公开(公告)号：JP2012004195A

公开(公告)日：2012-01-05

申请号：JP2010135694

申请日：2010-06-15

Applicant: Sumitomo Electric Ind Ltd ,  Sumitomo Electric Printed Circuit Inc ,  住友電工プリントサーキット株式会社 ,  住友電気工業株式会社

Inventor： AKAHA YOSHIHIRO ,  MATSUBARA HIDEKI ,  SAITO HIROHISA ,  MATSUMURA HIROYUKI ,  KITO KAZUHIRO ,  OKUYAMA HIROSHI

IPC: H05K1/02 ,  F21V19/00 ,  F21V29/00 ,  F21Y101/02

CPC classification number: H05K1/0203 ,  H05K1/028 ,  H05K3/0044 ,  H05K3/0061

Abstract: PROBLEM TO BE SOLVED: To provide a flexible substrate module that uses a flexible substrate and is sufficiently excellent in heat radiation to a mounted heat source, flexibility and integration.SOLUTION: In a flexible substrate module 1 which has a print wiring layer 12 formed as a surface layer laminated at the surface side of a flexible insulating base material 11, and a heat source 14 mounted on the print wiring layer 12 and is fixed to a housing K as a fixing partner in contact with the housing K, thermal diffusion promoting layers 21,23 formed of high thermal conduction material to promote enlargement of the area of a heat spot transferred from the heat source 14 to the print wiring layer 12 toward the housing K as the fixing partner are laminated as back surface layers laminated at the back surface side of the flexible insulating base material 11 over plural times.

Abstract translation: 要解决的问题：提供一种柔性基板模块，其使用柔性基板并且对于安装的热源具有足够优异的热辐射，柔性和集成度。 解决方案：在柔性基板模块1中，具有形成为在柔性绝缘基材11的表面侧层叠的表面层的印刷布线层12和安装在印刷布线层12上的热源14，并且是 固定到作为与壳体K接触的固定对象的壳体K，由高导热材料形成的热扩散促进层21,23，以促进从热源14传送到印刷布线层的热点的面积的扩大 12作为定影对象的壳体K多层叠在柔性绝缘基材11的背面侧的背面层。 版权所有（C）2012，JPO＆INPIT

公开(公告)号：JP2007123593A

公开(公告)日：2007-05-17

申请号：JP2005314415

申请日：2005-10-28

Applicant: Sumitomo Electric Printed Circuit Inc ,  住友電工プリントサーキット株式会社

Inventor： OKUYAMA HIROSHI ,  YAMABAYASHI NAOYUKI ,  YAMADA KATSUYA

IPC: H05K3/28

Abstract: PROBLEM TO BE SOLVED: To provide a flexible printed wiring board which is used within an automatic transmission and is capable of preventing an insulating resistance between the adjacent conductor circuits from lowering even when it is soaked in lubrication oil.
SOLUTION: This flexible printed wiring board 1 is intended for use in lubrication oil. This board comprises a conductor circuit 4 provided on a base material 2, a terminal array 9 for electrically connecting the conductor circuit 4 and the outside of the flexible printed wiring board 1, and a cover lay film 7 for covering the conductor circuit 4. In addition, the terminal array 9 is covered with a coating material 11.
COPYRIGHT: (C)2007,JPO&INPIT

Abstract translation: 要解决的问题：提供一种在自动变速器内使用的柔性印刷线路板，并且即使在润滑油中浸泡时也能够防止相邻导体电路之间的绝缘电阻降低。

解决方案：该柔性印刷线路板1用于润滑油。 该基板包括设置在基材2上的导体电路4，用于电连接导体电路4和柔性印刷电路板1的外部的端子阵列9和覆盖导体电路4的覆盖膜7。 此外，端子阵列9被涂覆材料11覆盖。版权所有（C）2007，JPO＆INPIT

公开(公告)号：JP2013236121A

公开(公告)日：2013-11-21

申请号：JP2012105333

申请日：2012-05-02

Applicant: Sumitomo Electric Printed Circuit Inc ,  住友電工プリントサーキット株式会社

Inventor： SHINYA YOSHIHISA ,  OKUYAMA HIROSHI

IPC: H01P1/04 ,  H01L23/12 ,  H01P5/02

Abstract: PROBLEM TO BE SOLVED: To provide a high frequency circuit structure which includes a high frequency circuit, efficiently realizes good electric characteristics, and, in particular, achieves the downsizing of a printed wiring board when the printed wiring board is formed, and to provide a manufacturing method of the high frequency circuit structure.SOLUTION: A high frequency circuit structure K includes: a base material 10 formed by an insulative resin; a first high frequency circuit 21a provided on the base material 10 and made of a conductive metal; and a second high frequency circuit 21b electrically connected with the first high frequency circuit 21a in at least a part thereof. The second high frequency circuit 21b is formed as a layer formed by applying and burning a conductive ink containing metal particles.

Abstract translation: 要解决的问题：为了提供包括高频电路的高频电路结构，有效地实现良好的电特性，并且特别地，当形成印刷线路板时实现了印刷线路板的小型化，并且提供一种 高频电路结构的制造方法。解决方案：高频电路结构K包括：由绝缘树脂形成的基材10; 设置在基材10上并由导电金属制成的第一高频电路21a; 以及在其至少一部分与第一高频电路21a电连接的第二高频电路21b。 第二高频电路21b形成为通过涂敷和燃烧含有金属颗粒的导电油墨形成的层。

公开(公告)号：JP2006019345A

公开(公告)日：2006-01-19

申请号：JP2004193099

申请日：2004-06-30

Applicant: Sumitomo Electric Printed Circuit Inc ,  住友電工プリントサーキット株式会社

Inventor： OKUYAMA HIROSHI ,  NISHIMURA AKIRA ,  YAMADA KATSUYA

IPC: H05K3/28 ,  H05K1/02

Abstract: PROBLEM TO BE SOLVED: To provide a flexible printed wiring board which has excellent electromagnetic shielding property and fire retardancy and superior step coverage and flexibility, has no environmental problems, and does not require a process such as thermal press for forming a shielding layer in manufacturing the same.
SOLUTION: The flexible printed wiring board comprises a base film, conductor circuit formed on the base film, cover lay for covering the conductor circuit, conductive paste layer formed on the cover layer, and top coat formed on the conductive paste layer. An adhesive layer interposed between the base film and the cover lay contains a non-halogen flame retarder, and the conductive paste layer has an average thickness of 22 μm or less and/or the top coat contains a non-halogen flame retarder.
COPYRIGHT: (C)2006,JPO&NCIPI

Abstract translation: 要解决的问题：为了提供具有优异的电磁屏蔽性和阻燃性以及优异的台阶覆盖性和柔软性的柔性印刷线路板，没有环境问题，并且不需要诸如用于形成屏蔽的热压机 制造层相同。 解决方案：柔性印刷电路板包括基膜，形成在基膜上的导体电路，用于覆盖导体电路的覆盖层，形成在覆盖层上的导电糊层和形成在导电糊层上的顶涂层。 插入在基膜和盖板之间的粘合层包含非卤素阻燃剂，导电糊层的平均厚度为22μm以下，和/或顶涂层含有无卤阻燃剂。 版权所有（C）2006，JPO＆NCIPI