公开(公告)号：JP2012160536A

公开(公告)日：2012-08-23

申请号：JP2011018302

申请日：2011-01-31

Applicant: Sumitomo Electric Printed Circuit Inc ,  住友電工プリントサーキット株式会社

Inventor： MATSUOKA TORU ,  SAITO YASUHISA ,  HAMADA KENJI

IPC: H05K1/14 ,  G11B5/60 ,  H05K3/36

Abstract: PROBLEM TO BE SOLVED: To provide a printed circuit board connection structure capable of improving electric and mechanical connection reliability, a head stack assembly with the printed wiring board connection structure, a magnetic disk device with the head stack assembly, and a method for manufacturing the printed circuit board connection structure.SOLUTION: In a printed wiring board connection structure 1000, a flying lead F provided on a first printed wiring board 321 and an exposing lead E provided on a second printed wiring board 333 are ultrasonic-connected with each other via a metal plating layer M. The exposing lead E is exposed to a recess U formed by opening one part of an insulation layer 333c laminated on a substrate 333a, and the metal plating layer M is formed on a surface of the exposing lead E with thickness larger than depth of the recess U.

Abstract translation: 要解决的问题：提供一种能够改善电气和机械连接可靠性的印刷电路板连接结构，具有印刷线路板连接结构的磁头堆叠组件，具有磁头堆叠组件的磁盘装置和方法 用于制造印刷电路板连接结构。 解决方案：在印刷线路板连接结构1000中，设置在第一印刷线路板321上的飞行引线F和设置在第二印刷线路板333上的曝光引线E通过金属电镀彼此超声波连接 曝光引线E暴露于通过打开层叠在基板333a上的绝缘层333c的一部分而形成的凹部U.金属镀层M形成在暴露引线E的厚度大于深度的表面上 （C）2012，JPO＆INPIT

公开(公告)号：JP2012160535A

公开(公告)日：2012-08-23

申请号：JP2011018301

申请日：2011-01-31

Applicant: Sumitomo Electric Printed Circuit Inc ,  住友電工プリントサーキット株式会社

Inventor： MATSUOKA TORU ,  SAITO YASUHISA ,  HAMADA KENJI

IPC: H05K1/14 ,  G11B5/60 ,  H05K3/36

Abstract: PROBLEM TO BE SOLVED: To provide a printed circuit board connection structure capable of improving electric and mechanical connection reliability, a head stack assembly with the printed wiring board connection structure, a magnetic disk device with the head stack assembly, and a method for manufacturing the printed circuit board connection structure.SOLUTION: In a printed circuit board connection structure 1000, a flying lead F and an exposing lead E are connected with each other via an anisotropic conductive material 500. Both outer sides of the flying lead F in a connection region S are bent toward a second printed circuit board 333 into a bent shape. The anisotropic conductive material 500 extends to an end region C1 on one side of the connection region S, extends to an end region C2 on an opposite side of the connection region S, and is filled between the first printed wiring board 321 and the second printed wiring board 333.

Abstract translation: 要解决的问题：提供一种能够改善电气和机械连接可靠性的印刷电路板连接结构，具有印刷线路板连接结构的磁头堆叠组件，具有磁头堆叠组件的磁盘装置和方法 用于制造印刷电路板连接结构。 解决方案：在印刷电路板连接结构1000中，飞铅F和曝光引线E通过各向异性导电材料500彼此连接。连接区域S中的飞行引线F的两个外侧弯曲 朝向第二印刷电路板333弯曲成形。 各向异性导电材料500延伸到连接区域S的一侧上的端部区域C1，延伸到连接区域S的相对侧上的端部区域C2，并且填充在第一印刷线路板321和第二印刷电路板 电路板333.版权所有（C）2012，JPO＆INPIT

公开(公告)号：JP2012146353A

公开(公告)日：2012-08-02

申请号：JP2011002282

申请日：2011-01-07

Applicant: Sumitomo Electric Printed Circuit Inc ,  住友電工プリントサーキット株式会社

Inventor： MATSUOKA TORU ,  SAITO YASUHISA ,  HAMADA KENJI

IPC: G11B21/02 ,  G11B21/21 ,  G11B33/12

Abstract: PROBLEM TO BE SOLVED: To provide a flexible wiring board and the like capable of obtaining a connection part having durability by securely connecting a terminal located on the bottom of a connection pad part and an exposed lead.SOLUTION: In a connection structure of a main flexible wiring board 20 and a flexible wiring board 10, the main flexible wiring board has a terminal 21 located on the bottom of a connection pad part K in which an insulating layer 23 is removed and the flexible wiring board 10 has an exposed lead 11 at a terminal part T in which an insulating layer 13 is removed. The exposed lead is processed to have parts 11a and 11c which overhang to the connection part of the wiring board and a projecting part of the exposed lead is electrically connected to the terminal 21 of the connection pad part.

Abstract translation: 要解决的问题：提供一种柔性布线板等，其能够通过牢固地连接位于连接焊盘部分的底部上的端子和暴露的引线来获得具有耐久性的连接部分。 解决方案：在主柔性布线板20和柔性布线板10的连接结构中，主柔性布线板具有位于连接焊盘部分K的底部的端子21，其中绝缘层23被去除 并且柔性布线板10在其中去除绝缘层13的端子部分T具有暴露的引线11。 将暴露的引线加工成具有突出到布线板的连接部分的部分11a和11c，并且暴露引线的突出部分电连接到连接焊盘部分的端子21。 版权所有（C）2012，JPO＆INPIT

公开(公告)号：JP2009283501A

公开(公告)日：2009-12-03

申请号：JP2008131218

申请日：2008-05-19

Applicant: Sumitomo Electric Printed Circuit Inc ,  住友電工プリントサーキット株式会社

Inventor： UEHARA SUMITO ,  MATSUOKA TORU ,  SHIMOMURA TETSUYA

IPC: H05K3/24 ,  H05K1/02 ,  H05K1/09 ,  H05K3/00

Abstract: PROBLEM TO BE SOLVED: To provide a method of manufacturing a printed wiring board that suppresses a decrease in productivity of the printed wiring board and improve the yield, and the printed wiring board manufactured by the method. SOLUTION: The method of manufacturing the printed wiring board includes the stages of: allocating a plurality of metal frames 51 to 56 on a base substrate 50 made of metal foil, and allocating a plurality of metal substrates 2 on each of the metal frames 51 to 56; providing an insulating layer 3 on an upper surface of the base substrate 50 including the plurality of metal substrates 2, and providing a conductive layer on an upper surface of the insulating layer 3; cutting a base substrate body 50a outside outer peripheries of the plurality of metal frames 51 to 56 to separate the plurality of metal frames 51 to 56 from the base substrate body 50a; and plating an upper surface of the conductive layer to coat the upper surface of the conductive layer with a plating layer. COPYRIGHT: (C)2010,JPO&INPIT

Abstract translation: 解决问题的方法：提供抑制印刷电路板的生产率降低并提高成品率的印刷电路板的制造方法以及通过该方法制造的印刷线路板。 解决方案：制造印刷电路板的方法包括以下步骤：在由金属箔制成的基底基板50上分配多个金属框架51至56，并且在每个金属上分配多个金属基板2 框51至56; 在包括多个金属基板2的基板50的上表面上设置绝缘层3，并在绝缘层3的上表面上设置导电层; 在多个金属框架51至56的外周外部切割基底基板主体50a，以将多个金属框架51至56与基底主体50a分离; 以及电镀所述导电层的上表面，以镀覆所述导电层的上表面。 版权所有（C）2010，JPO＆INPIT

公开(公告)号：JP2012156371A

公开(公告)日：2012-08-16

申请号：JP2011015350

申请日：2011-01-27

Applicant: Sumitomo Electric Printed Circuit Inc ,  住友電工プリントサーキット株式会社

Inventor： MATSUOKA TORU ,  SAITO YASUHISA ,  HAMADA KENJI

IPC: H05K1/14 ,  G11B21/02 ,  G11B21/21 ,  H05K3/36

CPC classification number: G11B5/4846 ,  G11B5/5569 ,  H05K3/323 ,  H05K2201/1078 ,  H05K2201/10818

Abstract: PROBLEM TO BE SOLVED: To provide a connection structure of a printed wiring board capable of enhancing electrical and mechanical connection reliability, a head stack assembly equipped with the connection structure of a printed wiring board, a magnetic disc device equipped with the head stack assembly, and a method of manufacturing the connection structure of a printed wiring board.SOLUTION: A connection structure 1000 of a printed wiring board comprises a first printed wiring board 321 equipped with a flying lead F, a second printed wiring board 333 equipped with an exposed lead E receiving the flying lead F, and an anisotropic conductive material 500 which connects the flying lead F and the exposed lead E. The flying lead F is configured to be bent to the second printed wiring board 333 side so that both sides of a connection region S, being connected with the exposed lead E via the anisotropic conductive material 500, are lower than the connection region S.

Abstract translation: 要解决的问题：为了提供能够提高电气和机械连接可靠性的印刷线路板的连接结构，配备有印刷线路板的连接结构的磁头堆叠组件，配备有磁头的磁盘装置 堆叠组件，以及制造印刷电路板的连接结构的方法。 解决方案：印刷电路板的连接结构1000包括配备有飞行引线F的第一印刷线路板321，配备有接收飞行引线F的露出引线E的第二印刷线路板333以及各向异性导电 连接飞铅F和暴露的引线E的材料500.飞铅F被配置为弯曲到第二印刷线路板333侧，使得连接区域S的两侧经由暴露的引线E经由 各向异性导电材料500低于连接区域S.版权所有：（C）2012，JPO＆INPIT

公开(公告)号：JP2012155803A

公开(公告)日：2012-08-16

申请号：JP2011015349

申请日：2011-01-27

Applicant: Sumitomo Electric Printed Circuit Inc ,  住友電工プリントサーキット株式会社

Inventor： SAITO YASUHISA ,  MATSUOKA TORU

IPC: G11B21/21 ,  G11B5/60 ,  H05K1/14 ,  H05K3/36

Abstract: PROBLEM TO BE SOLVED: To provide a connection structure of a printed wiring board, a head stack assembly with the connection structure of the printed wiring board, a magnetic disk drive with the head stack assembly, and a method of manufacturing the connection structure of the printed wiring board such that complication of manufacturing processes and an increase in cost can be prevented, and electric and mechanical connections are improved in reliability.SOLUTION: There is provided a connection structure 1000 of a printed wiring board including a first printed wiring board 321 which has an exposed lead 321b on a base material 321a, a second wiring board 333 which has a conductor 333b for receiving the lead 321b, and an anisotropic conductive material 500 connecting the lead 321b and the conductor 333b to each other. The conductor 333b is exposed in a recessed part U formed by opening a part of an insulating layer 333c laminated on a base material 333a, and the anisotropic conductive material 500 is interposed to fill the recessed part U.

Abstract translation: 要解决的问题：为了提供印刷线路板的连接结构，具有印刷线路板的连接结构的磁头堆叠组件，具有磁头堆叠组件的磁盘驱动器以及制造连接的方法 能够防止印刷电路板的结构化，从而可以防止制造工艺的复杂化和成本的增加，并且提高电气和机械连接的可靠性。 解决方案：提供了一种印刷电路板的连接结构1000，其包括：在基材321a上具有暴露引线321b的第一印刷线路板321;第二布线板333，其具有用于接收引线的导体333b 321b和将引线321b和导体333b连接的各向异性导电材料500。 导体333b暴露在通过打开层叠在基材333a上的绝缘层333c的一部分而形成的凹部U中，并且插入各向异性导电材料500以填充凹部U.版权所有（C） 2012年，JPO＆INPIT

公开(公告)号：JP2010080722A

公开(公告)日：2010-04-08

申请号：JP2008248250

申请日：2008-09-26

Applicant: Sumitomo Electric Printed Circuit Inc ,  住友電工プリントサーキット株式会社

Inventor： SHIMOMURA TETSUYA ,  MATSUOKA TORU

IPC: H05K3/22 ,  G11B5/60 ,  G11B21/21 ,  G11B33/12 ,  H05K1/02 ,  H05K3/06

Abstract: PROBLEM TO BE SOLVED: To provide an FPC (Flexible Printed Circuit) sheet allowing the easy electrical inspection of the state of the sheet without causing a trouble such as burrs which are generated accompanied by the cut of a plated lead, a method of manufacturing the same, and the FPC sheet for a hard disk device.
SOLUTION: The sheet includes a plated frame 21 and a plurality of FPCs 10. The FPC includes stainless steel foil 1, a base insulating layer 2, wiring 11, the plated lead 11k extending from the wiring and coupled to the plated frame and a cover insulating layer 3 covering these items. The cover insulating layer is situated in common over the sheet while covering the plated frame. On the plurality of FPCs, parts of the cover insulating layer for covering the plated lead part are removed to form root exposed parts K.
COPYRIGHT: (C)2010,JPO&INPIT

Abstract translation: 要解决的问题：为了提供一种FPC（柔性印刷电路）片材，其允许容易地电气检查片材的状态而不引起诸如伴随着电镀引线切割产生的毛刺的麻烦，方法 的制造方法以及用于硬盘装置的FPC片。 解决方案：该片材包括镀覆框架21和多个FPC 10. FPC包括不锈钢箔1，基底绝缘层2，布线11，从布线延伸并连接到镀覆框架的镀覆引线11k 覆盖这些物品的覆盖绝缘层3。 覆盖绝缘层在覆盖电镀框架的同时位于片材上。 在多个FPC上，除去覆盖电镀引线部的覆盖绝缘层的部分，形成根部露出部K.版权所有（C）2010，JPO＆INPIT

公开(公告)号：JP2009253080A

公开(公告)日：2009-10-29

申请号：JP2008100337

申请日：2008-04-08

Applicant: Sumitomo Electric Ind Ltd ,  Sumitomo Electric Printed Circuit Inc ,  住友電工プリントサーキット株式会社 ,  住友電気工業株式会社

Inventor： OKA YOSHIO ,  KASUGA TAKASHI ,  YAGI SHIGETO ,  BOKU TATSUTAMA ,  SHIMOMURA TETSUYA ,  MATSUOKA TORU ,  NOGUCHI KO ,  UENISHI NAOTA ,  OHAMA OSAMU ,  UEDA HIROSHI ,  UEHARA SUMITO ,  MAKINO TAKAHIKO ,  OKAGUCHI KAYO

IPC: H05K1/11

Abstract: PROBLEM TO BE SOLVED: To provide a printed wiring board having excellent connection reliability by using conductive paste.
SOLUTION: A printed wiring board 1 is provided with a first conductive layer 3, an insulating layer 2 provided on the surface of the first conductive layer 3, and a second conductive layer 4 provided on the surface of the insulating layer 2 and electrically connected with the first conductive layer 3. Moreover, the printed wiring board 1 is provided with: a via hole 5 that is formed in the insulating layer 2 and the second conductive layer 4 and has the first conductive layer 3 as a bottom surface and the insulating layer 2 and the second conductive layer 4 as wall surfaces; and conductive paste 6 that is filled in the via hole 5 to electrically connect the first conductive layer 3 and the second conductive layer 4. The opening diameter R1 of the via hole 5 in the insulating layer 2 is set larger than the opening diameter R2 of the via hole 5 in the second conductive layer 4.
COPYRIGHT: (C)2010,JPO&INPIT

Abstract translation: 要解决的问题：通过使用导电膏来提供具有优异连接可靠性的印刷线路板。 解决方案：印刷电路板1设置有第一导电层3，设置在第一导电层3的表面上的绝缘层2和设置在绝缘层2的表面上的第二导电层4和 与第一导电层3电连接。此外，印刷布线板1设置有形成在绝缘层2和第二导电层4中并具有作为底面的第一导电层3的通孔5，以及 绝缘层2和第二导电层4作为壁表面; 以及填充在通孔5中以将第一导电层3和第二导电层4电连接的导电膏6.绝缘层2中的通路孔5的开口直径R1被设定为大于开口直径R2 通孔5在第二导电层4中。（C）2010，JPO＆INPIT

公开(公告)号：JP2013069397A

公开(公告)日：2013-04-18

申请号：JP2011279703

申请日：2011-12-21

Applicant: Sumitomo Electric Printed Circuit Inc ,  住友電工プリントサーキット株式会社

Inventor： HAMADA KENJI ,  MATSUOKA TORU

IPC: G11B21/02 ,  G11B5/60 ,  G11B25/04 ,  G11B33/12

Abstract: PROBLEM TO BE SOLVED: To provide a connection structure of a printed circuit board capable of enhancing connection reliability by preventing the inclination and movement of connection reeds by softening of an adhesive for connecting copper foil.SOLUTION: In a connection structure 32 of a printed circuit board configured by connecting a printed circuit board 15 provided with a plurality of connection reeds 211, 212, 213, 214 exposingly over a substrate 201 and a flexible printed circuit board 11 provided with flying reeds 311, 312, 313, 314 connected to the connection reeds, dummy connection reeds 215, 216 formed with a predetermined gap from the connection reeds are provided on the printed circuit board, and the connection reeds and the flying reeds are connected.

Abstract translation: 要解决的问题：提供一种能够通过软化用于连接铜箔的粘合剂来防止连接簧片的倾斜和移动来提高连接可靠性的印刷电路板的连接结构。 解决方案：在印刷电路板的连接结构32中，通过连接布置在衬底201上的多个连接簧片211,212,213和214的印刷电路板15和柔性印刷电路板11，所述连接结构32被提供 与连接簧片连接的飞盘311,312,313,314设置在印刷电路板上，与连接簧片形成有预定间隙的虚拟连接簧片215,216，连接簧片和飞盘连接。 版权所有（C）2013，JPO＆INPIT

公开(公告)号：JP2009033034A

公开(公告)日：2009-02-12

申请号：JP2007197603

申请日：2007-07-30

Applicant: Sumitomo Electric Ind Ltd ,  Sumitomo Electric Printed Circuit Inc ,  住友電工プリントサーキット株式会社 ,  住友電気工業株式会社

Inventor： OKA YOSHIO ,  YAGI SHIGETO ,  BOKU TATSUTAMA ,  SHIMOMURA TETSUYA ,  MATSUOKA TORU ,  UENISHI NAOTA ,  UEDA HIROSHI ,  OKUDA SUMUTO ,  MAKINO TAKAHIKO

IPC: H05K1/09 ,  H05K3/12 ,  H05K3/28

Abstract: PROBLEM TO BE SOLVED: To provide a printed wiring board that allows sure coating of a conductive layer by a cover coat while preventing the occurrence of oxidization or corrosion of the conductive layer, and its manufacturing method.
SOLUTION: The printed wiring board 1 is provided with a conductive layer 3 provided on the surface of a base material 2, a conductive paste 7 provided on the surface of the conductive layer 3, and a cover coat 5 provided on the surface of the conductive layer 3 and on the surface of the conductive paste 7 so as to coat the conductive layer 3 and the conductive paste 7. The conductive paste 7 includes a metal reflective member 21 for reflecting ultraviolet rays. The cover coat 5 is formed of a negative-type photosensitive resin composition that is ultraviolet curable. When ultraviolet rays are emitted to the conductive paste 7, the metal reflective member 21 reflects the ultraviolet rays. The ultraviolet rays are scattered in the conductive paste 7. Scattered light of the ultraviolet rays scattered by the conductive paste 7 is emitted to a part of the cover coat 5 located around the conductive paste 7.
COPYRIGHT: (C)2009,JPO&INPIT

Abstract translation: 要解决的问题：提供一种能够通过覆盖层确保涂覆导电层同时防止导电层氧化或腐蚀的发生的印刷线路板及其制造方法。 解决方案：印刷电路板1设置有设置在基材2的表面上的导电层3，设置在导电层3的表面上的导电膏7和设置在导电层3的表面上的覆盖层5 的导电性层3和导电性膏7的表面，以便涂覆导电层3和导电膏7.导电膏7包括用于反射紫外线的金属反射构件21。 覆盖层5由可紫外线固化的负型感光性树脂组合物形成。 当紫外线发射到导电膏7时，金属反射构件21反射紫外线。 紫外线散射在导电膏7中。由导电膏7散射的紫外线的散射光被发射到位于导电浆7周围的覆盖层5的一部分。版权所有（C）2009， JPO和INPIT