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公开(公告)号：JP2008147554A
公开(公告)日：2008-06-26
申请号：JP2006335625
申请日：2006-12-13
Applicant: Sumitomo Electric Printed Circuit Inc , 住友電工プリントサーキット株式会社
Inventor： UENISHI NAOTA , YAMABAYASHI NAOYUKI , NAKAMA KOKI , NISHIKAWA JUNICHIRO , SHIBATA MASAHIRO , NISHIMURA AKIRA
Abstract: PROBLEM TO BE SOLVED: To provide an optical module capable of coping with the miniaturization of an electric equipment, such as a portable telephone unit, and to provide the electric equipment having such an optical module. SOLUTION: The optical module 5 has: a substrate 10; a laser diode 2 that is provided on a surface 10a of the substrate 10 and is a light-emitting element emitting a light signal; a drive element 3 that is provided on the surface 10a of the substrate 10, is connected to the laser diode 2 electrically, and drives the laser diode 2; and an electric connector 12 that supplies the drive power of the laser diode 2 and the drive element 3 and is provided on the rear 10b of the substrate 10. COPYRIGHT: (C)2008,JPO&INPIT
Abstract translation: 要解决的问题：提供一种能够应对诸如便携式电话单元的电气设备的小型化的光学模块，并提供具有这种光学模块的电气设备。 光学模块5具有：基板10; 设置在基板10的表面10a上并且是发出光信号的发光元件的激光二极管2; 设置在基板10的表面10a上的驱动元件3电连接到激光二极管2，驱动激光二极管2; 以及提供激光二极管2和驱动元件3的驱动电力并设置在基板10的后10b上的电连接器12.版权所有（C）2008，JPO＆INPIT
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公开(公告)号：JP2004079855A
公开(公告)日：2004-03-11
申请号：JP2002239648
申请日：2002-08-20
Applicant: Sumitomo Electric Printed Circuit Inc , 住友電工プリントサーキット株式会社
Inventor： OKA YOSHIO , KANDA MASAHIKO , HAYASHI NORIKATA , KIMURA TOSHIHIDE , KASHIWAGI SHUJI , NISHIMURA AKIRA
CPC classification number: H01L2224/16225
Abstract: PROBLEM TO BE SOLVED: To provide a novel printed circuit board which is formed by adhering a metallic plate firmly with higher thermal conductivity and enables the metallic plate to fully exert its function as a heat sink and a reinforcing plate. SOLUTION: A metallic plate 3 is adhered to the rear of a chip mounting part 2 of a substrate 1 having the bump-method chip mounting part 2 consisting of a number of conductor circuits 21 in the surface of the substrate 1 via an adhesive layer 4 containing chain-like metallic powder. COPYRIGHT: (C)2004,JPO
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公开(公告)号：JP2008145927A
公开(公告)日：2008-06-26
申请号：JP2006335626
申请日：2006-12-13
Applicant: Sumitomo Electric Printed Circuit Inc , 住友電工プリントサーキット株式会社
Inventor： UENISHI NAOTA , YAMABAYASHI NAOYUKI , NAKAMA KOKI , NISHIKAWA JUNICHIRO , SHIBATA MASAHIRO , NISHIMURA AKIRA
Abstract: PROBLEM TO BE SOLVED: To provide an optical module capable of coping with downsizing of electric equipment, and to provide electric equipment having the optical module. SOLUTION: The optical module 1 is equipped with a transmitting optical module 5 including a substrate 10, a laser diode 2 which is a light emitting element for emitting optical signals, and an electric connector 12. The optical module 1 is also equipped with a receiving optical module 9 including a substrate 13, a photo diode 6 which is a light receiving element in which optical signals enter and in which the optical signals are converted to electric signals, and an electric connector 15. The optical module 1 is further equipped with an optical waveguide 24 that is attached to each of the substrates 10, 13 and that is for optically coupling the laser diode 2 and the photo diode 6, and equipped with electric wiring 40 that is installed in each of the electric connectors 12, 15 and that is for electrically connecting the electric connectors 12, 15. COPYRIGHT: (C)2008,JPO&INPIT
Abstract translation: 要解决的问题：提供一种能够应对电气设备的小型化并提供具有光学模块的电气设备的光学模块。 光学模块1配备有包括基板10的发射光学模块5，作为用于发射光信号的发光元件的激光二极管2和电连接器12.光学模块1还配备有 具有包括基板13的接收光学模块9，作为光信号进入并且其中光信号被转换为电信号的光接收元件的光电二极管6和电连接器15.光模块1进一步 配备有附接到每个基板10,13并且用于光学耦合激光二极管2和光电二极管6并且配备有安装在每个电连接器12中的电线40的光波导24， 15，用于电连接电连接器12,15。版权所有：（C）2008，JPO＆INPIT
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公开(公告)号：JP2006019345A
公开(公告)日：2006-01-19
申请号：JP2004193099
申请日：2004-06-30
Applicant: Sumitomo Electric Printed Circuit Inc , 住友電工プリントサーキット株式会社
Inventor： OKUYAMA HIROSHI , NISHIMURA AKIRA , YAMADA KATSUYA
Abstract: PROBLEM TO BE SOLVED: To provide a flexible printed wiring board which has excellent electromagnetic shielding property and fire retardancy and superior step coverage and flexibility, has no environmental problems, and does not require a process such as thermal press for forming a shielding layer in manufacturing the same.
SOLUTION: The flexible printed wiring board comprises a base film, conductor circuit formed on the base film, cover lay for covering the conductor circuit, conductive paste layer formed on the cover layer, and top coat formed on the conductive paste layer. An adhesive layer interposed between the base film and the cover lay contains a non-halogen flame retarder, and the conductive paste layer has an average thickness of 22 μm or less and/or the top coat contains a non-halogen flame retarder.
COPYRIGHT: (C)2006,JPO&NCIPIAbstract translation: 要解决的问题：为了提供具有优异的电磁屏蔽性和阻燃性以及优异的台阶覆盖性和柔软性的柔性印刷线路板，没有环境问题，并且不需要诸如用于形成屏蔽的热压机 制造层相同。 解决方案：柔性印刷电路板包括基膜，形成在基膜上的导体电路，用于覆盖导体电路的覆盖层，形成在覆盖层上的导电糊层和形成在导电糊层上的顶涂层。 插入在基膜和盖板之间的粘合层包含非卤素阻燃剂，导电糊层的平均厚度为22μm以下，和/或顶涂层含有无卤阻燃剂。 版权所有（C）2006，JPO＆NCIPI
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