Abstract:
A lighting device is provided. The lighting device includes an optical reflection plate, a light holder, and at least one light source. The optical reflection plate includes a non-reflective region located in the center of the optical reflection plate, and a plurality of reflection regions surrounding the non-reflective region in sequence. The light holder is located on the non-reflective region of the optical reflection plate and includes a circle side-light concave portion. A light-emitting opening of the side-light concave portion faces to the reflection regions. The light source is located in the side-light concave portion of the light holder. When the light source emits light, the light emitted from the light source is reflected by the reflection regions.
Abstract:
An electro-optical apparatus including a display module and a touch panel is provided. The display module includes a body, at least a first positioning element, and at least a second positioning element. The body has a display surface and a bottom surface opposite to the display surface. The first positioning element and the second positioning element are connected to the body. The first positioning element is disposed on a first side of the body and the second positioning element is disposed on a second side of the body that is adjacent to the first side. The first positioning element and the second positioning element protrude from the display surface in a direction away from the bottom surface. The touch panel is disposed on the display surface of the body, and edges of the touch panel abut against the first positioning element and the second positioning element.
Abstract:
A light emitting diode (LED) cup light includes a base, a substrate, a LED light source and a fixing structure. The base includes a frame and a carrying member. The frame is surroundingly coupled to a periphery of the carrying member. The carrying member has a through hole. The substrate is disposed on the carrying member of the base. The LED light source is disposed on the substrate. The fixing structure presses on substrate and is engaged with a bottom surface of the carrying member of the base through the through hole.
Abstract:
A lighting device is provided. The lighting device includes an optical reflection plate, a light holder, and at least one light source. The optical reflection plate includes a non-reflective region located in the center of the optical reflection plate, and a plurality of reflection regions surrounding the non-reflective region in sequence. The light holder is located on the non-reflective region of the optical reflection plate and includes a circle side-light concave portion. A light-emitting opening of the side-light concave portion faces to the reflection regions. The light source is located in the side-light concave portion of the light holder. When the light source emits light, the light emitted from the light source is reflected by the reflection regions.
Abstract:
An electro-optical apparatus includes a display module and a touch panel. The display module includes a body, at least a first positioning element, and at least a second positioning element. The body has a display surface and a bottom surface opposite to the display surface. The first positioning element and the second positioning element are connected to the body. The first positioning element is disposed on a first side of the body and the second positioning element is disposed on a second side of the body that is adjacent to the first side. The first positioning element and the second positioning element protrude from the display surface in a direction away from the bottom surface. The touch panel is disposed on the display surface of the body, and edges of the touch panel abut against the first positioning element and the second positioning element.
Abstract:
The present invention relates to a passive multiple remote center compliance (MRCC) device that serves as a mechanical wrist for a robot arm. Such a multiple remote center compliance device comprises a translational structure and a gyrational structure serially interconnected between an operator member and a mounting member for enabling translational and rotational motion at, near or beyond the remote compliance center, that is, the functioning end of the operator member. The translational structure is securely connected to the mounting member (such as the end effector of a robot arm) and is provided with a translational block therein so as to furnish lateral compliance and orientational compliance. The gyrational structure is connected and operated by an operating member (such as the gripper of the robot arm) and moves relatively to the translational structure. The gyrational structure is provided with a gyrational block therein having a spherical configuration so as to furnish angular compliance and orientational compliance. In an alternative embodiment, adjustable resilient means is provided to overcome gravitation effecting the translational and the gyrational blocks, so as to proceed with insertion and mating maneuvers not advancing vertically downwards.
Abstract:
A light emitting diode (LED) cup light includes a base, a substrate, a LED light source and a fixing structure. The base includes a frame and a carrying member. The frame is surroundingly coupled to a periphery of the carrying member. The carrying member has a through hole. The substrate is disposed on the carrying member of the base. The LED light source is disposed on the substrate. The fixing structure presses on substrate and is engaged with a bottom surface of the carrying member of the base through the through hole.
Abstract:
The invention relates to a heat adjustment device. The heat adjustment device comprises a heat conductive substrate and a plurality of thermoelectric chips. The heat conductive substrate has a support surface. Each of the thermoelectric chips has a first surface and a second surface, wherein the second surfaces of the thermoelectric chips are fixed to the support surface of the heat conductive substrate, and the thermoelectric chips are electrically connected for providing a power to the thermoelectric chips so that the second surfaces of the thermoelectric chips give a temperature variation conducted to the heat conductive substrate. According to the heat adjustment device of the invention, after the temperature variation is conducted by the thermoelectric chips to the heat conductive substrate, a corresponding temperature variation is produced on the heat conductive substrate so that the area of the temperature variation is increased and the temperature is uniformly distributed on the heat conductive substrate. The heat adjustment device of the invention can be mounted in clothes. When the temperature of the second surfaces of the thermoelectric chips is increased and the heat is conducted to the heat conductive substrate, the clothes can produce heat to keep warm.
Abstract:
A method of communication between a protocol-processing unit and an input/output (I/O) device through a device interface controller includes configuring the protocol-processing unit to write command/message data in a predefined write file, and configuring the device interface controller to translate the command/message data written in the predefined write file into a corresponding command/message and to transmit the corresponding command/message thus translated to the I/O device. A system that includes the protocol-processing unit and the device interface controller is also disclosed.
Abstract:
A method for communication between an electronic device and a target input/output (I/O) device in a secure digital input/output (SDIO) card through a secure digital (SD) interface is provided. The SDIO card includes a SDIO controller. The method includes the steps of: configuring the electronic device to write an I/O command packet at a designated address accessible to both the electronic device and the SDIO controller, the I/O command packet including a command for controlling the operation of the target I/O device; and configuring the SDIO controller to control the operation of the target I/O device according to the I/O command packet written at the designated address.