摘要:
A lift pin assembly, an ashing apparatus and an ashing method are provided to prevent the pop-up and warpage of a wafer due to an abrupt variation of temperature by making a lift pin fall gradually using an improved driving unit with a step motor and a screw. A lift pin assembly includes a plurality of lift pins and a driving unit. The plurality of lift pins(110) movie up and down along a plurality of through holes of a support member. The lift pins are used for loading stably a wafer on the support member. The driving unit(130) is used for moving the lift pins step by step. The driving unit is composed of a step motor(132) capable of rotating by a predetermined angle and a screw. The screw(134) is connected to the step motor in order to change the rotation of the step motor into the up/down motion of the lift pins.
摘要:
리모트 방식의 플라즈마를 생성하는 방법 및 장치 그리고, 상기 플라즈마를 사용하는 반도체 제조 공정의 수행 방법 및 장치가 개시되어 있다. 축 방향을 갖는 주-자기장과, 상기 축 방향과 평행한 방향을 갖는 보조-자기장을 형성하다. 상기 주-자기장의 자기력선과 동일한 변위를 갖는 경로로 가스를 플로우시키고, 고주파 교류 전류를 인가하여, 가스 플라즈마를 생성한다. 상기 가스 플라즈마를 공정 챔버로 공급하여 상기 가스 플라즈마를 사용하는 반도체 제조 공정을 수행한다. 높은 효율로 플라즈마 가스를 생성할 수 있고, 저렴한 플라즈마 생성용 가스를 사용할 수 있다.
摘要:
PURPOSE: A method and an apparatus of generating gas plasma, a gas composition of generating plasma, and a method of fabricating a semiconductor device using the same are provided to reduce the manufacturing cost by using an inexpensive gas such as C3F8. CONSTITUTION: A first electric field is formed in a first direction perpendicular to a flowing direction of floating gas by applying a current in the same direction as the flowing direction of the floating gas. A second electric field is formed in parallel to the flowing direction of the floating gas. Plasma is generated by applying the first electric field and the second electric field to the floating gas. The floating gas includes gas containing fluoric atoms, oxygen gas, and argon gas.
摘要:
PURPOSE: A method and an apparatus for generating gas plasma, a gas composition for generating plasma, and a method for fabricating a semiconductor device using the same are provided to increase the productivity of the plasma in a plasma generation process using a remote method by shortening a period of time for generating the plasma. CONSTITUTION: A method for generating gas plasma includes a process for forming magnetic field, a process for providing electric power, and a process for forming gas plasma. The process for forming magnetic field is to form the main magnetic field having the axial direction and the auxiliary magnetic field having the direction parallel to the axial direction. The process for providing electric power is to apply the RF AC current to a path within a region between the main magnetic field and the auxiliary magnetic field. The process for forming gas plasma is to generate the gas plasma by flowing the gas to the same path as the path for applying the electric power. The path for applying the electric power is formed with a spiral path.
摘要:
A refrigeration system regulates the temperature of an electrostatic wafer chuck disposed in a process chamber. The refrigeration system includes a heat exchanger disposed in a heat exchange relationship with the electrostatic chuck, a refrigerator, a temperature sensor, and a temperature controller for controlling the refrigerator to cool the coolant withdrawn from the heat exchanger to a desired temperature in response to the temperature detected by the temperature sensor. The heat exchanger forms a coolant passageway inside the electrostatic chuck, and the refrigerator is disposed outside the process chamber The temperature sensor is disposed within the body of the electrostatic chuck. The temperature of the electrostatic chuck can be regulated so as to be maintained nearly constant because the temperature used to control the cooling of the coolant is measured directly from the body of the electrostatic chuck.
摘要:
PURPOSE: An impedance matching device of a high frequency oscillator is described, which can enhance efficiency of high frequency power supplied to a load and improve the function of a matching device. CONSTITUTION: The impedance matching device comprises a teflon-made insulator, connected with an oscillator in which high frequency power is applied, insulating a induction coil to have a transformer transforming the high frequency power into a predetermined size, and a condenser, connected with the transformer, condensing high frequency power of the transformed size. Consequentially, an impedance is matched between the oscillator and the predetermined load. Thereby, material of the insulator applied to the transformer is altered and characteristics of the condenser is improved, allowing the impedance matching therebetween to be stable.
摘要:
본 발명은 타이틀러를 이용한 웨이퍼의 코드마킹방법에 관한 것이다. 본 발명은, 셔터의 개폐작동으로 웨이퍼 상에 상기 웨이퍼를 식별하는 코드를 마킹하는 타이틀러를 이용하여 상기 웨이퍼 상에 식별코드 및 선택코드를 순차적으로 마킹하는 타이틀러를 이용한 웨이퍼의 코드마킹방법에 있어서, 상기 선택코드의 마킹은 상기 식별코드가 마킹된 자리수만큼 상기 타이틀러를 셔터의 개폐작동없이 이동시킨 후, 상기 선택코드의 마킹을 수행함을 특징으로 한다. 따라서, 공정수행의 소요시간을 단축시킬 수 있어 생산성이 향상되고, 타이틀러의 셔터의 수명을 연장시킬 수 있어 제조설비의 유지보수가 향상되는 효과가 있다.
摘要:
PURPOSE: A method and an apparatus of generating gas plasma, a gas composition of generating plasma, and a method of fabricating a semiconductor device using the same are provided to enhance productivity by improving efficiency of generation and reducing a generating period in a plasma generating process using a remote method. CONSTITUTION: A first electric field(48a) is generated at a plasma generating member or a gas floating member(43) by an RF current supplied from a power supply unit(45). A second electric field(48b) is generated at the plasma generating member or the gas floating member by a main magnetic field forming part and an auxiliary magnetic field forming part. The first electric field and the second electric field cross at right angles within the plasma generating member or the gas floating member. The radical atmosphere is formed within the plasma generating member or the gas floating member by the first electric field and the second electric field.
摘要:
An input/output valve switching apparatus of a semiconductor manufacturing system minimizes a vibration set up while operating an input/output valve for opening and closing a wafer-transfer passage that connects chambers of the system. The switching apparatus includes a valve actuator having a close port and an open port, a first fluid line connected to the close port, a second fluid line connected to the open port, first flow regulators installed in the first and second fluid lines, respectively, to regulate the flow rate of fluid, and second fluid flow regulators installed in the first and second fluid lines to regulate the flow rate of the fluid that has passed. The second fluid flow regulators can prevent a rapid introduction of the fluid into the actuator.
摘要:
PURPOSE: An etching apparatus is provided to minimize the generation of particles by preventing the damage of a through-hole for reaction gas. CONSTITUTION: An etching apparatus includes a chamber, a gas supply portion(22), and a base material(26). The chamber is used for etching a processing target by using plasma. The gas supply portion is formed with a metallic material. The gas supply portion has a through-hole(24) to supply a reaction gas to the chamber. The base material is formed with a plastic material and arranged on a wall of the through-hole. The base material is used for preventing the damage of the wall of the through-hole. The metal material includes aluminum. The plastic material includes an engineering plastic material. The processing target is formed with a photoresist layer.