접합 방법 및 접합 장치
    4.
    发明公开
    접합 방법 및 접합 장치 失效
    接合方法和接合装置

    公开(公告)号:KR1020090042335A

    公开(公告)日:2009-04-29

    申请号:KR1020097006280

    申请日:2007-09-20

    Abstract: Provided are a bonding method and a bonding apparatus, by which bubbles in an adhesive layer can be reduced while ensuring uniformity of the adhesive layer at the time of application and suppressing fluctuation of the adhesive layer during manufacture. The bonding apparatus is provided with a first spin-coating apparatus (1) for coating one surface of a first substrate (P1) with an adhesive (B1); a second spin-coating apparatus for coating one surface of a second substrate (P2) with an adhesive (B2) thinner than the adhesive (B1) on the first substrate; a pre-irradiation section (4) for temporarily hardening the adhesive (B1) on the first substrate (P1); a bonding section (5) for bonding the surface of the first substrate (P1) whereupon the adhesive (B1) is applied, with the surface of the second substrate (P2) whereupon the adhesive (B2) is applied; and a post-irradiation section (6) for hardening the adhesives (B1, B2) between the first substrate (P1) and the second substrate (P2).

    Abstract translation: 提供了一种粘合方法和粘合装置,通过该粘合方法和粘合装置,可以在施加时确保粘合剂层的均匀性并且抑制制造期间的粘合剂层的波动,从而可以降低粘合剂层中的气泡。 接合装置设置有用粘合剂(B1)涂覆第一基板(P1)的一个表面的第一旋涂装置(1)。 第二旋涂装置,用于在第一基板上用比粘合剂(B1)薄的粘合剂(B2)涂覆第二基板(P2)的一个表面; 用于使第一基板(P1)上的粘合剂(B1)暂时硬化的预照射部分(4); 用于将施加粘合剂(B1)的第一基板(P1)的表面与施加了粘合剂(B2)的第二基板(P2)的表面接合的接合部(5) 和用于硬化第一基板(P1)和第二基板(P2)之间的粘合剂(B1,B2)的后照射部分(6)。

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