公开(公告)号：JP2013140964A

公开(公告)日：2013-07-18

申请号：JP2012282291

申请日：2012-12-26

Applicant: Led Engin Inc ,  エルイーディエンジン・インコーポレーテッド

Inventor： MEI ZEQUN ,  YAN XIANTAO

IPC: H01L33/44 ,  H01L33/50

CPC classification number: H01L33/50 ,  H01L33/508 ,  H01L2933/0041

Abstract: PROBLEM TO BE SOLVED: To provide a method for accumulating a material layer including a phosphor on a plurality of LED dies.SOLUTION: A method for accumulating a material layer including a phosphor on a plurality of LED dies includes the steps of: arranging a template having a plurality of openings on an adhesive tape; and arranging each of the plurality of LED dies in one opening of the plurality of openings in the template. This method also includes a step of forming a patterned dry film photoresist layer on the template and the plurality of LED dies. The photoresist layer has a plurality of openings configured so as to expose an upper surface of each of the LED dies. Next, the material including the phosphor is arranged on the exposed upper surfaces of the respective LED dies. The method further includes a step of removing the photoresist layer and the template.

Abstract translation: 要解决的问题：提供一种在多个LED管芯上堆积包括磷光体的材料层的方法。解决方案：一种用于在多个LED管芯上堆积包括磷光体的材料层的方法包括以下步骤： 在胶带上具有多个开口; 以及将所述多个LED管芯中的每一个布置在所述模板中的所述多个开口的一个开口中。 该方法还包括在模板和多个LED管芯上形成图案化的干膜光致抗蚀剂层的步骤。 光致抗蚀剂层具有多个开口，其被配置为暴露每个LED管芯的上表面。 接下来，将包含荧光体的材料配置在各LED芯片的露出的上表面上。 该方法还包括去除光致抗蚀剂层和模板的步骤。

公开(公告)号：JP2013140965A

公开(公告)日：2013-07-18

申请号：JP2012282294

申请日：2012-12-26

Applicant: Led Engin Inc ,  エルイーディエンジン・インコーポレーテッド

Inventor： MEI ZEQUN ,  YAN XIANTAO

IPC: H01L33/50

CPC classification number: H01L33/50 ,  H01L2933/0041

Abstract: PROBLEM TO BE SOLVED: To provide a method for accumulating a material layer including a phosphor on a plurality of LED dies.SOLUTION: A method for accumulating a material layer including a phosphor on a plurality of LED dies includes the steps of: arranging a template having a plurality of openings on an adhesive tape; and arranging each of the plurality of LED dies in one opening of the plurality of openings in the template. This method also includes a step of arranging a stencil so as to cover the template and the plurality of LED dies. The stencil has a plurality of openings configured so as to expose an upper surface of each of the LED dies. Next, the material including the phosphor is arranged on the exposed upper surfaces of the respective LED dies. The method further includes a step of removing the stencil and the template.

Abstract translation: 要解决的问题：提供一种在多个LED管芯上堆积包括磷光体的材料层的方法。解决方案：一种用于在多个LED管芯上堆积包括磷光体的材料层的方法包括以下步骤： 在胶带上具有多个开口; 以及将所述多个LED管芯中的每一个布置在所述模板中的所述多个开口的一个开口中。 该方法还包括布置模板以覆盖模板和多个LED管芯的步骤。 模板具有多个开口，其被配置为暴露每个LED管芯的上表面。 接下来，将包含荧光体的材料配置在各LED芯片的露出的上表面上。 该方法还包括去除模版和模板的步骤。

公开(公告)号：JP2012238596A

公开(公告)日：2012-12-06

申请号：JP2012109292

申请日：2012-05-11

Applicant: Led Engin Inc ,  エルイーディエンジン・インコーポレーテッド

Inventor： YAN XIANTAO ,  LEE KACHUN ,  MEI ZEQUN

IPC: H05B37/02

CPC classification number: H05B33/0869 ,  H05B33/086

Abstract: PROBLEM TO BE SOLVED: To provide a device and a method of tuning color of an LED-based lighting fixture according to a desired color or color temperature.SOLUTION: A lighting fixture includes two or more independently addressable groups of LED associated with different colors or color temperatures. Color (or color temperature) of output light is tuned by dividing an input current controllably into the group of LED. Optimum division of the input current is determined on the basis of the linear interpolation between the measurements of color or color temperature generated by at least two different divisions of the input current. Tuning may be performed once during manufacture, and the lighting fixture does not require an active feedback component for maintaining the color temperature.

Abstract translation: 要解决的问题：提供根据期望的颜色或色温调整基于LED的照明器具的颜色的装置和方法。 解决方案：照明灯具包括与不同颜色或色温相关的两个或更多个可独立寻址的LED组。 通过将输入电流可控地分成LED组来调节输出光的颜色（或色温）。 基于由输入电流的至少两个不同分度产生的颜色或色温的测量之间的线性内插来确定输入电流的最佳分割。 可以在制造期间执行调谐一次，并且照明器具不需要用于维持色温的主动反馈部件。 版权所有（C）2013，JPO＆INPIT

公开(公告)号：JP2013084960A

公开(公告)日：2013-05-09

申请号：JP2012225711

申请日：2012-10-11

Applicant: Led Engin Inc ,  エルイーディエンジン・インコーポレーテッド

Inventor： YAN XIANTAO ,  DEVO A ADEVIYI ,  MEI ZEQUN

IPC: H01L23/12 ,  H01L33/00 ,  H05K3/34

CPC classification number: H01L25/0753 ,  H01L33/486 ,  H01L33/62 ,  H01L2924/0002 ,  H05K1/0204 ,  H05K1/05 ,  H05K1/111 ,  H05K2201/09381 ,  H05K2201/09663 ,  H05K2201/10106 ,  H05K2203/1178 ,  Y02P70/611 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To provide an improved grooved plate for solder joint.SOLUTION: A grooved plate for solder joint comprises a metal plate 208, placed on a metal plate on a multi die LED radiator board or an MCPCB(metal core print circuit board) 200 attached on a radiator board. Either of the metal plates, or both of the metal plates includes many of radial grooves 210 to 215, and at least a part of those radiates to a peripheral end of the metal plate 208. Those grooves 210 to 215 form ducts capable of releasing air at a solder joint process, reduce size and/or gross area of solder void, so that heat transfer between the radiator and the MCPCB is improved.

Abstract translation: 要解决的问题：提供一种用于焊接接头的改进的槽板。 解决方案：用于焊接接头的开槽板包括放置在多芯片LED散热器板上的金属板上的金属板208，或连接在散热器板上的MCPCB（金属芯印刷电路板）200。 金属板或两个金属板中的任一个包括许多径向槽210至215，并且其中的至少一部分辐射到金属板208的外周端。这些沟槽210至215形成能够释放空气的管道 在焊接过程中，减小焊料空隙的尺寸和/或总面积，从而提高散热器和MCPCB之间的热传递。 版权所有（C）2013，JPO＆INPIT