Abstract:
PROBLEM TO BE SOLVED: To provide a method for determining irradiated energy density of a laser beam that is not subject to variation in crystalline property of an irradiated film obtained by the influence of a change of a laser oscillator condition and the like when irradiating the laser beam to strengthen the crystalline property of the irradiated film, and a method for manufacturing a semiconductor substrate using the method as well as an apparatus for mamufacturing a semiconductor substrate using the same. SOLUTION: Laser beams having various irradiated energy densities are radiated to an irradiated film formed on a substrate, and surface scattering optical intensities of the irradiated film are measured for respective irradiated energy densities, thus preparing energy density and surface scattering optical intensity correspondence information. Here, the correspondence information is, for example, characteristic curves of irradiated energy densities shown in the figure and surface scattering optical intensities. Based on this correspondence information, an irradiated energy density is determined from surface scattering optical intensity as a preset target value. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To reduce the nonuniformity of crystallinity in an added part in the lengthwise direction of a laser light irradiation area when a semiconductor thin film in a larger area than a length in the lengthwise direction of the laser light irradiation area is crystallized by laser annealing. SOLUTION: When at least two lines of long laser lights 11A and 11B are added by two rows or more per line and they are directed to the surface of a semiconductor thin film 12 formed on a substrate 10, added parts 14A and 14B in at least two lines of laser lights 11A and 11B are made not to overlap in position in the lengthwise direction during irradiation. The added parts 14A and 14B of the respective lines of the laser lights 11A and 11B are adjusted, so that they may be overlaid in an area whose laser intensity E of a slope at a beam profile end in the lengthwise direction of adjoining lines is more than 20% to 80% or less. COPYRIGHT: (C)2005,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor device and its manufacturing method which suppresses the growth of pores in a crystalline semiconductor film. SOLUTION: The semiconductor device manufacturing method comprises a step of forming an amorphous silicon film 3 on a substrate 1 having an insulation surface, adding a metal element such as Ni onto the amorphous silicon film 3 for accelerating the crystallization of the amorphous silicon film, heat treating the amorphous silicon film 3 to crystallize this film, thus forming a crystalline silicon film 5 on the substrate, removing a silicon oxide film formed by the heat treatment on the crystalline silicon film 5 surface with a solution containing organic solvents and a fluoride, and irradiating the crystalline silicon film 5 with a laser beam or a strong light beam. COPYRIGHT: (C)2005,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a method for smoothing a laser annealed surface by using a mask having divided opening patterns and divided mask patterns. SOLUTION: The method for smoothing the laser annealed surface comprises: the steps of illuminating a laser beam having a first wavelength; melting a substrate region by using a mask having a first shielding region having an opening pattern which includes a first size and an opening pattern which includes a second size smaller than the first size, and supplying a first energy density by illuminating the laser beam having a first energy density to the substrate region; crystallizing the substrate region; illuminating the diffracted laser beam to the substrate region; and smoothing the surface of the substrate by illuminating the diffracted laser beam. The above-described mask has divided opening patterns on an LILaC region and the surface smoothed region. COPYRIGHT: (C)2004,JPO
Abstract:
PROBLEM TO BE SOLVED: To reduce the concentration of a catalyst element included in a crystalline semiconductor layer of a thin film transistor. SOLUTION: The method for manufacturing a semiconductor device comprises: a process for preparing an amorphous semiconductor film 104a to which a catalyst element 105 for accelerating crystallization is at least partially added; a process for crystallizing at least a part of the amorphous semiconductor film 104a by treating the amorphous semiconductor film 104a by first heat treatment to obtain a crystalline semiconductor film 104p including crystalline region; a process for forming a reflection prevention layer 108 for exposing at least a part of the crystalline region on the surface of the crystalline region; a process for forming a recrystallized region 104r by recrystallizing the exposed portion out of the crystalline region by irradiating the crystalline semiconductor film 104p with a laser beam and forming a gettering region 104g including an amorphous semiconductor on the portion covered with the reflection prevention layer out of the crystalline semiconductor film 104p; and a process for moving at least a part of the catalyst element 105 in the recrystallized region to the gettering region by treating the crystalline semiconductor film 104p by second heat treatment. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a laser apparatus which can emit over a long term a laser beam having stable output power. SOLUTION: The laser apparatus 1 has a housing 101 having a laser-medium storing chamber 102 for storing therein a laser-medium gas, a first laser window 104 provided in the wall surface of the housing 101, and a gas feeding device 114 for feeding the laser-medium gas to the laser-medium storing chamber 102. The laser beam generated by exciting the laser-medium gas is emitted from the first laser window 104 to the outside of the housing 101. The laser apparatus 1 has at least a pressure regulating valve 117 for regulating the inner pressure of the laser-medium storing chamber 102 in a laser oscillating state, and in the laser oscillating state, by the gas feeding device 114, the laser-medium gas is fed from the outside of the laser apparatus 1 to the laser-medium storing chamber 102. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To reduce the unevenness of crystal phase generation in laser annealing. SOLUTION: The irradiation of laser beams has slit shapes whose corners are configured of edge lines and masking patterns arranged at the corners for weakening an energy concentration with which a substrate is irradiated. The other method is provided by deforming the corners into tapered shapes like triangles. Also, the other method is provided by integrating various mask shapes into the respective corners. For example, the corners may not be provided with more than one masking pattern, or the triangular regions may not be provided with more than one masking pattern. The shapes of the masks are applied by deformation examples used for decreasing the energy concentration. COPYRIGHT: (C)2004,JPO
Abstract:
PROBLEM TO BE SOLVED: To provide a discharge excitation type excimer laser that improves durability in a counter electrode (main electrode), where discharge causes heavy exhaustion, and can reduce the number of times for exchanging the main electrode. SOLUTION: In the discharge excitation type excimer laser having a pair of counter electrodes, at least one of the counter electrodes is rotatable, and the discharge surface of the counter electrode can be changed. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a manufacturing method of a semiconductor crystal layer having a plurality of crystal characteristics, a semiconductor substrate, and a liquid crystal display panel. SOLUTION: The manufacturing method of the semiconductor crystal layer having the plurality of crystal characteristics includes a process for irradiating a first region on the semiconductor substrate with a laser beam through a first mask having a first pattern to anneal the first region, a process for carrying out growth to a first crystal state in the semiconductor layer of the first region by the annealing process of the first region, a process for annealing a second region by irradiating a second region on the semiconductor substrate with a laser beam through a second mask having a second pattern, and a process for carrying out growth to a second crystal state differing from the first one on the semiconductor layer of the second region by the annealing process of the second region. COPYRIGHT: (C)2004,JPO
Abstract:
PROBLEM TO BE SOLVED: To markedly reduce a laser annealing process time related to the use of a multi-pattern mask, when a multi-pattern mask is moved relative to a substrate in the direction opposite to a certain direction. SOLUTION: A laser irradiation method comprises a first process of exposing the semiconductor substrate to a laser beam that is radiated through the multi- pattern mask, a second process of relatively moving the mask and the substrate to an optical system in a first direction and exposing the adjacent regions of the substrate continuously to the laser beam in the prescribed first order for the corresponding mask patterns, and a third process of relatively moving the mask and the substrate to the optical system, in a second direction opposite to the first direction and exposing the adjacent regions of the substrate continuously to the laser beam irradiation in the first sequence for the corresponding mask patterns. COPYRIGHT: (C)2003,JPO