公开(公告)号：JP2011121058A

公开(公告)日：2011-06-23

申请号：JP2009278209

申请日：2009-12-08

Applicant: Arakawa Chem Ind Co Ltd ,  Denso Corp ,  Fujitsu Ten Ltd ,  Harima Chemicals Inc ,  Koki:Kk ,  Toyota Motor Corp ,  トヨタ自動車株式会社 ,  ハリマ化成株式会社 ,  富士通テン株式会社 ,  株式会社デンソー ,  株式会社弘輝 ,  荒川化学工業株式会社

Inventor： IWAMURA EIJI ,  GOTO KAZUYUKI ,  ISHIGA FUMIO ,  YOSHIOKA TAKAYASU ,  UTSUNO KIMITAKA ,  NAKAMURA MITSUO ,  OKOCHI TERUO ,  MITSUHARU MASAKI ,  SUKEGAWA TAKUSHI ,  IKEDO KENJI ,  ANDO YOSHIYUKI ,  SHIRAI TAKESHI ,  MORI KIMIAKI ,  WADA RIE ,  NAKANISHI KENSUKE ,  AIHARA MASAMI ,  KUMAMOTO SATOSHI

IPC: B23K35/363 ,  B23K35/22 ,  B23K35/26 ,  C22C12/00 ,  C22C13/00 ,  H05K3/34

CPC classification number: B23K35/3613 ,  B23K35/362 ,  C22C12/00 ,  C22C13/00 ,  H05K3/3484

Abstract: PROBLEM TO BE SOLVED: To provide solder paste for enhancing the heating sag resistance. SOLUTION: Solder paste contains in its flux an activator having dibasic acid having the molecular weight of ≤250, monobasic acid having the molecular weight of 150-300, and dibasic acid having the molecular weight of 300-600, and at least one kind of resin additive selected from among a group constituted of high-density polyethylene and polypropylene. The flux contains the resin additive by 4-12 wt.%. The viscosity of the resin additive at 80°C is ≥400 Pa s. COPYRIGHT: (C)2011,JPO&INPIT

Abstract translation: 要解决的问题：提供用于提高加热抗流挂性的焊膏。 解决方案：焊膏中含有分子量为≤250的二元酸，分子量为150-300的一元酸和分子量为300-600的二元酸的活化剂，至少 一种选自高密度聚乙烯和聚丙烯的树脂添加剂。 助熔剂含有4-12重量％的树脂添加剂。 树脂添加剂在80℃下的粘度≥400Pa·s。 版权所有（C）2011，JPO＆INPIT

公开(公告)号：JP2013066939A

公开(公告)日：2013-04-18

申请号：JP2012286772

申请日：2012-12-28

Applicant: Denso Corp ,  株式会社デンソー ,  Harima Chemicals Inc ,  ハリマ化成株式会社

Inventor： MITSUHARU MASAKI ,  YAMAMOTO MASAYASU ,  NAKANISHI KENSUKE ,  AIHARA MASAMI

IPC: B23K35/363 ,  B23K35/26 ,  C22C13/00 ,  H05K3/34

Abstract: PROBLEM TO BE SOLVED: To provide a soldering flux and a solder paste composition which can satisfactorily suppress cracking of a flux residue after soldering even in a severe environment such as drastic change in temperature, have high reliability and excellent soldering performance and have a manufacturing cost and a load to the environment equal to those in conventional techniques.SOLUTION: The soldering flux includes a base resin, an activator and an organic solvent. The content of the base resin is 8.7-71 wt.% with respect to the total amount of the flux, the content of the activator is 0.1-20 wt.% with respect to the total amount of the flux, and the content of the organic solvent is 26.7-90.0 wt.% with respect to the total amount of the flux. As the base resin, the soldering flux contains 5.7-56 wt.% of a thermoplastic acrylic resin having less than -50°C of a glass transition temperature with respect to the total amount of the flux. The base resin includes acrylated rosin. The solder paste composition contains the flux and solder alloy powder.

Abstract translation: 要解决的问题：为了提供能够令人满意地抑制焊接后的焊剂残留物的裂纹的助焊剂和焊膏组合物，即使在诸如剧烈变化的剧烈环境下，具有高可靠性和优异的焊接性能，并且具有 制造成本和对环境的负荷等于常规技术的成本。 解决方案：助焊剂包括基础树脂，活化剂和有机溶剂。 相对于助熔剂的总量，基础树脂的含量为8.7〜71重量％，活化剂的含量相对于助熔剂的总量为0.1-20重量％，含量 有机溶剂相对于助熔剂的总量为26.7-90.0重量％。 作为基础树脂，焊剂含有相对于助熔剂总量的具有小于-50℃的玻璃化转变温度的热塑性丙烯酸树脂的5.7-56重量％。 基础树脂包括丙烯酸酯化松香。 焊膏组合物含有焊剂和焊料合金粉末。 版权所有（C）2013，JPO＆INPIT

公开(公告)号：JP2011183458A

公开(公告)日：2011-09-22

申请号：JP2011142476

申请日：2011-06-28

Applicant: Denso Corp ,  Harima Chemicals Inc ,  ハリマ化成株式会社 ,  株式会社デンソー

Inventor： MITSUHARU MASAKI ,  YAMAMOTO MASAYASU ,  NAKANISHI KENSUKE ,  AIHARA MASAMI

IPC: B23K35/363

Abstract: PROBLEM TO BE SOLVED: To provide a soldering flux and a solder paste composition capable of satisfactorily suppressing cracking of flux residue after soldering even in a severe environment such as drastic change in temperature, has high reliability, is excellent in soldering and has a manufacturing cost and a load to the environment equal to those in the conventional technique.
SOLUTION: The soldering flux comprises a base resin, an activator and an organic solvent, wherein the content of the base resin is 8.7 to 71 wt.% with respect to the total amount of flux, the content of the activator is 0.1 to 20 wt.% with respect to the total amount of flux, the content of the organic solvent is 26.7 to 90.0 wt.% with respect to the total amount of flux and the content of a thermoplastic acrylic resin having a glass transition temperature less than -50°C, as the base resin is 5.7 to 56 wt.% with respect to the total amount of flux. The solder paste composition contains the soldering flux and a solder alloy powder.
COPYRIGHT: (C)2011,JPO&INPIT

Abstract translation: 要解决的问题：为了提供能够令人满意地抑制焊接后的焊剂残留物的裂纹的助焊剂和焊膏组合物，即使在诸如剧烈变化的剧烈环境下也具有高可靠性，焊接性优异， 制造成本和对环境的负荷等于常规技术的成本。 助焊剂包括基础树脂，活化剂和有机溶剂，其中基础树脂的含量相对于助熔剂的总量为8.7至71重量％，活化剂的含量为0.1 至20重量％，相对于助熔剂的总量和玻璃化转变温度的热塑性丙烯酸树脂的含量，有机溶剂的含量为26.7〜90.0重量％ -50℃，相对于助熔剂的总量，基础树脂为5.7〜56重量％。 焊膏组合物含有助焊剂和焊料合金粉末。 版权所有（C）2011，JPO＆INPIT

公开(公告)号：JP2011121059A

公开(公告)日：2011-06-23

申请号：JP2009278210

申请日：2009-12-08

Applicant: Arakawa Chem Ind Co Ltd ,  Denso Corp ,  Fujitsu Ten Ltd ,  Harima Chemicals Inc ,  Koki:Kk ,  Toyota Motor Corp ,  トヨタ自動車株式会社 ,  ハリマ化成株式会社 ,  富士通テン株式会社 ,  株式会社デンソー ,  株式会社弘輝 ,  荒川化学工業株式会社

Inventor： IWAMURA EIJI ,  GOTO KAZUYUKI ,  NAGASAKA SHINSUKE ,  YOSHIOKA TAKAYASU ,  UTSUNO KIMITAKA ,  NAKAMURA MITSUO ,  OKOCHI TERUO ,  MITSUHARU MASAKI ,  SUKEGAWA TAKUSHI ,  IKEDO KENJI ,  ANDO YOSHIYUKI ,  SHIRAI TAKESHI ,  MORI KIMIAKI ,  WADA RIE ,  NAKANISHI KENSUKE ,  AIHARA MASAMI ,  KUMAMOTO SATOSHI

IPC: B23K35/363 ,  B23K35/22 ,  B23K35/26 ,  C22C13/00

CPC classification number: B23K35/362 ,  B23K35/0222 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/3613 ,  C22C13/00 ,  H05K3/3489

Abstract: PROBLEM TO BE SOLVED: To provide flux for solder paste and solder paste having adequate fluidity even when the shear force is repeatedly applied thereto, and capable of suppressing any fatigue degradation of the viscoelastic characteristic and various kinds of performance degradation due to the same.
SOLUTION: The flux for solder paste comprises acrylic resin which is obtained by the radical copolymerization of (meth)acrylic ester having a 6-15C alkyl group and (meth)acrylic ester other than that (meth)acrylic ester, and rosins. The weight ratio of the acrylic resin when that of rosins is 1 is 0.5-1.2, and the flux for solder paste is fluidized by applying the shear force of 10-150 Pa.
COPYRIGHT: (C)2011,JPO&INPIT

Abstract translation: 要解决的问题：为了提供具有足够的流动性的焊膏和焊膏的助焊剂，即使当反复施加剪切力时，也能够抑制粘弹性特性的疲劳劣化和各种性能下降 相同。 焊膏的焊剂包含通过使具有6-15C烷基的（甲基）丙烯酸酯与除（甲基）丙烯酸酯以外的（甲基）丙烯酸酯）和（甲基）丙烯酸酯的自由基共聚得到的丙烯酸树脂，以及松香 。 当松香的丙烯酸树脂为1时，丙烯酸树脂的重量比为0.5-1.2，通过施加10-150Pa的剪切力使焊膏的流量流动。版权所有（C）2011，JPO＆INPIT

公开(公告)号：JP2006035259A

公开(公告)日：2006-02-09

申请号：JP2004218318

申请日：2004-07-27

Applicant: Denso Corp ,  Harima Chem Inc ,  ハリマ化成株式会社 ,  株式会社デンソー

Inventor： MITSUHARU MASAKI ,  YAMAMOTO MASAYASU ,  AIHARA MASAMI ,  INOUE TAKASUKE ,  KUMAMOTO SATOSHI

IPC: B23K35/22 ,  H05K3/34

Abstract: PROBLEM TO BE SOLVED: To obtain a solder paste for forming a soldered joint that excels in durability including cold cycle resistance and crack resistance.
SOLUTION: This solder paste contains a flux containing thermosetting resin and/or thermoplastic resin, a resin filler powder coated with a metallic layer, and a solder alloy powder. Alternatively, the solder paste contains a flux containing thermosetting resin and/or thermoplastic resin and a resin filler powder coated with a solder alloy layer.
COPYRIGHT: (C)2006,JPO&NCIPI

Abstract translation: 要解决的问题：获得用于形成焊接接头的焊膏，其耐久性优异，包括耐冷循环性和抗裂纹性。 解决方案：该焊膏含有含热固性树脂和/或热塑性树脂的助熔剂，涂有金属层的树脂填料粉末和焊料合金粉末。 或者，焊膏包含含有热固性树脂和/或热塑性树脂的助熔剂和涂覆有焊料合金层的树脂填料粉末。 版权所有（C）2006，JPO＆NCIPI

公开(公告)号：JP2008062253A

公开(公告)日：2008-03-21

申请号：JP2006240229

申请日：2006-09-05

Applicant: Denso Corp ,  Harima Chem Inc ,  ハリマ化成株式会社 ,  株式会社デンソー

Inventor： YAMAMOTO MASAYASU ,  SHIOMI TAKUMI ,  NAKANISHI KENSUKE ,  WATABE MASAHIRO ,  AIHARA MASAMI

IPC: B23K35/363 ,  H05K3/34

CPC classification number: B23K35/362 ,  B23K35/0244 ,  B23K35/025 ,  C08K5/04 ,  C08K5/1535 ,  C08K5/16

Abstract: PROBLEM TO BE SOLVED: To provide a flux for soldering and a solder paste composition capable of demonstrating excellent wettability to a metal or a plating containing no lead irrespective of the kind of the metal.
SOLUTION: The flux for soldering contains a base resin and an activator. The activator contains an oxygen-containing heterocyclic compound having at least one carboxylic group in a molecule. The oxygen-containing heterocyclic compound preferably has a five-membered ring structure to be selected from a group consisting of furan, hydrofuran, and oxazole. The content of the oxygen-containing heterocyclic compound is preferably 0.1-50 wt.% to the total flux. The solder paste composition contains the flux and solder alloy powder.
COPYRIGHT: (C)2008,JPO&INPIT

Abstract translation: 要解决的问题：为了提供能够显示对金属的润湿性优异的焊接助焊剂和焊膏组合物，不管金属的种类如何，都不含铅。

解决方案：用于焊接的焊剂包含基础树脂和活化剂。 活化剂含有分子中具有至少一个羧基的含氧杂环化合物。 含氧杂环化合物优选具有选自呋喃，氢呋喃和恶唑的五元环结构。 含氧杂环化合物的含量相对于总通量优选为0.1〜50重量％。 焊膏组合物含有焊剂和焊料合金粉末。 版权所有（C）2008，JPO＆INPIT

公开(公告)号：JP2005074449A

公开(公告)日：2005-03-24

申请号：JP2003306064

申请日：2003-08-29

Applicant: Denso Corp ,  Harima Chem Inc ,  ハリマ化成株式会社 ,  株式会社デンソー

Inventor： INOUE TAKASUKE ,  AIHARA MASAMI ,  MORIGAMI TADAHIKO ,  FURUMOTO ATSUSHI

IPC: B23K35/363

Abstract: PROBLEM TO BE SOLVED: To provide a water-insoluble flux for soldering and a soldering paste composition suppressing the generation of minute soldering balls in the periphery of a soldering portion when soldering and having excellent storing stability and the stability in printing.
SOLUTION: The water-insoluble flux for soldering comprises a base resin, an activator, a thixotropic agent, and 0.1 to 0.4% by weight of water based on the total of organic solvents. The water-insoluble soldering paste composition comprises the above flux, and a soldering alloy powder.
COPYRIGHT: (C)2005,JPO&NCIPI

Abstract translation: 要解决的问题：提供用于焊接的水不溶性助熔剂和焊锡膏组合物，其在焊接时抑制焊接部周边的微小焊锡球的产生，并且具有优异的储存稳定性和印刷稳定性。 解决方案：用于焊接的水不溶性焊剂包括基础树脂，活化剂，触变剂和基于总有机溶剂的0.1至0.4重量％的水。 水不溶性焊膏组合物包含上述助熔剂和焊接合金粉末。 版权所有（C）2005，JPO＆NCIPI

公开(公告)号：JP2008062252A

公开(公告)日：2008-03-21

申请号：JP2006240228

申请日：2006-09-05

Applicant: Denso Corp ,  Harima Chem Inc ,  ハリマ化成株式会社 ,  株式会社デンソー

Inventor： MITSUHARU MASAKI ,  YAMAMOTO MASAYASU ,  NAKANISHI KENSUKE ,  AIHARA MASAMI

IPC: B23K35/363 ,  B23K35/22 ,  H05K3/34

CPC classification number: B23K35/362 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/3613

Abstract: PROBLEM TO BE SOLVED: To provide a flux for soldering, and solder paste composition, wherein generation of cracks in flux residues after the soldering is sufficiently suppressed even under a severe environment that the difference between coldness and hotness is very large, and they are high in reliability and excellent in solderability, and the manufacturing cost and burden on the environment are equal to before.
SOLUTION: The flux for soldering contains a base resin and an activator. The base resin contains a thermoplastic acrylic resin having the glass transition temperature of

Abstract translation: 要解决的问题：为了提供焊接用焊剂和焊膏组合物，即使在冷热度差非常大的恶劣环境下也能充分抑制焊接后的焊剂残留物的裂纹的产生，以及 它们的可靠性高，可焊性优异，制造成本和环境负担与之前相同。

解决方案：用于焊接的焊剂包含基础树脂和活化剂。 基础树脂含有玻璃化转变温度<-50℃的热塑性丙烯酸树脂。 热塑性丙烯酸树脂的含量优选为焊剂总量的0.5-80重量％，活化剂的含量优选为焊剂总量的0.1-20重量％。 焊膏组合物含有焊剂和焊料合金粉末。 版权所有（C）2008，JPO＆INPIT

公开(公告)号：JP2010269356A

公开(公告)日：2010-12-02

申请号：JP2009124606

申请日：2009-05-22

Applicant: Harima Chem Inc ,  Sharp Corp ,  シャープ株式会社 ,  ハリマ化成株式会社

Inventor： SAKOTA NAOKI ,  AIHARA MASAMI ,  KASHIWAGI SHINICHIRO

IPC: B23K35/363 ,  B23K35/14 ,  B23K35/22 ,  B23K35/26 ,  C22C11/06 ,  C22C12/00 ,  C22C13/00 ,  H05K3/34

Abstract: PROBLEM TO BE SOLVED: To provide a solder paste composition which can achieve an extremely high level of printability and bleeding suppression effect (even after continuous printing) without causing degradation of stability during storage and solder bonding failure. SOLUTION: The solder paste composition is characterized by containing solder alloy powder, thermoplastic resin powder with a lower melting temperature than the solder alloy and flux. The solder paste composite is effective in bringing the extremely high level of printability and bleeding suppression effect during continuous printing, without causing the degradation of stability during storage, the solder bonding failure, and rejection at an appearance inspection. COPYRIGHT: (C)2011,JPO&INPIT

Abstract translation: 要解决的问题：提供一种焊膏组合物，其可以在不会导致存储和焊接失败期间的稳定性劣化的同时实现极高的可印刷性和喷出抑制效果（甚至在连续印刷之后）。 焊膏组合物的特征在于含有焊料合金粉末，熔融温度低于焊料合金和焊剂的热塑性树脂粉末。 焊膏复合物在连续印刷期间有效地提供极高的可印刷性和耐渗色抑制效果，而不会在外观检查期间导致储存期间的稳定性降低，焊接失败和拒绝。 版权所有（C）2011，JPO＆INPIT

公开(公告)号：JP2008062240A

公开(公告)日：2008-03-21

申请号：JP2006239286

申请日：2006-09-04

Applicant: Harima Chem Inc ,  ハリマ化成株式会社

Inventor： KASHIWAGI SHINICHIRO ,  AIHARA MASAMI

IPC: B23K35/22 ,  B23K35/363 ,  H05K3/34

Abstract: PROBLEM TO BE SOLVED: To provide a solder paste composition, wherein printability and sag resistance (during printing and leaving as it is) can be developed at very high level. SOLUTION: This solder paste composition is a solder paste composition contains solder powder and a flux. The flux contains fatty acid triamide as a thixotropy agent, which is obtained by using C14-22 fatty acid (A), C14-22 hydroxy fatty acid (B) and triamine compound (C) as a starting material. It is preferable that the fatty acid triamide is a material obtained by making the fatty acid (A) of 1.5-2.5 mol and the hydroxy fatty acid (B) of 0.5-1.5 mol react to the triamine compound (C) of 1 mol and it is preferable that the content of the fatty acid triamide is 0.5-40 wt.% of the total content of the flux. COPYRIGHT: (C)2008,JPO&INPIT

Abstract translation: 要解决的问题：提供一种焊膏组合物，其中可印刷性和抗流挂性（在印刷和离开期间）可以以非常高的水平开发。

解决方案：该焊膏组合物是含有焊料粉末和焊剂的焊膏组合物。 助熔剂含有以C14-22脂肪酸（A），C14-22羟基脂肪酸（B）和三胺化合物（C）为起始原料得到的作为触变剂的脂肪酸三酰胺。 优选脂肪酸三酰胺是通过使脂肪酸（A）为1.5〜2.5摩尔，羟基脂肪酸（B）为0.5〜1.5摩尔与1摩尔的三胺化合物（C）反应而得到的材料， 脂肪酸三酰胺的含量优选为助焊剂总量的0.5〜40重量％。 版权所有（C）2008，JPO＆INPIT