Abstract:
PROBLEM TO BE SOLVED: To provide a method and a unit to form a thin film which is formed in its stabilized quality. SOLUTION: In a crystal growth step, the thin film is formed using a thin film forming apparatus 11. The characteristic value of the thin film formed in this step includes a process error w. In a measuring step, measured characteristic of the formed thin film is measured with a measuring unit 12. The measured characteristic value measured in this step includes a measuring error ν. In a virtual crystal growth step, characteristic value of the thin film formed with a virtual thin film forming apparatus 13 is obtained and an arithmetic characteristic value is computed. In a measuring error removing step, a forecasted characteristic value wherein only the measuring error ν among the process errors w and measuring errors ν is removed from the measuring characteristic value can be computed with a measuring error removing unit 14, on the basis of the computed characteristic value and the measured characteristic value. Moreover, in a apparatus condition determining step, the new apparatus condition of the thin film forming apparatus 11 is determined with a condition setting unit 15 based on the forecasted characteristic value. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a method for manufacturing a matrix board for a liquid crystal by which the matrix board for the liquid crystal can be manufactured by using the reduced number of sheets of photomasks and to provide the matrix board for the liquid crystal. SOLUTION: A TFT active matrix board 1 is manufactured in such a manner that a TFT active matrix circuit 10 comprising a TFT element part 31 wherein a gate electrode film 12, a gate insulating film 14, a first semiconductor layer 15, a second semiconductor layer 16, a source and drain electrode film 17 and a passivation film 19 are layered on a glass substrate 11 is formed, an acrylic resin film 20 is formed so as to cover a resist part formed in a previously determined position on the TFT active matrix circuit 10 and the TFT active matrix circuit 10, the resist part is exposed by etching and then removed to form a through-hole and a pixel electrode 22a and contact holes 22b and 22c are formed by covering the surfaces of the acrylic resin film 20 and the through- hole with a conductive material. COPYRIGHT: (C)2004,JPO
Abstract:
PROBLEM TO BE SOLVED: To reduce the number of sheets of photomasks used when a liquid crystal display is manufactured. SOLUTION: In the steps for manufacturing a wiring board 50 for the liquid crystal display, a first circuit 44 is formed first on a first substrate 41, an interlayer insulating layer 45 covering the first circuit 44 is formed and the surface of the interlayer insulating layer 45 is made water-repellent. A resist pattern having multi-step local thickness is formed on the interlayer insulating layer 45 using photomasks capable of halftone exposure. The interlayer insulating layer 45 is etched using the resist pattern as a mask and the resist pattern is removed. A recessed part 52 and a through hole 53 of the interlayer insulating layer 45 are filled with a conductive material. Thus, a pixel electrode 46 and the first circuit 44 can be three dimensionally superposed and the number of sheets of the photomasks used when the liquid crystal display is manufactured is reduced. COPYRIGHT: (C)2004,JPO
Abstract:
PROBLEM TO BE SOLVED: To provide a method for manufacturing a matrix board for a liquid crystal with the necessary number of photo masks reduced, and to provide a matrix board for a liquid crystal. SOLUTION: A TFT active matrix board 1 is manufactured by forming a TFT element part 31 laminated with a gate electrode film 12, a gate insulating film 14, a 1st semiconductor layer 15, a 2nd semiconductor layer 16, a source-drain electrode film 17, and a passivation film 19, forming a projection part 40 at a predetermined position of the TFT element part 31, forming an acrylic resin film 20 so that it covers the projection part 40 and the TFT element part 31 where the projection part 40 is not formed, etching the acrylic resin film 20 to expose the projection part 40 and form a pixel electrode 21a on the surface of the projection part 40 and the acrylic resin 20, and connecting the projection part 40 with the pixel electrode 21a. COPYRIGHT: (C)2004,JPO
Abstract:
PROBLEM TO BE SOLVED: To provide a method for manufacturing a matrix substrate for a liquid crystal with which a liquid repellent layer with a property to repel a conductive material to form a conductive film is patterned without using lifting-off and to provide the matrix substrate for the liquid crystal manufactured with the method. SOLUTION: The method for manufacturing the matrix substrate for the liquid crystal has a process to form a photosensitive electric insulating film 20 so as to cover a TFT active matrix circuit 10 formed on an electric insulating substrate 11, to form a photosensitive water repellent film 21 on the surface of the photosensitive electric insulating film 20, to subject the photosensitive electric insulating film 20 and the photosensitive water repellent film 21 to halftone exposure, to remove the photosensitive water repellent film 21 on a position on which the pixel electrode is to be formed, further to form a through hole reaching a source-drain electrode film 17 from the surface of the photosensitive electric insulating film 20, to form a coat-type transparent conductive film 23 by coating the surface of the photosensitive electric insulating film 20 and the through hole with the conductive material, to form the pixel electrode 23a and a contact hole 23b and to obtain the TFT active matrix substrate 1. COPYRIGHT: (C)2004,JPO