摘要:
본발명은, 락톤을밀착성기로서갖는반복단위와산불안정기함유반복단위를공중합한고분자화합물을포함하는제1 포지티브형레지스트재료로기판상에제1 레지스트막을형성하는공정, 제1 레지스트막을노광후에가열처리하고, 현상하여제1 레지스트패턴을형성하는공정, 제1 레지스트패턴에아민화합물또는옥사졸린화합물을적용하고, C3 내지 8의알코올, 또는 C3 내지 8의알코올및 C6 내지 12의에테르를포함하고상기제1 레지스트패턴을용해시키지않는용제를용매로하는제2 포지티브형레지스트재료를도포하여제2 레지스트막을형성하는공정, 제2 레지스트막을노광, PEB 후에현상하여제2 레지스트패턴을형성하는공정을포함하는패턴형성방법을제공한다. 본발명에따르면, 제1 레지스트패턴의패턴이미형성된부분에제2 패턴을형성하여, 패턴사이의피치를반으로하는더블패터닝을행하고, 1회의건식에칭으로기판을가공할수 있다.
摘要:
PURPOSE: A pattern formation method for processing a substrate by one step of dry etching, and a resist composition are provided to process the substrate by forming a second pattern on a place without a first resist pattern, and by performing a double patterning. CONSTITUTION: A pattern formation method comprises the following steps: forming a first resist film by spreading a first positive resist material containing a polymer compound produced by copolymerizing a recurring unit with an acid-labile group, on a substrate(10); forming a frits resist pattern by exposing the first resist film with a high energy beam, post-exposure baking the resist film, and developing the first resist film; inactivating the first resist pattern by applying an oxazoline compound or an amine compound; forming a second resist film by spreading a second positive resist material on the first resist pattern; and forming a second resist pattern(50) by exposing and developing the second resist film.
摘要:
PURPOSE: A composition for modifying a resist, and a patterning method using thereof are provided to perform a double patterning process for processing a substrate using two exposure processes and one dry etching process. CONSTITUTION: A composition for modifying a resist for producing a pattern contains a base resin with a recurring unit and an alcohol based solvent. A patterning method using the composition comprises the following steps: forming a first resist layer by spreading a positive resist material on a substrate(10); exposing the first resist layer with a high energy beam and alkali to develop a first resist pattern; spreading the composition for modifying the resist on the first resist pattern and heating to modify the resist; and forming a second resist pattern(50) on the first resist pattern.
摘要:
PURPOSE: A positive resist material, a patterning process using the same, and a polymerizable compound used in the method are provided to be useful in minute processing, and to ensure high resolution in a lithography technique, especially, an ArF lithography technique. CONSTITUTION: A positive resist composition comprising (A) a resin component which becomes soluble in an alkaline developer under the action of an acid and (B) a compound capable of generating an acid in response to actinic light or radiation, wherein the resin component (A) is a polymer comprising non-leaving hydroxyl group-containing recurring units of at least one type selected from the general formulae (1-1) to (1-3), wherein R1 is hydrogen, methyl or trifluoromethyl, X is a single bond or methylene, Y is hydroxyl or hydroxymethyl, and m is 0, 1 or 2.