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    가공 기판 및 그 제조 방법
    1.
    发明公开
    가공 기판 및 그 제조 방법 有权
    基板和其制造方法

    公开(公告)号：KR1020100071909A

    公开(公告)日：2010-06-29

    申请号：KR1020090123038

    申请日：2009-12-11

    申请人： 도쿄 오카 고교 가부시키가이샤

    发明人： 이마이히로후미 ,  다무라고키 ,  미스미고이치 ,  아사이다카히로

    IPC分类号： H01L21/302

    CPC分类号： G03F7/20 ,  H01L21/6836 ,  H01L2221/6834 ,  Y10T428/24273

    摘要： PURPOSE: A processing substrate and a manufacturing method thereof are provided to equally form the size of patterns on both surfaces by exposing a photosensitive resin layer with the same sensitivity. CONSTITUTION: A photosensitive resin layer(2) is formed on the surface of a substrate(1) by using a photosensitive resin compound. A plurality of penetration holes(6) is formed on the substrate. A pattern layer corresponding to the plurality of penetration holes is formed on the photosensitive resin layer formed on both sides of the substrate. The photosensitive resin layer formed on both sides of the substrate is exposed. The substrate is a support plate to support the wafer.

    摘要翻译： 目的：通过以相同的灵敏度曝光感光性树脂层，提供了处理基板及其制造方法，以均匀地形成两面上的图案的尺寸。 构成：通过使用感光性树脂化合物，在基板（1）的表面上形成感光性树脂层（2）。 在基板上形成有多个贯通孔（6）。 在形成在基板的两侧的感光性树脂层上形成与多个贯通孔对应的图案层。 形成在基板两侧的感光性树脂层露出。 基板是支撑晶片的支撑板。

    기판의 박판화 방법, 첩합 시스템 및 박판화 시스템
    2.
    发明公开
    기판의 박판화 방법, 첩합 시스템 및 박판화 시스템 无效
    降低衬底厚度，层压体系和衬底厚度减少系统的方法

    公开(公告)号：KR1020090018139A

    公开(公告)日：2009-02-19

    申请号：KR1020087030791

    申请日：2007-04-04

    申请人： 도쿄 오카 고교 가부시키가이샤

    发明人： 이나오요시히로 ,  이와타야스마사 ,  미스미고이치 ,  아사이다카히로

    IPC分类号： H01L21/50 ,  H01L21/304

    CPC分类号： H01L23/49822 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/67011 ,  H01L21/67092 ,  H01L21/6835 ,  H01L21/6836 ,  H01L23/49816 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2224/13

    摘要： [PROBLEMS] To provide a method for reducing the thickness of a substrate, which can reduce the thickness of a wafer (a substrate) with a bump provided on a circuit forming face without the separation of the bump. [MEANS FOR SOLVING PROBLEMS] A liquid resin (4) is coated to a larger thickness than the height of a bump (2) by a squeegee (3) onto a wafer (substrate) (W) in its surface (W1), and the coating is baked to form a protective film (5) having an even thickness. Thereafter, a support plate (6) is superimposed on the protective film (5), and the support plate (6) is pressed by a head (7) to conduct adhesion of the support plate (6) to the protective film (5). Next, the assembly is turned upside-down, and the backside (W2) of the wafer (W) is ground by a grinder (13) to reduce the thickness. Thereafter, a solvent is supplied through a solvent supply pipe (9) in the head (7), and the solvent is spread to the bonding interface of the protective film (5) and the support plate (6) through a number of solvent supply holes (8) in the support plate (6) to dissolve the protective film (5). Further, the solvent containing the protective film (5) dissolved therein is recovered from a solvent recovery pipe (10) in the head (7).

    摘要翻译： 本发明提供一种降低衬底厚度的方法，该方法可以减小设置在电路形成面上的凸起而不会使凸块分离的晶片（衬底）的厚度。 解决问题的手段将液体树脂（4）通过刮板（3）涂覆到其表面（W1）上的晶片（基板）（W）上的比凸块（2）的高度大的厚度，以及 烘烤该涂层以形成具有均匀厚度的保护膜（5）。 此后，将支撑板（6）重叠在保护膜（5）上，并且支撑板（6）被头部（7）按压以将支撑板（6）粘附到保护膜（5）上， 。 接下来，将组件倒置，并且通过研磨机（13）研磨晶片（W）的背面（W2）以减小厚度。 此后，通过头部（7）中的溶剂供给管（9）供给溶剂，通过多种溶剂供给将溶剂扩散到保护膜（5）和支撑板（6）的接合界面 在支撑板（6）中的孔（8）以溶解保护膜（5）。 此外，从头部（7）中的溶剂回收管（10）回收含有溶解于其中的保护膜（5）的溶剂。