Printed wiring board connection structure, head stack assembly with printed wiring board connection structure, magnetic disk device with head stack assembly, and method for manufacturing printed wiring board connection structure
    1.
    发明专利
    Printed wiring board connection structure, head stack assembly with printed wiring board connection structure, magnetic disk device with head stack assembly, and method for manufacturing printed wiring board connection structure 有权
    印刷接线板连接结构,头印组件与印刷线路板连接结构,磁头盒装置与头架组件,以及制造印刷电路板连接结构的方法

    公开(公告)号:JP2012160536A

    公开(公告)日:2012-08-23

    申请号:JP2011018302

    申请日:2011-01-31

    Abstract: PROBLEM TO BE SOLVED: To provide a printed circuit board connection structure capable of improving electric and mechanical connection reliability, a head stack assembly with the printed wiring board connection structure, a magnetic disk device with the head stack assembly, and a method for manufacturing the printed circuit board connection structure.SOLUTION: In a printed wiring board connection structure 1000, a flying lead F provided on a first printed wiring board 321 and an exposing lead E provided on a second printed wiring board 333 are ultrasonic-connected with each other via a metal plating layer M. The exposing lead E is exposed to a recess U formed by opening one part of an insulation layer 333c laminated on a substrate 333a, and the metal plating layer M is formed on a surface of the exposing lead E with thickness larger than depth of the recess U.

    Abstract translation: 要解决的问题:提供一种能够改善电气和机械连接可靠性的印刷电路板连接结构,具有印刷线路板连接结构的磁头堆叠组件,具有磁头堆叠组件的磁盘装置和方法 用于制造印刷电路板连接结构。 解决方案:在印刷线路板连接结构1000中,设置在第一印刷线路板321上的飞行引线F和设置在第二印刷线路板333上的曝光引线E通过金属电镀彼此超声波连接 曝光引线E暴露于通过打开层叠在基板333a上的绝缘层333c的一部分而形成的凹部U.金属镀层M形成在暴露引线E的厚度大于深度的表面上 (C)2012,JPO&INPIT

    Printed wiring board connection structure, head stack assembly with printed wiring board connection structure, magnetic disk device with head stack assembly, and method for manufacturing printed wiring board connection structure
    2.
    发明专利
    Printed wiring board connection structure, head stack assembly with printed wiring board connection structure, magnetic disk device with head stack assembly, and method for manufacturing printed wiring board connection structure 审中-公开
    印刷接线板连接结构,头印组件与印刷线路板连接结构,磁头盒装置与头架组件,以及制造印刷电路板连接结构的方法

    公开(公告)号:JP2012160535A

    公开(公告)日:2012-08-23

    申请号:JP2011018301

    申请日:2011-01-31

    Abstract: PROBLEM TO BE SOLVED: To provide a printed circuit board connection structure capable of improving electric and mechanical connection reliability, a head stack assembly with the printed wiring board connection structure, a magnetic disk device with the head stack assembly, and a method for manufacturing the printed circuit board connection structure.SOLUTION: In a printed circuit board connection structure 1000, a flying lead F and an exposing lead E are connected with each other via an anisotropic conductive material 500. Both outer sides of the flying lead F in a connection region S are bent toward a second printed circuit board 333 into a bent shape. The anisotropic conductive material 500 extends to an end region C1 on one side of the connection region S, extends to an end region C2 on an opposite side of the connection region S, and is filled between the first printed wiring board 321 and the second printed wiring board 333.

    Abstract translation: 要解决的问题:提供一种能够改善电气和机械连接可靠性的印刷电路板连接结构,具有印刷线路板连接结构的磁头堆叠组件,具有磁头堆叠组件的磁盘装置和方法 用于制造印刷电路板连接结构。 解决方案:在印刷电路板连接结构1000中,飞铅F和曝光引线E通过各向异性导电材料500彼此连接。连接区域S中的飞行引线F的两个外侧弯曲 朝向第二印刷电路板333弯曲成形。 各向异性导电材料500延伸到连接区域S的一侧上的端部区域C1,延伸到连接区域S的相对侧上的端部区域C2,并且填充在第一印刷线路板321和第二印刷电路板 电路板333.版权所有(C)2012,JPO&INPIT

    Flexible wiring board, connection structure of wiring board and method of manufacturing thereof
    3.
    发明专利
    Flexible wiring board, connection structure of wiring board and method of manufacturing thereof 审中-公开
    柔性布线板,接线板连接结构及其制造方法

    公开(公告)号:JP2012146353A

    公开(公告)日:2012-08-02

    申请号:JP2011002282

    申请日:2011-01-07

    Abstract: PROBLEM TO BE SOLVED: To provide a flexible wiring board and the like capable of obtaining a connection part having durability by securely connecting a terminal located on the bottom of a connection pad part and an exposed lead.SOLUTION: In a connection structure of a main flexible wiring board 20 and a flexible wiring board 10, the main flexible wiring board has a terminal 21 located on the bottom of a connection pad part K in which an insulating layer 23 is removed and the flexible wiring board 10 has an exposed lead 11 at a terminal part T in which an insulating layer 13 is removed. The exposed lead is processed to have parts 11a and 11c which overhang to the connection part of the wiring board and a projecting part of the exposed lead is electrically connected to the terminal 21 of the connection pad part.

    Abstract translation: 要解决的问题:提供一种柔性布线板等,其能够通过牢固地连接位于连接焊盘部分的底部上的端子和暴露的引线来获得具有耐久性的连接部分。 解决方案:在主柔性布线板20和柔性布线板10的连接结构中,主柔性布线板具有位于连接焊盘部分K的底部的端子21,其中绝缘层23被去除 并且柔性布线板10在其中去除绝缘层13的端子部分T具有暴露的引线11。 将暴露的引线加工成具有突出到布线板的连接部分的部分11a和11c,并且暴露引线的突出部分电连接到连接焊盘部分的端子21。 版权所有(C)2012,JPO&INPIT

    Connection structure of printed wiring board, head stack assembly equipped with connection structure of printed wiring board, magnetic disc device equipped with head stack assembly, and method of manufacturing connection structure of printed wiring board
    4.
    发明专利
    Connection structure of printed wiring board, head stack assembly equipped with connection structure of printed wiring board, magnetic disc device equipped with head stack assembly, and method of manufacturing connection structure of printed wiring board 审中-公开
    印刷线路板的连接结构,装有印刷线路板的连接结构的头架组件,配有头架组件的磁性碟片装置以及制造印刷线路板连接结构的方法

    公开(公告)号:JP2012156371A

    公开(公告)日:2012-08-16

    申请号:JP2011015350

    申请日:2011-01-27

    Abstract: PROBLEM TO BE SOLVED: To provide a connection structure of a printed wiring board capable of enhancing electrical and mechanical connection reliability, a head stack assembly equipped with the connection structure of a printed wiring board, a magnetic disc device equipped with the head stack assembly, and a method of manufacturing the connection structure of a printed wiring board.SOLUTION: A connection structure 1000 of a printed wiring board comprises a first printed wiring board 321 equipped with a flying lead F, a second printed wiring board 333 equipped with an exposed lead E receiving the flying lead F, and an anisotropic conductive material 500 which connects the flying lead F and the exposed lead E. The flying lead F is configured to be bent to the second printed wiring board 333 side so that both sides of a connection region S, being connected with the exposed lead E via the anisotropic conductive material 500, are lower than the connection region S.

    Abstract translation: 要解决的问题:为了提供能够提高电气和机械连接可靠性的印刷线路板的连接结构,配备有印刷线路板的连接结构的磁头堆叠组件,配备有磁头的磁盘装置 堆叠组件,以及制造印刷电路板的连接结构的方法。 解决方案:印刷电路板的连接结构1000包括配备有飞行引线F的第一印刷线路板321,配备有接收飞行引线F的露出引线E的第二印刷线路板333以及各向异性导电 连接飞铅F和暴露的引线E的材料500.飞铅F被配置为弯曲到第二印刷线路板333侧,使得连接区域S的两侧经由暴露的引线E经由 各向异性导电材料500低于连接区域S.版权所有:(C)2012,JPO&INPIT

    Connection structure of printed wiring board, head stack assembly with connection structure of printed wiring board, magnetic disk drive with head stack assembly, and method of manufacturing connection structure of printed wiring board
    5.
    发明专利
    Connection structure of printed wiring board, head stack assembly with connection structure of printed wiring board, magnetic disk drive with head stack assembly, and method of manufacturing connection structure of printed wiring board 审中-公开
    印刷线路板的连接结构,印刷线路板的连接结构的头架组件,带有头架组件的磁盘驱动器,以及制造印刷电路板的连接结构的方法

    公开(公告)号:JP2012155803A

    公开(公告)日:2012-08-16

    申请号:JP2011015349

    申请日:2011-01-27

    Abstract: PROBLEM TO BE SOLVED: To provide a connection structure of a printed wiring board, a head stack assembly with the connection structure of the printed wiring board, a magnetic disk drive with the head stack assembly, and a method of manufacturing the connection structure of the printed wiring board such that complication of manufacturing processes and an increase in cost can be prevented, and electric and mechanical connections are improved in reliability.SOLUTION: There is provided a connection structure 1000 of a printed wiring board including a first printed wiring board 321 which has an exposed lead 321b on a base material 321a, a second wiring board 333 which has a conductor 333b for receiving the lead 321b, and an anisotropic conductive material 500 connecting the lead 321b and the conductor 333b to each other. The conductor 333b is exposed in a recessed part U formed by opening a part of an insulating layer 333c laminated on a base material 333a, and the anisotropic conductive material 500 is interposed to fill the recessed part U.

    Abstract translation: 要解决的问题:为了提供印刷线路板的连接结构,具有印刷线路板的连接结构的磁头堆叠组件,具有磁头堆叠组件的磁盘驱动器以及制造连接的方法 能够防止印刷电路板的结构化,从而可以防止制造工艺的复杂化和成本的增加,并且提高电气和机械连接的可靠性。 解决方案:提供了一种印刷电路板的连接结构1000,其包括:在基材321a上具有暴露引线321b的第一印刷线路板321;第二布线板333,其具有用于接收引线的导体333b 321b和将引线321b和导体333b连接的各向异性导电材料500。 导体333b暴露在通过打开层叠在基材333a上的绝缘层333c的一部分而形成的凹部U中,并且插入各向异性导电材料500以填充凹部U.版权所有(C) 2012年,JPO&INPIT

    Connection structure of wiring board, forming method of the same and hdd
    6.
    发明专利
    Connection structure of wiring board, forming method of the same and hdd 有权
    接线板连接结构,形成方法和硬盘

    公开(公告)号:JP2012150872A

    公开(公告)日:2012-08-09

    申请号:JP2011010889

    申请日:2011-01-21

    Abstract: PROBLEM TO BE SOLVED: To provide a connection structure of a wiring board or the like, in which a connection part with durability, for surely connecting a terminal located at a bottom part of a connection pad part and an exposed lead, can be obtained.SOLUTION: The connection structure of a wiring board comprises: a main flexible wiring board 20 having a connection pad part K; a flexible wiring board 10 having a flying lead 11; an ACF 5; and a resin 7 located so as to cover the flying lead and a terminal 21. An opening 5h exists around a conductive connection part of the ACF, and through the opening, the resin covering an exposed lead and the terminal of the conductive connection part is continuously bonded to a substrate 22 forming a bottom part of the connection pad part.

    Abstract translation: 要解决的问题:为了提供布线板等的连接结构,其中具有耐久性的连接部分,用于可靠地连接位于连接焊盘部分的底部的端子和暴露的引线,可以 得到。 解决方案:布线板的连接结构包括:具有连接焊盘部分K的主柔性布线板20; 具有飞行导线11的柔性布线板10; ACF 5; 以及覆盖飞铅和端子21的树脂7.在ACF的导电连接部分周围存在开口5h,通过该开口,覆盖裸露引线的树脂和导电连接部的端子是 连续地结合到形成连接焊盘部分的底部的基板22。 版权所有(C)2012,JPO&INPIT

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