公开(公告)号：KR1020070118065A

公开(公告)日：2007-12-13

申请号：KR1020077010834

申请日：2006-09-15

Applicant: 미쓰비시 마테리알 가부시키가이샤

Inventor： 구로미츠요시로우 ,  도리우미마코토 ,  나가토모요시유키 ,  이시즈카히로야 ,  바바요우이치로 ,  와타나베도모유키 ,  야스이다쿠야

IPC: H01L23/40

CPC classification number: H01L23/3735 ,  H01L23/473 ,  H01L2224/29111 ,  H01L2224/32225 ,  H05K1/0271 ,  H05K1/0306 ,  H05K1/09 ,  H05K3/0061 ,  H05K3/341 ,  H05K3/3463 ,  H05K2201/0352 ,  H05K2201/09736

Abstract: An insulating circuit board is provided with an insulating board, a circuit board bonded to a first plane of the insulating board, and a metal plate bonded to a second plane of the insulating board. The circuit board is formed of an Al alloy having a purity of 99.98% or pure Al, and the metal plate is formed of an Al alloy having a purity of 98.00% but not more than 99.90%. A thickness (a) of the circuit board is, for instance, 0.2mm or more but not more than 0.8mm, and a thickness (b) of the metal plate is, for instance, 0.6mm or more but not more than 1.5mm, and an inequality of a/b

Abstract translation: 绝缘电路板设置有绝缘板，接合到绝缘板的第一平面的电路板和接合到绝缘板的第二平面的金属板。 电路板由纯度为99.98％的Al合金或纯Al形成，金属板由纯度为98.00％但不高于99.90％的Al合金形成。 电路板的厚度（a）例如为0.2mm以上且0.8mm以下，金属板的厚度（b）例如为0.6mm以上且1.5mm以下 ，并且满足a / b <= 1的不等式。 设置有冷却槽部的绝缘电路基板具有绝缘电路基板，以及通过第二焊料层与金属板接合的冷却槽部。 第二焊料层由以Sn为主要成分的焊料形成，杨氏模量例如为35GPa以上，0.2％抗强度例如为30MPa以上，拉伸强度为 例如40MPa以上。 冷却槽部由例如纯Al或Al合金形成。