摘要:
(A) 알칼리 가용성 수지, 가교제, 광산 발생제, 및 용매를 포함하는 포지티브형 감광성 수지 조성물을 기판 상에 도포하는 단계; (B) 상기 도포된 포지티브형 감광성 수지 조성물을 건조한 후, 150℃ 내지 200℃에서 사전 가열하는 단계(Pre baking); (C) 상기 사전 가열 후 노광하는 단계; (D) 상기 노광 후 현상하는 단계; 및 (E) 상기 현상 후 경화하는 단계를 포함하는 감광성 수지막의 제조 방법, 및 상기 방법에 따라 제조된 감광성 수지막을 제공한다.
摘要:
The present invention relates to a rinse liquid for an insulating film and a method for rinsing an insulating film, wherein the rinse liquid includes a solvent represented by chemical formula 1. In chemical formula 1, R^1 and R^a to R^e are defined as in the specification.
摘要翻译:本发明涉及一种用于绝缘膜的冲洗液和一种用于漂洗绝缘膜的方法,其中冲洗液包括由化学式1表示的溶剂。在化学式1中,R 1和R 2 a至R e 被定义为在说明书中。
摘要:
Provided are a manufacturing method of a filler for filling a gap, comprising manufacturing hydrogenation polysilazane by putting 50-70 parts by weight of ammonia based on 100 parts by weight of halo-silane at a rate of 1 to 15 g/hr after injecting the halo-silane into an alkaline solvent, a filler for filling a gap manufactured by the manufacturing method, and a manufacturing method of a semiconductor capacitor using the same.
摘要:
본 발명에서는 하기 화학식 1로 표시되는 구조단위 10 내지 40 몰%를 포함하는 유기실란계 축중합물 및 용매를 포함하는 레지스트 하층막용 조성물이 제공된다. [화학식 1]
상기 화학식 1에서 ORG의 정의는 명세서에 기재한 바와 같다. 이로써, 본 발명은 저장안정성 및 내에칭성이 우수한 레지스트 하층막을 제공하여 우수한 패턴을 전사할 수 있는 레지스트 하층막용 조성물 및 이를 이용한 반도체 집적회로 디바이스의 제조방법을 제공할 수 있다. 레지스트 하층막, 유기실란계 축중합물, 저장안정성, 내에칭성
摘要:
PURPOSE: A composition for forming a silica-based insulation layer is provided to remarkably reduce defects in the silica based insulation layer, thereby capable of improving gap-fill performance, insulative performance required for the silica-based insulation layer. CONSTITUTION: A composition for forming a silica-based insulation layer comprises hydrogenated polysiloxazane comprising a moiety in chemical formula 1, and a moiety in chemical formula 2, and has chlorine content of 1 ppm or less. In chemical formulas R1-R7 is respectively hydrogen, a substituted or unsubstituted C1-30 alkyl group, a substituted or unsubstituted C3-30 cycloalkyl group, a substituted or unsubstituted C6-30 aryl group, a substituted or unsubstituted C7-30 arylalkyl group, a substituted or unsubstituted C1-30 heteroalkyl group, a substituted or unsubstituted C2-30 heterocycloalkyl group, a substituted or unsubstituted C2-30 alkenyl group, a substituted or unsubstituted alkoxy group, a substituted or unsubstituted carbonyl group, hydroxy group, or combinations thereof, and at least one of R1-R7 is hydrogen.
摘要:
PURPOSE: A resist sublayer composition and a method for manufacturing a semiconductor integrated circuit using the same are provided to easily control the surface of a hydrophilic characteristic or the hydrophobic characteristic by increasing the content of silicon without a silane compound. CONSTITUTION: A resist sublayer composition includes a solvent and an organic silane-based polycondensate containing a structural unit represented by chemical formula 1. In the chemical formula 1, the ORG is selected from a group including C6 to C30 functional group containing substituted or non-substituted aromatic ring, C1 to C12 alkyl group, and Y-(Si(OR)_3)_a. The R is C1 to C6 alkyl group. The Y is linear or branched substituted or non-substituted C1 to C20 alkylene group, or substituted alkylene group. The a is 1 or 2. The Z is selected from a group including hydrogen and C1 to C6 alkyl group.
摘要:
PURPOSE: A photo-resist sublayer composition and a method for manufacturing a semiconductor device using the same are provide to stably form a photo-resist pattern and easily control the surface material characteristic. CONSTITUTION: A photo-resist sublayer composition includes a solvent and a polysiloxane resin represented by chemical formula 1. In the chemical formula 1, the x, the y, and the z represents the relative ratio of the (SiO_1.5Y-SiO_1.5)_x repeating unit, the (SiO_2)_y repeating unit, the (XSiO_1.5)_z repeating unit. The e and the f represents the ratio of the number of OH groups and OR groups, which is bonded with the silicon atom in the polysiloxane resin, with respect to the 2x+Y+z of silicon atoms. The R1 is C1 to C6 alkyl group. The X is substituted or non-substituted C6 to C30 aryl group or C3 to C30 hetero aryl group. The Y is substituted or non-substituted C6 to C30 aryl group, C3 to C30 hetero aryl group, C1 to C20 linear or branched substituted or non-substituted akylene group, C1 to C20 alkylene group, C2 to C20 hydrocarbon group with a double bond or a triple bond, and the combination of the same.