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    자기 조립 폴리머 나노마스크를 이용한 표면 나노제조 방법
    5.
    发明公开
    자기 조립 폴리머 나노마스크를 이용한 표면 나노제조 방법 审中-实审
    使用自组装聚合物纳米颗粒的表面纳米化方法

    公开(公告)号：KR1020150111967A

    公开(公告)日：2015-10-06

    申请号：KR1020157022761

    申请日：2014-01-21

    申请人： 코닝 인코포레이티드

    发明人： 퀘사다,마크알레잔드로 ,  왕,지앙구오 ,  장,잉

    IPC分类号： G03F7/00 ,  B05D5/00 ,  H01L21/033 ,  H01L21/314

    CPC分类号： B05D5/00 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0002 ,  Y10S977/888

    摘要： 나노필러화기판표면의제조방법은기판표면에양친매성블록코폴리머와친수성호모폴리머를함유하는폴리머용액을적용하는단계를포함한다. 상기폴리머용액내의상기양친매성블록코폴리머와상기친수성호모폴리머가상기기판표면상에서자기조립하여상기기판표면에인접한소수성도메인및 상기기판표면의반대편에상기자기-조립폴리머층의노출된표면으로부터상기자기-조립폴리머층으로확장된친수성도메인을갖는자기조립폴리머층을형성한다. 상기친수성도메인의적어도일부는제거되어상기자기-조립폴리머층의노출된표면에서복수의기공을형성할수 있다. 보호층이복수의기공을통해서에칭하여관통홀을형성하기위한마스크로서상기노출된표면상에증착될수 있다. 나노필러-형성물질이상기관통홀을통해서상기기판표면상에증착될수 있다. 다음, 상기자기-조립폴리머층의잔여부분이제거되어나노필러화된기판표면을노출시킬수 있다.

    낮은 소결 온도를 갖는 주석 함유 무기물을 이용한 기밀밀봉
    9.
    发明公开
    낮은 소결 온도를 갖는 주석 함유 무기물을 이용한 기밀밀봉 无效
    具有低烧结温度的含TIN的无机材料的封装密封

    公开(公告)号：KR1020080080019A

    公开(公告)日：2008-09-02

    申请号：KR1020080017432

    申请日：2008-02-26

    申请人： 코닝 인코포레이티드

    发明人： 아이트켄,부르스가디너 ,  퀘사다,마크알레잔드로

    IPC分类号： C23C14/00 ,  C23C4/00

    CPC分类号： H01L51/5253 ,  Y10T428/1266

    摘要： A method for inhibiting oxygen and moisture decomposition of the device and a device manufactured by results of the method are described, wherein a Sn^2+ containing inorganic material is used to form a barrier layer on the device in order to prevent the oxygen and moisture decomposition of the device, and the Sn^2+ containing inorganic material may be, for example, SnO, mixed SnO and P2O5 powders, and mixed SnO and BPO4 powders. A device(200) has at least a portion thereof sealed with a Sn^2+ containing inorganic material. The Sn^2+ containing inorganic material comprises tin oxide. The Sn^2+ containing inorganic material is one of the following: SnO; SnO+P2O5; and SnO+BPO4. The Sn^2+ containing inorganic material is heat-treated at a temperature of less than 100 deg.C, preferably less than 40 deg.C. The device is an organic electronic device comprising: a substrate plate(206); at least one organic electronic or optoelectronic layer(204); and a Sn^2+ containing inorganic material(202), wherein the at least one organic electronic or optoelectronic layer is hermetically sealed between the Sn^2+ containing inorganic material and the substrate plate. The device comprises: a substrate plate; at least one organic light emitting diode; and a sputtered and non-heat treated SnO film, wherein the at least one organic light emitting diode is hermetically sealed between the sputtered and non-heat treated SnO film and the substrate plate.

    摘要翻译： 描述了用于抑制装置的氧气和水分分解的方法以及通过该方法的结果制造的装置，其中使用含Sn 2+的无机材料在装置上形成阻挡层，以防止氧气和水分 该装置和含Sn 2+的无机材料的分解可以是例如SnO，混合SnO和P2O5粉末，以及混合的SnO和BPO4粉末。 装置（200）的至少一部分用含有Sn 2+的无机材料密封。 含Sn 2+的无机材料包含氧化锡。 含Sn 2+的无机材料是以下之一：SnO; 的SnO + P2O5; 和SnO + BPO4。 含Sn 2+的无机材料在小于100℃，优选小于40℃的温度下进行热处理。 该器件是有机电子器件，包括：衬底板（206）; 至少一个有机电子或光电子层（204）; 和含Sn 2+的无机材料（202），其中所述至少一个有机电子或光电子层气密地密封在含有Sn 2+的无机材料和基板之间。 该装置包括：基板; 至少一个有机发光二极管; 以及溅射和未热处理的SnO膜，其中所述至少一个有机发光二极管密封在所述溅射和未热处理的SnO膜与所述基板之间。