THERMOELECTRIC ELEMENT MODULE FOR COOLING

    公开(公告)号:JPH10144967A

    公开(公告)日:1998-05-29

    申请号:JP31012396

    申请日:1996-11-06

    Abstract: PROBLEM TO BE SOLVED: To provide a thermoelectric element module for cooling that is simple in structure, achieves a high cooling performance, is of high quality, and have a high productivity. SOLUTION: A metal substrate whose surface is subjected to insulation treatment is used on substrates 2 and 3, and an electrode film is bonded to it using a thermally conductive adhesive with a direct thermal conductivity of 0.1W/mK or higher, thus improving the cooling characteristic with a simple structure, improving the junction strength, and achieving miniaturization. Especially, by setting the thickness of the adhesive to 10μm or less, strength is improved and a thermal deformation prevention effect is improved. Further, by forming a recessed part for accepting a thermoelectric element 1 individually and positioning it on the surface of the substrates 2 and 3, ease of assembly, namely productivity and position accuracy of the thermoelectric element are improved. A junction area increases and hence junction strength is improved, further the mechanical strength due to the engagement of recess and projection is improved, and hence the strength of the entire module is improved. Then, a module can be miniaturized in a height direction by the amount corresponding to part recessed, thus further promoting the miniaturization of the module.

    CERAMIC SPRING MATERIAL AND CERAMIC SPRING AND ITS PRODUCTION

    公开(公告)号:JPH07138067A

    公开(公告)日:1995-05-30

    申请号:JP8381694

    申请日:1994-03-29

    Abstract: PURPOSE:To obtain a ceramic spring causing no decline in its mechanical strength even in an atmosphere at elevated temperatures, low in elastic modulus, and improved in both fracture stress and flexural strength, by heat treatment of a composite sintered compact prepared by dispersing fine carbide particles in a matrix consisting of mullite. CONSTITUTION:Firstly, a matrix consisting of mullite is subjected to wet mixing with fine powder of at least one kind of carbide selected from among TiC, SiC, VC, NbC, B4C, TaC, WC, HfC, Cr2C2 and ZrC, followed by drying into mixed powder. Second, the mixed powder is hot-pressed to produce a composite sintered compact, which is then heat treated at temperatures >=1200 deg.C but not higher than the sintered temperature to obtain the objective ceramic spring material. Finally, this material is formed to a desired shape to obtain the other objective ceramic spring.

    METHOD FOR FORMING CERAMIC COIL SPRING

    公开(公告)号:JPH01110907A

    公开(公告)日:1989-04-27

    申请号:JP26833087

    申请日:1987-10-26

    Abstract: PURPOSE:To prevent wire from breaking, deforming and the like and consequently reduce the scattering in shape by a method wherein organic material for giving formability and water are added to ceramic powder so as to kneaded one another, formed in wire and dried and, after that, immersed in solvent so as to be given plasticity. CONSTITUTION:Ceramic powder, the which organic material for giving formability and water as its solvent are added and kneaded, is extruded with a die in the form of wire. The wire is dried so as to fully shrink on drying. Next, the dry wire is immersed in coiling solvent. The, wire, which is given plasticity by being immersed in the coiling solvent, is coiled round a mandrel and, after that, dried and finally the resultant formed body in coiled form is removed from the mandrel. As the resultant formed body, almost no shrinkage on drying after coiling develops and the breakage and deformation at the inside of the coil of the wire are little. Further, scattering in shape is little even in comparison among a large number of formed bodies.

    CERAMICS CONNECTOR AND BRAZING METHOD FOR CONDUCTIVE CONNECTOR PIN IN CONNECTOR

    公开(公告)号:JPH05174884A

    公开(公告)日:1993-07-13

    申请号:JP34304891

    申请日:1991-12-25

    Abstract: PURPOSE:To feed a specific amount of brazing material to a specific position accurately and easily. CONSTITUTION:A connector main body 11 consists of a ceramics as an insulator, and a through hole 15 is formed therein. A conductor pin 12 is inserted to the through hole 15, and soldered to the connector main body 11. A brazing material 30 before heating has a coil form, and it is installed to a specific position of the conductor pin 12. The brazing material 30 is housed in a diameter expanding part 20 provided at the upper end side of the through hole 15. After the conductor pin 12 to which the brazing material 30 is installed to a specific position is set in the through hole 15 in such a way, it is heated, and the brazing material 30 is let flow to the lower side of the through hole 15 by utilizing the dead weight of the molten brazing material 30, so as to carry out the brazing.

    METALLIC SUBSTRATE AND ITS MANUFACTURE

    公开(公告)号:JPH04209587A

    公开(公告)日:1992-07-30

    申请号:JP40538190

    申请日:1990-12-05

    Abstract: PURPOSE:To improve heat radiation property and improve the adhesion by temperature change by using glass, where ceramic particles are dispersed, for an insulating layer. CONSTITUTION:First, metallic alkoxide solution is applied on the surface of a metallic base material layer 2, and this substrate 1 is dried at, for example, approximately a room temperature to 200 deg.C, and then it is heated in atmospheric temperature, and kept at a specified temperature for, for example, ten minutes, and then it is cooled at a speed of specified temperature per minute, thus a metallic oxide layer 3 is baked. Next, at the surface of this metallic oxide layer 3 is printed the screen of paste, wherein ceramic Al2O3 particles and lead borosilicate crystallized glass powder are dispersed uniformly in vehicle consisting of an organic solvent at the ratio of 1:1 in this case, by raising the temperature at a speed of, for example, 35 deg.C per minute so as to bake an insulating layer 4.

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