公开(公告)号：KR1020130117474A

公开(公告)日：2013-10-28

申请号：KR1020120040098

申请日：2012-04-18

申请人： 서울바이오시스 주식회사

发明人： 이정훈 ,  갈대성 ,  남기범

IPC分类号： H01L33/20 ,  H01L33/22

CPC分类号： H01L33/20 ,  H01L33/0075 ,  H01L33/0095 ,  H01L33/46 ,  H01L33/50 ,  H01L33/505 ,  H01L2933/0025 ,  H01L2933/0033 ,  H01L2933/0041

摘要： PURPOSE: A light emitting diode improving the optical extraction efficiency and a manufacturing method thereof has an uneven pattern within the backside of a substrate and has a semiconductor layer on the front side, reducing the processing steps by omitting a protection layer. CONSTITUTION: A substrate (10) having a front side (10_fs) and a backside (10 bs). An unevenness pattern (10c) is formed within the backside of the substrate. A light-emitting semiconductor layer (20) is formed by laminating a first type semiconductor layer (21), an active layer (22), and a second type semiconductor layer (23) successively on the front side of the substrate having the unevenness pattern. The light emitting semiconductor layer and the substrate are separated into multiple light emitting cells. Each light emitting cell forms a light emitting diode chip (C).

摘要翻译： 目的：提高光提取效率的发光二极管及其制造方法在基板的背面具有凹凸图案，并且在前侧具有半导体层，通过省略保护层来减少加工步骤。 构成：具有正面（10_fs）和背面（10mb）的衬底（10）。 在基板的背面形成有凹凸图案（10c）。 通过在具有不平坦图案的基板的正面上依次层叠第一类型半导体层（21），有源层（22）和第二类型半导体层（23），形成发光半导体层（20） 。 将发光半导体层和基板分离成多个发光单元。 每个发光单元形成发光二极管芯片（C）。

公开(公告)号：KR1020130105589A

公开(公告)日：2013-09-25

申请号：KR1020130108030

申请日：2013-09-09

申请人： 세종대학교산학협력단

发明人： 서영수 ,  박상율

IPC分类号： C09K11/02 ,  C09K11/06

CPC分类号： H01L33/502 ,  C09K11/02 ,  C09K11/565 ,  C09K11/883 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48237 ,  H01L2924/181 ,  H01L2933/0041 ,  Y10T428/1393 ,  Y10T428/31801 ,  H01L2924/00012 ,  H01L2924/00014

摘要： PURPOSE: A polymer microparticle is provided to have excellent moisture blocking and low moisture contents, thereby protecting quantum dots attached to it from a high temperature and high humidity environment. CONSTITUTION: A manufacturing method of a polymer microparticle comprises a step of forming a polymer solution by heating a polymer with a polar functional group in the branched chain (S3); and a step of cooling the polymer solution to make the polymer with a polar functional group in the branched chain obtain a self-assembled crystalline polymer microparticle (S9). The polymer having with a functional group in the branched chain is a crystalline polymer. The polymer microparticle comprises a crystalline polymer matrix win which the polymer with a polar functional group in the branched chain is self-assembled. [Reference numerals] (S1) Preparing a polymer with a polar functional group in a branched chain; (S3) Forming a polymer solution by heating the polymer with a polar functional group in the branched chain in a solvent; (S9) Cooling the polymer solution to form micro polymer particles

摘要翻译： 目的：提供聚合物微粒以具有优异的防潮性和低水分含量，从而保护与高温高湿环境相连的量子点。 构成：聚合物微粒的制造方法包括通过在支链中加热具有极性官能团的聚合物形成聚合物溶液的步骤（S3）; 并且在支链中冷却聚合物溶液以制备具有极性官能团的聚合物的步骤获得自组装结晶聚合物微粒（S9）。 在支链中具有官能团的聚合物是结晶聚合物。 聚合物微粒包括结晶聚合物基质，其中支链中具有极性官能团的聚合物是自组装的。 [S1]在支链中制备极性官能团的聚合物， （S3）通过在溶剂中在支链中加成具有极性官能团的聚合物形成聚合物溶液; （S9）冷却聚合物溶液以形成微聚合物颗粒

公开(公告)号：KR101296205B1

公开(公告)日：2013-08-13

申请号：KR1020120079624

申请日：2012-07-20

申请人： 주식회사 네패스엘이디

发明人： 오성호

IPC分类号： H01L33/48 ,  H01L33/50 ,  H01L33/52

CPC分类号： H01L33/502 ,  H01L33/56 ,  H01L2933/0041

摘要： PURPOSE: A method for fabricating a light emitting device package is provided to obtain good products by repairing bad products, thereby reducing production costs. CONSTITUTION: A package substrate is prepared (110). A bad light emitting device is selected among first packaged light emitting devices (120). The color index of the bad light emitting device is measured and classified (130). The color index is corrected to choose a color changing material (140). A mold structure including a transparent material is manufactured (150). [Reference numerals] (110) Package substrate with a light emitting device is prepared; (120) Bad light emitting device is selected; (130) Color index of a bad light emitting device is measured and classified; (140) Color changing material is chosen to correspond to the color index of a bad light emitting device; (150) Mold structure including a transparent mold and a transparent material filling the transparent mold is manufactured; (160) Mold structure is bonded to a package substrate

摘要翻译： 目的：提供一种制造发光器件封装的方法，通过修复不良产品来获得良好的产品，从而降低生产成本。 构成：制备封装衬底（110）。 在第一封装发光器件（120）中选择不良的发光器件。 测量和分类不良发光器件的颜色指数（130）。 校正颜色指数以选择变色材料（140）。 制造包括透明材料的模具结构（150）。 （附图标记）（110）制备具有发光装置的封装基板; （120）选择不良发光装置; （130）测量和分类不良发光器件的颜色指数; （140）选择变色材料以对应于不良发光器件的颜色指数; （150）制造包括透明模具和填充透明模具的透明材料的模具结构; （160）模具结构结合到封装衬底

公开(公告)号：KR1020130083388A

公开(公告)日：2013-07-22

申请号：KR1020127033204

申请日：2010-05-20

申请人： 다리엔 루밍라이트 컴퍼니 리미티드

发明人： 지아오,지구오 ,  리,마오롱 ,  창,잉 ,  수이,유롱 ,  다이,징지안 ,  우,유에닝 ,  장,홍웨이

IPC分类号： B32B27/06 ,  B32B27/20 ,  C09K11/00

CPC分类号： B32B27/08 ,  B32B33/00 ,  C08J7/042 ,  C08J2367/00 ,  C08J2427/12 ,  C08J2483/04 ,  C09D5/20 ,  C09D183/04 ,  H01L33/501 ,  H01L2933/0041 ,  Y10T428/264

摘要： 본 발명은 기판 및 그 위에 적용된 광변환 피복층을 포함하는 벗겨지는 광변환 발광필름을 제공하는데, 이 광변환 피복층은 형광물질, 2가지 성분의 실리콘 수지, 희석제 및 보조제로 이루어지며, 상기 기판은 불소함유 폴리에스테르 필름이고, 상기 불소함유 폴리에스테르 필름은 상기 광변환 발광필름이 사용되는 경우에 상기 광변환 피복층으로부터 쉽게 벗겨질 수 있다. 상기 불소함유 폴리에스테르 필름은 기판 및 보호필름으로서 기능할 수 있다. 상기 불소함유 폴리에스테르 필름은 상기 광변환 피복층의 변형을 회피하기 위해서 쉽게 벗겨질 수 있다. 상기 불소함유 폴리에스테르 필름이 벗겨진 후에, 빛 굴절이 감소하고 발광효율은 증가한다. 형광물질은 에탄올-알콕시 올리고머 폴리실록산 혼합물 용액으로 처리되고, 실리콘 수지와의 양립성이 향상되며, 피복된 필름의 표면조건이 개선되고, 필름의 균등도가 증가하게 된다.

公开(公告)号：KR1020130081029A

公开(公告)日：2013-07-16

申请号：KR1020120001979

申请日：2012-01-06

申请人： 삼성전자주식회사

发明人： 홍지훈 ,  오국진 ,  오정민

IPC分类号： H01L33/50 ,  H01L33/52

CPC分类号： H01L22/10 ,  B67D7/3281 ,  H01L33/0095 ,  H01L33/50 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/3025 ,  H01L2933/0041 ,  H01L2924/00014 ,  H01L2924/00

摘要： PURPOSE: A method for manufacturing a light emitting device and an apparatus for dispensing liquid resins with phosphors are provided to minimize the degradation of yield by feeding back information about a proper discharge quantity after color coordinates of an LED package are measured. CONSTITUTION: Liquid resins with phosphors are dispensed with a discharge quantity which is set in at least one LED package (S31). The color coordinates of white light emitted from the LED package are measured (S33). The discharge quantity of the liquid resins with the phosphors is controlled (S35). The liquid resins with the phosphors are dispensed to another LED package with the controlled discharge quantity (S37). The liquid resins with the phosphors dispensed to another LED package are hardened (S39). [Reference numerals] (S31) Liquid resins with phosphors are dispensed with a discharge quantity which is set in at least one LED package; (S33) Color coordinates of white light is measured by driving at least one LED package; (S35) Discharge quantity of liquid resins with phosphors is controlled based on a difference between measured color coordinates and target color coordinates; (S37) Liquid resins with phosphors are dispensed to another LED package with a controlled discharge quantity; (S39) Liquid resins with phosphors dispensed to another LED package are hardened

摘要翻译： 目的：提供一种用于制造发光器件的方法和用于用磷光体分配液体树脂的设备，以通过在测量LED封装的颜色坐标之后反馈关于适当放电量的信息来最小化产量的劣化。 构成：具有磷光体的液体树脂被放置在至少一个LED封装中的放电量（S31）。 测量从LED封装发出的白光的色坐标（S33）。 对荧光体的液体树脂的排出量进行控制（S35）。 具有荧光体的液体树脂被分配到具有受控排放量的另一个LED封装（S37）。 具有分配到另一LED封装的磷光体的液体树脂被硬化（S39）。 （附图标记）（S31）具有荧光体的液体树脂被排除在至少一个LED封装中的放电量; （S33）通过驱动至少一个LED封装来测量白光的色坐标; （S35）基于测定的色坐标与目标色坐标之间的差来控制具有荧光体的液体树脂的排出量; （S37）具有荧光体的液态树脂被分配到具有受控放电量的另一LED封装; （S39）分配到另一个LED封装的荧光粉的液态树脂被硬化

公开(公告)号：KR1020130074326A

公开(公告)日：2013-07-04

申请号：KR1020110142342

申请日：2011-12-26

申请人： 루미마이크로 주식회사

发明人： 박정환 ,  박성규 ,  김선홍 ,  김태훈

IPC分类号： H01L33/50

CPC分类号： H01L33/505 ,  H01L21/78 ,  H01L25/0753 ,  H01L33/44 ,  H01L2933/0041

摘要： PURPOSE: A method for manufacturing a light emitting device and the light emitting device manufactured by the same are provided to form wavelength conversion layer in a chip production process and to omit a separate wavelength conversion layer. CONSTITUTION: A wavelength conversion layer (20) is formed on a substrate. Grooves (21) are formed at regular interval in the wavelength conversion layer. A light emitting device (100) is inserted into the groove. The wavelength conversion layer is formed in the front and the lateral part of the light emitting device. Light emitting devices having the wavelength conversion layer are separated.

摘要翻译： 目的：提供一种制造发光器件的方法和由其制造的发光器件，以在芯片制造工艺中形成波长转换层，并省略单独的波长转换层。 构成：在基板上形成波长转换层（20）。 在波长转换层中以规则的间隔形成槽（21）。 发光器件（100）插入凹槽中。 波长转换层形成在发光器件的前部和外侧部分。 具有波长转换层的发光器件被分离。

公开(公告)号：KR101281285B1

公开(公告)日：2013-07-03

申请号：KR1020087007183

申请日：2006-07-20

申请人： 오스람 옵토 세미컨덕터스 게엠베하

发明人： 브루너,허벌트 ,  에이스러,다이터 ,  피스처,헬머트 ,  겐더,이왈드,카르마이클 ,  헤인들,알렉산더

IPC分类号： H01L33/50 ,  H01L33/48

CPC分类号： H01L33/505 ,  H01L2924/0002 ,  H01L2933/0041 ,  H01L2924/00

摘要： 본 발명에 따른 방법은, 발광 다이오드 칩을 위해, 전자기적 라디에이션을 방출하는 데 적합한 층 시퀀스를 포함하는 기본 몸체를 구비한다.
상기 기본몸체의 하나 이상의 주요면에 커버층이 적층된다. 하나 이상의 캐비티가 커버층에 도입되고, 상기 캐비티는 부분적으로 또는 완전히 발광 변환 물질로 충전된다. 발광 변환 물질은 하나 이상의 형광체를 포함한다.
또한, 커버층이 광 구조화가 가능한 물질 및 하나 이상의 형광체를 포함함으로써, 커버층은 발광 변환 물질로 기능하고, 직접적으로 광 구조화가 될 수 있는 방법에 관한 것이다.
또한, 본 방법으로 제조될 수 있는 발광 다이오드 칩이 기재된다.
발광 다이오드 칩, 발광 변환 물질, 광 구조화, 형광체, 커버층

公开(公告)号：KR1020130071077A

公开(公告)日：2013-06-28

申请号：KR1020110138393

申请日：2011-12-20

申请人： 엘지이노텍 주식회사

发明人： 최광규 ,  송윤수 ,  도형석 ,  문연태

IPC分类号： H01L33/50 ,  H01L33/36

CPC分类号： H01L33/508 ,  H01L33/502 ,  H01L2933/0041

摘要： PURPOSE: Light emitting device and manufacturing method thereof are provided to improve wavelength conversion efficiency by locating a wavelength conversion layer. CONSTITUTION: An electrode(110) is contacted with a light emitting structure(120). The light emitting structure includes a first conductive semiconductor layer, an active layer and a second conductive semiconductor layer. A wavelength conversion layer(130) surrounds the electrode. The wavelength conversion layer is located on the surface of the light emitting structure. At least a part of the electrode is exposed to the outside of the wavelength conversion layer.

摘要翻译： 目的：提供发光器件及其制造方法，以通过定位波长转换层来提高波长转换效率。 构成：电极（110）与发光结构（120）接触。 发光结构包括第一导电半导体层，有源层和第二导电半导体层。 波长转换层（130）围绕电极。 波长转换层位于发光结构的表面上。 电极的至少一部分暴露于波长转换层的外部。

公开(公告)号：KR1020130056685A

公开(公告)日：2013-05-30

申请号：KR1020110122411

申请日：2011-11-22

申请人： 하나 마이크론(주)

发明人： 이경우 ,  장미

IPC分类号： H01L33/50 ,  H01L33/48

CPC分类号： H01L33/501 ,  H01L25/0753 ,  H01L33/44 ,  H01L2933/0041

摘要： PURPOSE: A method for manufacturing a light emitting diode is provided to form a silicon layer and a phosphor layer with uniform thicknesses on the surface of an LED chip by coating a phosphor after the silicon layer is formed on the LED chip. CONSTITUTION: An LED chip is prepared(S100). A silicon layer is formed on the LED chip(S200). A phosphor layer is formed by coating a phosphor on the LED chip with the silicon layer(S300). Phosphor powder is uniformly diffused on the silicon layer by an ultrasonic process(S400). [Reference numerals] (AA) Start; (BB) End; (S100) Step of preparing a plurality of LED chips; (S200) Step of forming a silicon layer on the LED chips; (S300) Step of forming a phosphor layer by coating a phosphor in powder form on the LED chip with the silicon layer; (S400) Step of uniformly diffusing the phosphor powder on the silicon layer by an ultrasonic process

摘要翻译： 目的：提供一种制造发光二极管的方法，在LED芯片上形成硅层之后，通过涂覆荧光体，在LED芯片的表面上形成均匀厚度的硅层和荧光体层。 构成：准备了LED芯片（S100）。 在LED芯片上形成硅层（S200）。 通过用硅层在LED芯片上涂覆磷光体形成磷光体层（S300）。 荧光粉通过超声波处理在硅层上均匀扩散（S400）。 （附图标记）（AA）开始; （BB）结束; （S100）准备多个LED芯片的步骤; （S200）在LED芯片上形成硅层的工序; （S300）通过将具有硅层的LED芯片上的粉末形式的荧光粉涂覆而形成荧光体层的工序; （S400）通过超声波处理将荧光体粉末均匀地扩散到硅层上的工序

公开(公告)号：KR1020130049762A

公开(公告)日：2013-05-14

申请号：KR1020120124390

申请日：2012-11-05

申请人： 주식회사 아모센스

发明人： 방연호 ,  최상석 ,  오대성 ,  노승윤

IPC分类号： H01L33/48 ,  H01L33/58 ,  H01L33/50

CPC分类号： H01L33/58 ,  H01L25/0753 ,  H01L33/502 ,  H01L33/505 ,  H01L33/507 ,  H01L2933/0041

摘要： PURPOSE: A lens for an LED package and the LED package including the same are provided to improve yield by installing the lens in an LED device. CONSTITUTION: A substrate includes a light emitting device mounting region. A light emitting device(30) is formed in the light emitting device mounting region. The light emitting device includes a light emitting unit. A lens unit(50) separately surrounds the light emitting device. A fluorescent layer(60) is formed on the inner side of the lens unit.

摘要翻译： 目的：提供一种用于LED封装的透镜和包括其的LED封装，以通过将透镜安装在LED器件中来提高产量。 构成：衬底包括发光器件安装区域。 在发光器件安装区域中形成发光器件（30）。 发光装置包括发光单元。 透镜单元（50）分别围绕发光器件。 荧光层（60）形成在透镜单元的内侧。