公开(公告)号：US5850171A

公开(公告)日：1998-12-15

申请号：US692449

申请日：1996-08-05

Applicant: Barry Lin ,  Shih Chang Liao ,  Duen Jen Cheng

Inventor： Barry Lin ,  Shih Chang Liao ,  Duen Jen Cheng

IPC: H01C1/16 ,  H01C13/02 ,  H01L27/08 ,  H05K1/03 ,  H05K3/00 ,  H05K3/34 ,  H05K3/40 ,  H01C1/01 ,  H01C1/14

CPC classification number: H01C13/02 ,  H01C1/16 ,  H01L27/0802 ,  H05K1/0306 ,  H05K3/0052 ,  H05K3/3442 ,  H05K3/403

Abstract: The present invention discloses a resistive circuit. The resistive circuit includes a plurality of resistor networks disposed on a substrate. The resistor networks also includes a plurality of resistive circuit elements. The resistor networks further includes a plurality of termination contacts each connected to one of the resistive circuit elements. Each of the termination contacts is disposed on an edge of the substrate and each of the termination contacts is separated from a next termination contact by an edge trench disposed on the edge of the substrate whereby a distance across the edge trench defining a pitch between the termination contacts.

Abstract translation: 本发明公开了一种电阻电路。 电阻电路包括设置在基板上的多个电阻网络。 电阻网络还包括多个电阻电路元件。 电阻网络还包括多个终端触点，每个终端触点都连接到电阻电路元件之一。 每个终端触点设置在衬底的边缘上，并且每个终端触点通过设置在衬底的边缘上的边缘沟槽与下一终端触点分开，从而跨越边缘沟槽的距离限定了终端之间的间距 联系人

公开(公告)号：US08648458B2

公开(公告)日：2014-02-11

申请号：US12837740

申请日：2010-07-16

Applicant: Barry Lin

Inventor： Barry Lin

IPC: H01L23/492

CPC classification number: H01L23/4951 ,  H01L23/49575 ,  H01L24/48 ,  H01L2224/48247 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An integrated circuit leadframe device supports various chip arrangements. As consistent with various embodiments, a leadframe includes a plurality of banks of conductive integrated circuit chip connectors. Each bank has a plurality of conductive strips respectively having an end portion, the end portions of each of the strips in the bank being substantially parallel to one another and arranged at an oblique angle to end portions of strips in at least one of the other banks. Each of the end portions has a tip extending to an interior portion of the leadframe device and separated from the other tips by a gap. A fastening material is arranged on at least some of the conductive strips and configured to fasten an integrated circuit chip to the conductive strips

Abstract translation: 集成电路引线框架装置支持各种芯片布置。 与各种实施例一致，引线框架包括多组导电集成电路芯片连接器。 每个组具有分别具有端部的多个导电条，该组中的每个条的端部彼此基本平行并且以与倾斜角度布置在至少一个其它条中的条的端部 。 每个端部具有延伸到引线框架装置的内部的尖端，并且与另一个尖端分开间隙。 紧固材料布置在至少一些导电条上并且被配置成将集成电路芯片紧固到导电条上

公开(公告)号：US20110147903A1

公开(公告)日：2011-06-23

申请号：US12837740

申请日：2010-07-16

Applicant: Barry Lin

Inventor： Barry Lin

IPC: H01L23/52 ,  H01L23/495

CPC classification number: H01L23/4951 ,  H01L23/49575 ,  H01L24/48 ,  H01L2224/48247 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An integrated circuit leadframe device supports various chip arrangements. As consistent with various embodiments, a leadframe includes a plurality of banks of conductive integrated circuit chip connectors. Each bank has a plurality of conductive strips respectively having an end portion, the end portions of each of the strips in the bank being substantially parallel to one another and arranged at an oblique angle to end portions of strips in at least one of the other banks. Each of the end portions has a tip extending to an interior portion of the leadframe device and separated from the other tips by a gap. A fastening material is arranged on at least some of the conductive strips and configured to fasten an integrated circuit chip to the conductive strips

Abstract translation: 集成电路引线框架装置支持各种芯片布置。 与各种实施例一致，引线框架包括多组导电集成电路芯片连接器。 每个组具有分别具有端部的多个导电条，该组中的每个条的端部彼此基本平行并且以与倾斜角度布置在至少一个其它条中的条的端部 。 每个端部具有延伸到引线框架装置的内部的尖端，并且与另一个尖端分开间隙。 紧固材料布置在至少一些导电条上并且被配置成将集成电路芯片紧固到导电条上