-
公开(公告)号：JPWO2009150918A1
公开(公告)日：2011-11-10
申请号：JP2010516800
申请日：2009-05-13
IPC: G03F7/023 , G03F7/40 , H01L21/027
CPC classification number: G03F7/022 , G03F7/0047 , G03F7/16
Abstract: 本発明の目的は、電気絶縁性、熱衝撃性に優れる均一な絶縁性被膜を有する構造体及びその製造方法、絶縁性被膜を形成することができ且つ解像性に優れるポジ型感光性樹脂組成物、並びに電子部品を提供することである。本発明の絶縁性被膜を有する構造体の製造方法は、孔部を有する基板に、溶剤を塗布する溶剤塗布工程と、ポジ型感光性樹脂組成物を、この樹脂組成物が孔部内の溶剤と接触するように、基板に塗布する樹脂組成物塗布工程と、塗膜を乾燥し、孔部の内壁面及び底面のうちの少なくとも内壁面に樹脂成分を含む被膜117、118、119を形成する工程と、上記基板の表面に形成されている被膜の所定領域を露光し、アルカリ性溶液を用いて処理し、孔部の内壁面に形成されている被膜117を残存させる表底面側被膜除去工程と、孔部の内壁面117に残存している被膜を加熱する加熱硬化工程と、を備える。
-
公开(公告)号：JP5246259B2
公开(公告)日：2013-07-24
申请号：JP2010516800
申请日：2009-05-13
Applicant: Jsr株式会社
IPC: G03F7/023 , G03F7/40 , H01L21/027
CPC classification number: G03F7/022 , G03F7/0047 , G03F7/16
-
-
Patent Agency Ranking
公开(公告)号：JP5262350B2
公开(公告)日：2013-08-14
申请号：JP2008169485
申请日：2008-06-27
Applicant: Jsr株式会社
IPC: H01L21/312 , C08G73/10 , C08L79/08 , H01L23/14
Abstract: PROBLEM TO BE SOLVED: To provide a structure which has a uniform insulating film with superior electric insulation and a method of manufacturing the same, a resin composition which can form the insulating film, and an electronic component. SOLUTION: The method of manufacturing the structure which has the insulating film includes a step of coating a substrate having a hole portion with a solvent, a step of coating the substrate with the resin composition so that the resin composition may come into contact with the solvent in the hole portion, a step of forming films 117, 118, and 119 containing a resin component on at least an internal wall surface between the internal wall surface and a bottom surface of the hole portion by drying the coating, a heating and curing step of heating the film formed on the entire surface of the substrate including the internal wall surface and bottom surface of the hole portion into insulating films 217, 218, and 219 containing a cured body of the resin component, and a surface and bottom surface-side insulating film removing step of removing the insulating film 219 formed on the surface of the substrate and the insulating film 218 formed on the bottom surface of the hole portion of the substrate, and leaving the insulating film 217 formed on the internal wall surface of the hole portion. COPYRIGHT: (C)2010,JPO&INPIT
-
-
-
-
公开(公告)号：JP5311104B2
公开(公告)日：2013-10-09
申请号：JP2008169486
申请日：2008-06-27
Applicant: Jsr株式会社
IPC: H01L23/522 , C08F20/58 , C08K5/00 , C08L33/24 , H01L21/3205 , H01L21/768 , H01L25/065 , H01L25/07 , H01L25/18
CPC classification number: H01L2224/16145 , H01L2224/16225 , H01L2924/10253 , H01L2924/15311 , H01L2924/00
Abstract: PROBLEM TO BE SOLVED: To provide a structure which has a uniform insulating film with superior electric insulation and a method of manufacturing the same, a resin composition which can form the insulating film, and an electronic component. SOLUTION: The method of manufacturing the structure which has the insulating film includes a step of coating a substrate having a hole portion with a solvent, a step of coating the substrate with the resin composition so that the resin composition may come into contact with the solvent in the hole portion, a step of forming films 117, 118, and 119 containing a resin component on at least an internal wall surface between the internal wall surface and a bottom surface of the hole portion by drying the coating, a heating and curing step of heating the film formed on the entire surface of the substrate including the internal wall surface and bottom surface of the hole portion into insulating films 217, 218, and 219 containing a cured body of the resin component, and a surface and bottom surface-side insulating film removing step of removing the insulating film 219 formed on the surface of the substrate and the insulating film 218 formed on the bottom surface of the hole portion of the substrate, and leaving the insulating film 217 formed on the internal wall surface of the hole portion. COPYRIGHT: (C)2010,JPO&INPIT
-
-
-
-
-
-
-
Search Results
8
records
(took 0.018 seconds)
