Abstract:
PROBLEM TO BE SOLVED: To provide an electronic component and a method of manufacturing the electronic component.SOLUTION: An electronic component has a conductor formed in an insulator, and is provided, on an outer surface of the insulator, with an external electrode electrically connected to the conductor. In the electronic component, a curvature of the external electrode in a via machining region is decreased to a predetermined level or less, thereby making it possible to decrease defect generation due to glare-reflection of a laser.
Abstract:
PROBLEM TO BE SOLVED: To provide a multilayer ceramic capacitor eliminating failures due to variance of the thickness of the multilayer ceramic capacitor and overcoming problems with filling of a resin, by minimizing variance of the thickness of multilayer ceramic or an external electrode of the multilayer ceramic capacitor, and a printed circuit board including the multilayer ceramic capacitor.SOLUTION: In the multilayer ceramic capacitor including multilayer ceramic and external electrodes formed on both sides of the multilayer ceramic, |Tmax-Tmin| is 10 μm or less, and |CTmax-CTmin| is 20 μm or less, where Tmax is a maximum thickness of the external electrodes in a via processing area, Tmin is a minimum thickness of the external electrodes in the via processing area, CTmax is a maximum thickness of the multilayer ceramic capacitor in the via processing area, and CTmin is a minimum thickness of the multilayer ceramic capacitor in the via processing area.
Abstract:
PROBLEM TO BE SOLVED: To inhibit formation of voids between a surface of an electronic element and an insulating material by embedding the electronic element coated by forming a coating layer on the surface of the electronic element, before inserting the electronic element into a cavity, with an insulating material having the same physical properties as the insulating material packed in between the electronic component element and the cavity.SOLUTION: An electronic component embedded printed circuit board includes a core having a cavity; an electronic component inserted in the cavity and having a bonding coating layer on an outer peripheral surface; insulating layers laminated on and under the core and in contact with the bonding coating layer; and circuit patterns provided on the insulating layers.
Abstract:
PROBLEM TO BE SOLVED: To provide a multilayer ceramic capacitor, a circuit board packaging structure of the multilayer ceramic capacitor, and a packaging body of the multilayer ceramic capacitor.SOLUTION: There is provided a multilayer ceramic capacitor including a ceramic body having a plurality of dielectric layers laminated, an active layer which has capacitance formed including a plurality of first and second internal electrodes formed to be exposed alternately from both end faces of the ceramic body across the dielectric layers, upper and lower cover layers formed above and below the active layer, first and second external electrodes formed covering both end faces of the ceramic body, and a plurality of first and second dummy electrodes extending in the active layer from the first and second external electrodes inward in a length direction to be face the first and second internal electrodes respectively. The rate (B+C)/A at which a center part of the active layer is off the center part of the ceramic body satisfies 1.063≤(B+C)/A≤1.745, where A is a half as large as the overall thickness of the ceramic body, B is the thickness of the lower and upper cover layers, and C is a half as large as the overall thickness of the active layer.
Abstract:
PROBLEM TO BE SOLVED: To provide a multilayer ceramic electronic component having low ESL characteristics, while a reduction in IR thereof is prevented by preventing a plating liquid from being impregnated, and a method for manufacturing the multilayer ceramic electronic component.SOLUTION: A multilayer ceramic electronic component according to the present invention includes: a ceramic element assembly having a plurality of dielectric layers laminated therein; first and second internal electrodes formed on at least one surface of each of the dielectric layers within the ceramic element assembly and including first and second lead parts extended so as to be exposed through one surface of the ceramic element assembly, respectively; and first and second external electrodes formed on the one surface of the ceramic element assembly and electrically connected to the first and second internal electrodes through exposed portions of the first and second lead parts, respectively. A ratio of a width of the first or second lead part to a width of the first or second external electrode is in a range of 10-85%.