得规定的所需转矩的电压值。 ECU40控制逆变器30的电力转换动作，使得提供给电动机MG的电流具有有效值和相位，当部分放电起始电压DL为零时，至少允许电动发电机MG产生所需转矩 低于比正常大气压低的低气压下的正常设定中的电动机内的最大电压差ΔV1。 版权所有（C）2011，JPO＆INPIT